207717 ⎘
Details of semiconductor or other solid state devices; Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered constructions; Leads, on insulating substrates, characterised by the materials Carbon, e.g. fullerenes
METHODS AND SYSTEMS FOR FORMING INTEGRATED CIRCUIT PACKAGES COMPRISING GLASS LAYERS
#2ARCHITECTURE AND METHOD OF MAKING A SYSTEM LEVEL SEMICONDUCTOR IC-SUBSTRATE, INTERCONNECT FABRIC AND INTEGRATED ELECTRONIC SYSTEMS
#3Semiconductor Device and Method of Making Redistribution Layers with Intensive Pulsed Light Irradiation
#4CARBON NANOFIBER CAPACITOR APPARATUS AND RELATED METHODS
#5POWER MODULE AND FABRICATION METHOD OF THE SAME, GRAPHITE PLATE, AND POWER SUPPLY EQUIPMENT
#6METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE
#7Semiconductor Device and Method of Making a Semiconductor Package with Graphene-Coated Interconnects
#8Semiconductor Device and Method of Forming RDL with Graphene-Coated Core
#9SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#10INTEGRATED CIRCUIT SUPPORTS WITH MICROSTRIPS
#11INSULATING CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING SAME
#12INTERPOSER AND PACKAGING DEVICE ARCHITETCURE AND METHOD OF MAKING FOR INTEGRATED CIRCUITS
#13Semiconductor structure and method for manufacturing the same
#14Power module and fabrication method of the same, graphite plate, and power supply equipment
#15FORMATION METHOD OF CHIP PACKAGE
#16DIELECTRIC CAPACITANCE RECOVERY OF INTER-LAYER DIELECTRIC LAYERS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION
#17Semiconductor device
#18Semiconductor assemblies including thermal circuits and methods of manufacturing the same
#19Graphite-laminated chip-on-film-type semiconductor package having improved heat dissipation and electromagnetic wave shielding functions
#20Semiconductor assemblies including thermal circuits and methods of manufacturing the same
#21Method of manufacturing semiconductor devices and corresponding semiconductor device
#22Semiconductor package carrier board, method for fabricating the same, and electronic package having the same
#23Graphite-laminated chip-on-film-type semiconductor package allowing improved visibility and workability
#24Component carrier with stabilizing structure for interface adhesion
#25Structure and formation method of chip package with shielding structure
#26Electrical device including a through-silicon via structure
#27Power module and fabrication method of the same, graphite plate, and power supply equipment
#28Silicon nitride substrate and silicon nitride circuit board using the same
#29SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
#30Component carrier with a bypass capacitance comprising dielectric film structure
#31MULTI-FUNCTIONALIZED CARBON NANOTUBES
#32Method of manufacturing a flexible substrate with carbon nanotube vias and corresponding flexible substrate
#33Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement
#34Ceramic circuit board
#35Guard structure for signal isolation
#36Functionalized boron nitride materials and methods for their preparation and use
#37Silicon nitride substrate and silicon nitride circuit board using the same
#38Integration of backside heat spreader for thermal management
#39Method for patterning a graphene layer and method for manufacturing a display substrate
#40Interconnect structure and manufacturing method thereof
#41Semiconductor device and manufacturing method of the same
#42Method for processing a carrier and an electronic component
#43Connecting and bonding adjacent layers with nanostructures
#44Substrate for electronic device and electronic device
#45Connecting and bonding adjacent layers with nanostructures
#46Electrochemical-codeposition methods for forming carbon nanotube reinforced metal composites
#47Carbon nanotube-reinforced solder caps, and chip packages and systems containing same
#48Carbon nanotube-based conductive connections for integrated circuit devices
#49Connecting and bonding adjacent layers with nanostructures
#50Microelectronic package interconnect and method of fabrication thereof
#51Microelectronic substrate including bumping sites with nanostructures
#52Sensor component with a cavity housing and a sensor chip and method for producing the same
#53Method of assembling carbon nanotube reinforced solder caps
#54Coatings Comprising Carbon Nanotubes
#55Semiconductor device with semiconductor chips mounted on mounting board via conductive anaotubes
#56Formation of high metallic content carbon nanotube structures
#57Carbon nanotube via interconnect
#58Semiconductor substrate with strip conductors formed of carbon nanotubes and production thereof
#59Carbon nanotube reinforced metallic layer
#60Method for disposing a conductor structure on a substrate, and substrate comprising said conductor structure
#61Carbon nanotube reinforced metal composites
#62Composite material, electrical circuit or electric module
#63Microelectronic package interconnect and method of fabrication thereof
#64Wiring connection structure and method for forming the same
#65Method for fabricating a silicon carbide interconnect for semiconductor components using heating
#66Solution processed pentacene-acceptor heterojunctions in diodes, photodiodes, and photovoltaic cells and method of making same
#67Nano-powder-based coating and ink compositions
#68Flexible rewiring plate for semiconductor components, and process for producing it
#69Expansion constrained die stack