207785 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas ; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
HIGH VOLTAGE TRANSISTOR WITH A FIELD PLATE
#2702Solid-state imaging device and electronic apparatus
#2703ON-CHIP INTEGRATION OF INDIUM TIN OXIDE (ITO) LAYERS FOR OHMIC CONTACT TO BOND PADS
#2704SEMICONDUCTOR PACKAGE INCLUDING PROCESSOR CHIP AND MEMORY CHIP
#2705Backside contact to improve thermal dissipation away from semiconductor devices
#2706Display device including connection pad part and electronic component connected to connection pad part
#2707Layouts for pads and conductive lines of memory devices, and related devices, systems, and methods
#2708Hybrid bonding structure and method of fabricating the same
#2709Display device
#2710Memory packages and methods of forming same
#2711Semiconductor package
#2712Semiconductor device and method of manufacturing the same
#2713Semiconductor devices and semiconductor packages including the same
#2714Structure with conductive feature and method of forming same
#2715Printed package and method of making the same
#2716Semiconductor device and manufacturing method of semiconductor device including a through electrode for connection of wirings
#27173D Integrated Circuit and Methods of Forming the Same
#2718Semiconductor device
#2719Display device and manufacturing method thereof
#2720Semiconductor package
#2721Semiconductor package and method of fabricating the same
#2722Semiconductor package including alignment material and method for manufacturing semiconductor package
#2723Semiconductor device and semiconductor module
#2724Fuses to measure electrostatic discharge during die to substrate or package assembly
#2725Semiconductor package and method of manufacturing the semiconductor package
#2726Semiconductor device and semiconductor package
#2727SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND POWER CONVERSION DEVICE
#2728Nonvolatile memory device with capability of determining degradation of data erase characteristics
#2729Display panel and display device including crack detection line electrically connecting first and second pins
#2730Method for manufacturing semiconductor die with decoupling capacitor
#2731Semiconductor devices
#2732Power module package
#2733Buffer layer(s) on a stacked structure having a via
#2734Through-silicon transmission lines and other structures enabled by same
#2735Semiconductor package including stacked semiconductor chips
#2736Semiconductor package including stacked semiconductor chips
#2737Semiconductor device and method of manufacturing the same
#2738Power semiconductor apparatus and fabrication method for the same
#2739Microelectronic components including metal pillars secured to bond pads, and related methods, assemblies, and systems
#2740High-speed die connections using a conductive insert
#2741Light source unit and display device including the same
#2742SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#2743Semiconductor device with thermal release layer and method for fabricating the same
#2744Methods for registration of circuit dies and electrical interconnects
#2745SiC semiconductor device
#2746Die stack structure, semiconductor structure and method of fabricating the same
#2747Die-to-wafer bonding structure and semiconductor package using the same
#2748Semiconductor device including uneven contact in passivation layer
#2749Semiconductor device
#2750Molded semiconductor package with high voltage isolation
#2751Semiconductor device with metal film on surface between passivation film and copper film
#2752Electronic device package and method for manufacturing the same
#2753Semiconductor device package including promoters and method of manufacturing the same
#2754TFT array substrate and display panel including the same
#2755Hybrid bonding with uniform pattern density
#2756Bonding structure and method of forming same
#2757Electronic package and fabrication method thereof
#2758BONDING ALIGNMENT MARKS AT BONDING INTERFACE
#2759Semiconductor package including high thermal conductivity layer
#2760Nonvolatile memory device and method of programming in the same
#2761Semiconductor assemblies with hybrid fanouts and associated methods and systems
#2762Protective surface layer on under bump metallurgy for solder joining
#2763Semiconductor device with buried metal pad, and methods for manufacture
#2764Semiconductor device with thermal release layer and method for fabricating the same
#2765Semiconductor structure having an anti-arcing pattern disposed on a passivation layer and a post passivation layer disposed on the anti-arcing pattern
#2766Multi-segment monolithic LED chip
#2767Thin-film resistor (TFR) with displacement-plated TFR heads
#2768Semiconductor device
#27693D INTEGRATED CIRCUIT (3DIC) STRUCTURE
#2770Memory device
#2771Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops
#2772Semiconductor device, power converter, and method of manufacturing semiconductor device
#2773Chip structure and manufacturing method thereof
