207716 ⎘
Details of semiconductor or other solid state devices; Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered constructions; Leads, on insulating substrates, characterised by the materials the conductive materials containing semiconductor material
CONDUCTIVE MATERIALS WITH OPTICAL DEVICE STRUCTURES FOR HYBRID BONDING
#2Semiconductor Component Including One or More Conductors Comprising a Stack of Ferromagnetic and Nonmagnetic Materials
#3ELECTROLYTIC COBALT-IRON-PALLADIUM-GOLD AS A SURFACE FINISH FOR EMBEDDED DIE ATTACHMENTS
#4IMMERSION GOLD-ELECTROLESS PALLADIUM-IMMERSION GOLD (IGEPIG) AS A SURFACE FINISH FOR EMBEDDED DIE ATTACHMENTS
#5INTEGRATED CIRCUIT DEVICE
#6SEMICONDUCTOR DEVICE FOR RF INTEGRATED CIRCUIT
#7HEAVILY DOPED SEMICONDUCTOR DEVICES FOR POWER DISTRIBUTION
#8CHIP AND PREPARATION METHOD THEREOF, AND ELECTRONIC DEVICE
#9COMPACT DIRECT-BONDED METAL SUBSTRATE PACKAGE
#10GLASS-BASED INTEGRATED CIRCUIT PACKAGES FOR COMPOUND MICROELECTRONIC COMPONENTS OPERATING AT MILLIMETER WAVE (MMWAVE) FREQUENCIES
#11SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
#12SENSOR FOR MEASURING A GAS PROPERTY
#13CORROSION REDUCTION AT LIQUID METAL/METAL INTERFACES BY SELECTIVE INTRINSIC ALLOYING
#14SEMICONDUCTOR DEVICE AND EQUIPMENT
#15LEADFRAME WITH A METAL OXIDE COATING AND METHOD OF FORMING THE SAME
#16Multi-Device Power Module Arrangement
#17Semiconductor device for RF integrated circuit
#18SILICON INTERPOSER INCLUDING THROUGH-SILICON VIA STRUCTURES WITH ENHANCED OVERLAY TOLERANCE AND METHODS OF FORMING THE SAME
#19THIN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#20COMPONENT FOR A STRETCHABLE ELECTRONIC DEVICE
#21Electronic component with metallic cap
#22Semiconductor device with die mounted to an insulating substrate and corresponding method of manufacturing semiconductor devices
#23Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the same
#24Electronic package, supporting structure and fabrication method thereof
#25Landing pad apparatus for through-silicon-vias
#26Chip package structure using silicon interposer as interconnection bridge
#27Component carrier with stabilizing structure for interface adhesion
#28Leadframe with a metal oxide coating and method of forming the same
#29Semiconductor package with in-package compartmental shielding and active electro-magnetic compatibility shielding
#30Solid-state imaging device
#31Component carrier with integrated thermally conductive cooling structures
#32Semiconductor module, method for manufacturing the same and power conversion apparatus
#33Chip package assembly with enhanced interconnects and method for fabricating the same
#34Fingerprint sensing structure with small curvature radius
#35Wiring structure and method for producing wiring structure
#36Circuit structure
#37Metal silicate spacers for fully aligned vias
#38Metal silicate spacers for fully aligned vias
#39LEAD CARRIER WITH PRINT FORMED PACKAGE COMPONENTS AND CONDUCTIVE PATH REDISTRIBUTION STRUCTURES
#40Hybrid carbon-metal interconnect structures
#41Electronic device, assembly and methods of manufacturing an electronic device including a vertical trench capacitor and a vertical interconnect
#423-D package having plurality of substrates
#43Buried hard mask for embedded semiconductor device patterning
#44Electronic device
#45Method of fabricating semiconductor package having an interposer structure
#46Hybrid carbon-metal interconnect structures
#47Through substrate vias and device
#48Wafers, panels, semiconductor devices, and glass treatment methods
#493-D package having plurality of substrates
#50Through-silicon vias and interposers formed by metal-catalyzed wet etching
#51Thermal management structure with integrated heat sink
#52Flexible light emitting semiconductor device
#53SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, WIRING SUBSTRATE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF WIRING SUBSTRATE
#54Laminated wiring board
#55Semiconductor device
#56Flip-chip bonding structure using multi chip module-deposited substrate
#57Electronic device, assembly and methods of manufacturing an electronic device including a vertical trench capacitor and a vertical interconnect
#58Method for fabricating a silicon carbide interconnect for semiconductor components using heating
#59Semiconductor device for RF integrated circuit
#60Stress relieving through-silicon vias
#61Sidewall image transfer for heavy metal patterning in integrated circuits