SEMICONDUCTOR DEVICE

TFT-LCD array substrate having a connecting device for testing twice and test method for the same

Leakage measurement of through silicon vias

Low resistivity gate conductor

Method of producing semiconductor wafer, semiconductor wafer, method of producing semiconductor device and semiconductor device

Device with integrated power supply

Double seal ring

Electronic device manufacturing method and chip assembly

Current sense transistor with embedding of sense transistor cells

Semiconductor integrated circuit and method for measuring internal voltage thereof

Semiconductor device

Miniaturized implantable sensor platform having multiple devices and sub-chips

Adjusting configuration of a multiple gate transistor by controlling individual fins

Microelectronic wireless transmission device

Contactless wafer probing with improved power supply

CHIP STRUCTURE AND WAFER STRUCTURE

Integrated electronic components and methods of formation thereof

METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF

Method for manufacturing fine-pitch bumps and structure thereof

Method of manufacturing a semiconductor component

Semiconductor component that includes a protective structure

Method and system for binding halide-based contaminants

Gate conductor with a diffusion barrier

Methods of manufacture and use of energized ophthalmic devices having an electrical storage mode

Methods and apparatus to form electronic circuitry on ophthalmic devices

STRUCTURE AND MANUFACTURING METHOD FOR REDUCING STRESS OF CHIP

Measuring current and resistance using combined diodes/resistor structure to monitor integrated circuit manufacturing process variations

Secondary memory units and systems including the same

Test structures, methods of manufacturing thereof, test methods, and MRAM arrays

Semiconductor switching device

Monitoring testkey used in semiconductor fabrication

Integrated mechanical device for electrical switching

Interconnect having ultra high speed signal transmission/reception

Semiconductor device with wireless communication

Test carrier

Leakage measurement structure having through silicon vias

Substrate and patterning device for use in metrology, metrology method and device manufacturing method

Apparatus and methods for dicing interposer assembly

Sacrificial wafer probe pads through seal ring for electrical connection to circuit inside an integrated circuit

Semiconductor device having groove-shaped via-hole

Semiconductor device having groove-shaped via-hole

Method and system for binding halide-based contaminants

Encapsulated integrated-circuit device with thin-film battery

Semiconductor device, semiconductor device design method, semiconductor design apparatus, and program

Semiconductor device having groove-shaped via-hole

Semiconductor device having groove-shaped via-hole

Semiconductor device having groove-shaped via-hole

Stacked via structure for metal fuse applications

Multiple energization elements in stacked integrated component devices

Vertically integrated systems

Sensor for semiconductor degradation monitoring and modeling

Semiconductor device with wireless communication

Semiconductor device and method of manufacturing semiconductor device

Wafer-scale package including power source

Semiconductor device

Method for constructing an electrical circuit, and electrical circuit

Battery-operated wireless-communication apparatus and method

Integrated battery and IC

Stacked-die package for battery power management

Package substrates and semiconductor packages having the same

Semiconductor device with buried bit line

Silicon wafer for semiconductor with powersupply system on the backside of wafer

Gate conductor with a diffusion barrier

Method for assembling at least one chip with a wire element, electronic chip with a deformable link element, fabrication method of a plurality of chips, and assembly of at least one chip with a wire element

Method and system for binding halide-based contaminants

Semiconductor device having groove-shaped pattern

Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package

Method and apparatus for integrated-circuit battery devices

Method for manufacturing a semiconductor component

Ultra high speed signal transmission/reception interconnect

Semiconductor device having groove-shaped via-hole

INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF

SHALLOW TRENCH ISOLATION STRUCTURE INCLUDING SECOND LINER COVERING CORNER OF TRENCH AND FIRST LINER

Process of fabricating chip

ELECTRICAL DEVICE HAVING A POWER SOURCE WITH A MAGNETIC CAPACITOR AS AN ENERGY STORAGE DEVICE

Integrated Circuit Package for Magnetic Capacitor

Data storage device having self-powered semiconductor device

Adjusting configuration of a multiple gate transistor by controlling individual fins

