Patents-Review.com
ClassID:

207719 ⎘

H01L23/49888 - CPC Classification

Classification description:

Details of semiconductor or other solid state devices; Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered constructions; Leads, on insulating substrates, characterised by the materials the conductive materials containing superconducting material

Recent Application in this class:
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METHOD OF MANUFACTURING DEVICE AND DEVICE

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DEVICE AND METHOD OF MANUFACTURING DEVICE

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QUANTUM COMPUTING APPARATUS WITH INTERPOSER AND METHODS OF FABRICATION AND OPERATION THEREOF, QUANTUM COMPUTING APPARATUS COMPRISING TANTALUM NITRIDE AND METHOD OF FABRICATION THEREOF

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20250015169
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ELECTRONIC DEVICE, QUANTUM COMPUTER, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

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2024-12-26

THROUGH-VIA SUBSTRATE, MOUNTING SUBSTRATE, AND METHOD FOR MANUFACTURING THROUGH-VIA SUBSTRATE

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20240234293
2024-07-11

QUANTUM DEVICE

 #7
20240136274
2024-04-25

QUANTUM DEVICE

 #8
20230197539
2023-06-22

Interposer chips and enclosures for quantum circuits

 #9
20220344240
2022-10-27

MULTILAYER SUPERCONDUCTING STRUCTURES FOR CRYOGENIC ELECTRONICS

 #10
20220285482
2022-09-08

TRENCH CAPACITOR DEVICE FOR SUPERCONDUCTING ELECTRONIC CIRCUIT AND SUPERCONDUCTING QUBIT DEVICE

 #11
20220199507
2022-06-23

MULTI-LAYERED PACKAGING FOR SUPERCONDUCTING QUANTUM CIRCUITS

 #12
20220093501
2022-03-24

Chip with bifunctional routing and associated method of manufacturing

 #13
20220093500
2022-03-24

Integrated structure with bifunctional routing and assembly comprising such a structure

 #14
20210407928
2021-12-30

Quantum device including shield part and method of manufacturing the same

 #15
20210399193
2021-12-23

Quantum device and method of manufacturing the same

 #16
20200243743
2020-07-30

Method of forming superconducting layers and traces

 #17
20200006621
2020-01-02

Superconducting bump bonds

 #18
20200006620
2020-01-02

Superconducting bump bonds

 #19
20190157184
2019-05-23

Integrated circuit having a heat sink coupled to separate ground planes through vias with different thermal characteristics

 #20
20190131509
2019-05-02

Bump bonded cryogenic chip carrier

 #21
20190131246
2019-05-02

Thermally isolated ground planes with a superconducting electrical coupler

 #22
20190103541
2019-04-04

Bump bonded cryogenic chip carrier

 #23
20190097118
2019-03-28

Method of forming superconducting apparatus including superconducting layers and traces

 #24
20190097117
2019-03-28

Low-noise microwave amplifier utilizing superconductor-insulator-superconductor junction

 #25
20190044047
2019-02-07

Package substrates with top superconductor layers for qubit devices

 #26
20180366634
2018-12-20

Superconducting bump bonds

 #27
20180168070
2018-06-14

Cooling technology for cryogenic link

 #28
20180102470
2018-04-12

Cryogenic electronic packages and assemblies

 #29
20180102469
2018-04-12

Cryogenic electronic packages and methods for fabricating cryogenic electronic packages

 #30
20180005887
2018-01-04

THROUGH-SILICON VIA WITH INJECTION MOLDED FILL