H01L23/5328 - CPC Classification Index

ClassID:

207748 ⎘

H01L23/5328 - CPC Classification

Classification description:

Details of semiconductor or other solid state devices; Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials; Conductive materials containing conductive organic materials or pastes, e.g. conductive adhesives, inks

Recent Application in this class:

20260060065

2026-02-26

SEMICONDUCTOR DEVICE INCLUDING INTERCONNECT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

20260026338

2026-01-22

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

20240363538

2024-10-31

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

20240274546

2024-08-15

ELECTRONIC DEVICE AND VARIABLE FREQUENCY CONTROL SYSTEM USING ELECTRONIC DEVICE

20230298962

2023-09-21

POWER MODULE

20230197601

2023-06-22

FILL OF VIAS IN SINGLE AND DUAL DAMASCENE STRUCTURES USING SELF-ASSEMBLED MONOLAYER

20230077018

2023-03-09

CONDUCTIVE AND FLEXIBLE SANDWICH-STRUCTURED COMPOSITES

20230037554

2023-02-09

Semiconductor structure with two-dimensional conductive structures

20200185323

2020-06-11

Packaged semiconductor system having unidirectional connections to discrete components

#10

20200091083

2020-03-19

Semiconductor device and method for manufacturing the same

#11

20190388928

2019-12-26

Gas cushion apparatus and techniques for substrate coating

#12

20190139883

2019-05-09

Packaged semiconductor system having unidirectional connections to discrete components

#13

20190131236

2019-05-02

Semiconductor device with barrier layer

#14

20190131228

2019-05-02

Semiconductor devices and semiconductor packages including the same, and methods of manufacturing the semiconductor devices

#15

20180308702

2018-10-25

Semiconductor device and method for manufacturing the same

#16

20180269141

2018-09-20

Chip-size, double side connection package and method for manufacturing the same

#17

20180251652

2018-09-06

Reactively assisted ink for printed electronic circuits

#18

20180206368

2018-07-19

CONDUCTIVE PATTERN, ELECTRIC CIRCUIT, ELECTROMAGNETIC WAVE SHIELD, AND METHOD FOR PRODUCING CONDUCTIVE PATTERN

#19

20180163071

2018-06-14

Reactively assisted ink for printed electronic circuits

#20

20180122719

2018-05-03

Apparatus for manufacturing a thermoelectric module

#21

20180090037

2018-03-29

LED display

#22

20180053719

2018-02-22

Semiconductor package with core substrate having a through hole

#23

20170345753

2017-11-30

Integrated circuit having slot via and method of forming the same

#24

20170189935

2017-07-06

Gas cushion apparatus and techniques for substrate coating

#25

20170169914

2017-06-15

Stretchable conductor, method for manufacturing same, and paste for forming stretchable conductor

#26

20170162491

2017-06-08

Chip-size, double side connection package and method for manufacturing the same

#27

20170141036

2017-05-18

Pattern placement error compensation layer in via opening

#28

20170141035

2017-05-18

Pattern placement error compensation layer

#29

20170140848

2017-05-18

Cotton fiber dissolution and regeneration and 3D printing of cellulose based conductive composites

#30

20170092691

2017-03-30

Flexible LED display

#31

20170062374

2017-03-02

Anisotropic conductive material, electronic device including anisotropic conductive material, and method of manufacturing electronic device

#32

20170040260

2017-02-09

Integrated circuit having slot via and method of forming the same

#33

20170033068

2017-02-02

Formation of solder and copper interconnect structures and associated techniques and configurations

#34

20160351449

2016-12-01

Non-lithographically patterned directed self assembly alignment promotion layers

#35

20160343670

2016-11-24

Flexible device having flexible interconnect layer using two-dimensional materials

#36

20160298030

2016-10-13

METALLIC AND SEMICONDUCTOR NANOTUBES, NANOCOMPOSITE OF SAME, PURIFICATION OF SAME, AND USE OF SAME

#37

20160268205

2016-09-15

Polymer member based interconnect

#38

20160198594

2016-07-07

CONDUCTIVE PATTERN, ELECTRIC CIRCUIT, ELECTROMAGNETIC WAVE SHIELD, AND METHOD FOR PRODUCING CONDUCTIVE PATTERN

#39

20160181202

2016-06-23

Microelectronic devices with multi-layer package surface conductors and methods of their fabrication

#40

20160133608

2016-05-12

Devices and stacked microelectronic packages with package surface conductors and methods of their fabrication

#41

20160133541

2016-05-12

Heat spreader with wiring substrate for reduced thickness

#42

20160086890

2016-03-24

Wiring and method for manufacturing the same

#43

20160079169

2016-03-17

Polymer member based interconnect

#44

20160056072

2016-02-25

Multilayered contact structure having nickel, copper, and nickel-iron layers

#45

20160020192

2016-01-21

Non-circular die package interconnect

#46

20150314325

2015-11-05

Gas cushion apparatus and techniques for substrate coating

#47

20150287680

2015-10-08

Semiconductor devices having through electrodes capped with self-aligned protection layers

#48

20150262931

2015-09-17

Microelectronic packages having mold-embedded traces and methods for the production thereof

#49

20150228581

2015-08-13

Integrated circuit package fabrication

#50

20150209914

2015-07-30

Anisotropic conductive adhesive

#51

20150200164

2015-07-16

Semiconductor devices and methods of manufacture thereof

#52

20150076711

2015-03-19

Conductive ink for filling vias

#53

20150054158

2015-02-26

Functional material

#54

20150054019

2015-02-26

Semiconductor device having electrode interconnections within a conductive adhesive

#55

20150028334

2015-01-29

Electroconductive thin film, coating liquid for forming electroconductive thin film, field-effect transistor, and method for producing field-effect transistor

#56

20140225260

2014-08-14

Solution process for improved nanowire electrodes and devices that use the electrodes

#57

20140191395

2014-07-10

Forming interconnect structures using pre-ink-printed sheets

#58

20140124939

2014-05-08

Discrete device mounted on substrate

#59

20140120717

2014-05-01

Method of Semiconductor Integrated Circuit Fabrication

#60

20140057428

2014-02-27

Buffer layer for sintering

#61

20140054802

2014-02-27

Semiconductor device and method of forming RDL using UV-cured conductive ink over wafer level package

#62

20130154093

2013-06-20

Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device bonded by the same

#63

20130146334

2013-06-13

Print compatible designs and layout schemes for printed electronics

#64

20120168790

2012-07-05

DISPLAY DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF

#65

20120064291

2012-03-15

ELECTRICALLY CONDUCTIVE PASTE COMPOSITION AND ELECTRICALLY CONDUCTIVE FILM FORMED BY USING THE SAME

#66

20110277655

2011-11-17

Forming interconnect structures using pre-ink-printed sheets

#67

20110186333

2011-08-04

Printed compatible designs and layout schemes for printed electronics

#68

20110062590

2011-03-17

Chip Stacking Device Having Re-Distribution Layer

#69

20110057325

2011-03-10

Method for manufacturing a chip-size double side connection package

#70

20100283122

2010-11-11

Systems and methods for providing high-density capacitors

#71

20100248474

2010-09-30

METHOD OF FORMING COATING-TYPE FILM

#72

20090321953

2009-12-31

Circuit substrate having circuit wire formed of conductive polarization particles, method of manufacturing the circuit substrate and semiconductor package having the circuit wire

#73