3-D circuits with integrated passive devices

Semiconductor integrated circuit including a power supply, semiconductor system including a semiconductor integrated circuit, and method of forming a semiconductor integrated circuit

HYBRID ELECTRONIC DEVICE INCLUDING SEMICONDUCTOR CHIP AND FUEL CELL, METHOD OF FABRICATING THE SAME AND SYSTEM HAVING THE SAME

Bare microelectronic chip provided with a recess forming a housing for a wire element constituting a flexible mechanical support, fabrication process and microstructure

METHOD OF FABRICATING A SHALLOW TRENCH ISOLATION STRUCTURE INCLUDING FORMING A SECOND LINER COVERING THE CORNER OF THE TRENCH AND FIRST LINER.

Integrated circuit including isolation regions substantially through substrate

Stacked-die package for battery power management

SEMICONDUCTOR CHIP PACKAGE HAVING METAL BUMP AND METHOD OF FABRICATING SAME

Mask design elements to aid circuit editing and mask redesign

ANTI-FUSE STRUCTURE INCLUDING A SENSE PAD CONTACT REGION AND METHODS FOR FABRICATION AND PROGRAMMING THEREOF

Battery-operated wireless-communication apparatus and method

TEST IC STRUCTURE

Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package

Integrated electronic components and methods of formation thereof

Silicon wafer for semiconductor with powersupply system on the backside of wafer

Gate conductor structure

Integrated battery pack with lead frame connection

Method for fabricating semiconductor package free of substrate

Design Structures Incorporating Semiconductor Device Structures with Self-Aligned Doped Regions

Device With Mounted Electronic Parts, Method Of Producing The Same, Protection Circuit Module Of Secondary Battery, And Battery Package

Semiconductor device having groove-shaped via-hole

THIN FILM BATTERY ON AN INTEGRATED CIRCUIT OR CIRCUIT BOARD AND METHOD THEREOF

Method and apparatus for thin-film battery having ultra-thin electrolyte

SEMICONDUCTOR DEVICE WITH BATTERY

Reduction of Electromagnetic Interference in Integrated Circuit Device Packages

Combined power source and printed transistor circuit apparatus and method

Method and apparatus for integrated-circuit battery devices

Semiconductor device and method for manufacturing the same

Semiconductor integrated circuit including a power supply, and semiconductor system including a semiconductor integrated circuit

Semiconductor wafer assemblies

Apparatus for spin coating semiconductor substrates

Battery mounted integrated circuit device having diffusion layers that prevent cations serving to charge and discharge battery from diffusing into the integrated circuit region

Method and system for binding halide-based contaminants

Thin-film battery having ultra-thin electrolyte

Wireless chip and manufacturing method of the same

Methods for making device enclosures and devices with an integrated battery

Thin-film battery devices and apparatus for making the same

IC package with an integrated power source

Wafer edge ring structures and methods of formation

Semiconductor device for preventing defective filling of interconnection and cracking of insulating film

Semiconductor package free of substrate and fabrication method thereof

Semiconductor device and method for manufacturing the same

Integrated battery pack with lead frame connection

Functionally improved battery and method of making same

Integrated circuit package with laminated power cell having coplanar electrode

Integrated capacitor-like battery and associated method

Micro- or nano-electronic component comprising a power source and means for protecting the power source

Earth energy systems and devices

Systems and methods for integrating batteries with stacked integrated circuit die elements

Thin film capacitor and multilayer circuit board having the thin film capacitor embedded therein

Memory device with bitline noise suppressing scheme

Soluble sensor node and method of manufacture

Aging tolerant apparatus

Laminated spacers for field-effect transistors

Prevention of switching of spins in magnetic tunnel junctions by on-chip parasitic magnetic shield

Multi-chip package system and methods of forming the same

Semiconductor device with authentication code

Semiconductor device with metal dam and fabricating method