#2774Semiconductor memory device structure
#2775Electronic circuit for a hybrid molecular bonding
#2776Bond pad with enhanced reliability
#2777Semiconductor structures with via openings and methods of making the same
#2778Solder ball application for singular die
#2779Backside power distribution network semiconductor package and method of manufacturing the same
#2780Devices and methods of vertical integrations of semiconductor chips, magnetic chips, and lead frames
#2781Integrated fan-out package and manufacturing method thereof
#2782Non-volatile memory device and method of operating the same
#2783Al bonding wire
#2784Semiconductor device and method of manufacturing the same
#2785Methods of forming microelectronic devices, and related microelectronic devices and electronic systems
#2786Interconnect structure with redundant electrical connectors and associated systems and methods
#2787Bonded assembly formed by hybrid wafer bonding using selectively deposited metal liners
#2788SEMICONDUCTOR DEVICE
#2789Semiconductor device structure with bottle-shaped through silicon via and method for forming the same
#2790Semiconductor package and manufacturing method thereof
#2791Electronic element mounting substrate and electronic device
#2792Method of manufacturing semiconductor element, and semiconductor element body
#2793Wrap-around source/drain method of making contacts for backside metals
#2794Wrap-around source/drain method of making contacts for backside metals
#2795Semiconductor device structure with magnetic element
#2796Display panel and display device
#2797Image sensor
#2798Display device and method of fabricating the same
#2799Memory device having wafer-to-wafer bonding structure
#2800DIRECT BONDING METHODS AND STRUCTURES
#2801Method of manufacturing semiconductor device and semiconductor device
#2802Chip structure, packaging structure and manufacturing method for chip structure
#2803Semiconductor device and manufacturing method of semiconductor device
#2804Transistor packages with improved die attach
#2805Package structure and method of manufacturing the same
#2806Wafer-level bonding of obstructive elements
#2807Semiconductor module, power semiconductor module, and power electronic equipment using the semiconductor module or the power semiconductor module
#2808Semiconductor structure and method for forming the same
#2809Stacked semiconductor device
#2810Circuit structure
#2811Fabrication and use of through silicon vias on double sided interconnect device
#2812Semiconductor package
#2813Semiconductor device and manufacturing method of semiconductor device
#2814Multi-chip integrated fan-out package
#2815Method and structures for low temperature device bonding
#2816Apparatus including a terminal pad associated with a conductive trace and having an irregular surface topography
#2817Semiconductor device with spacer over bonding pad
#2818High-frequency device
#2819Substrate processing and packaging
#2820Semiconductor device and method of manufacture
#2821INTERCONNECT STRUCTURES AND METHODS FOR FORMING SAME
#2822Semiconductor packages
#2823Package structure and manufacturing method thereof
#2824Methods and systems for improving power delivery and signaling in stacked semiconductor devices
#2825Semiconductor device and method of forming the same
#2826Semiconductor device and method of forming the same
#2827Semiconductor device
#2828Semiconductor device interconnection systems and methods
#2829Semiconductor structure and manufacturing method thereof
#2830Semiconductor device including coupled bond pads having differing numbers of pad legs
#2831Semiconductor device having a metallization structure
#2832Substrate structure, semiconductor package structure and method for manufacturing a substrate structure
#2833Semiconductor device and manufacturing method thereof
#2834Chip package structure
#2835Semiconductor chip
#2836Semiconductor device and method of manufacture
#2837DRY ETCH BACK SUBSTRATE INTERCONNECTIONS
#2838Optical module
#2839Semiconductor package with intermetallic-compound solder-joint comprising solder, UBM, and reducing layer materials
#2840Memory device
#2841Method for manufacturing semiconductor structure
#2842Combination-bonded die pair packaging and associated systems and methods
#2843Singulation of microelectronic components with direct bonding interfaces
#2844METHOD OF FORMING SEMICONDUCTOR STRUCTURE
#2845Method for fabricating semiconductor device with stress relief structure
#2846Method of manufacturing semiconductor device
#2847Device for controlling trapped ions and method of manufacturing the same
#2848Semiconductor device and method for manufacturing semiconductor device
#2849PACKAGE WITH PAD HAVING OPEN NOTCH
#2850Bump pad structure
#2851Semiconductor package having a chip carrier with a pad offset feature
#2852Fan-out semiconductor package including under-bump metallurgy
#2853Advanced device assembly structures and methods
#2854Display device and method of manufacturing the display device
#2855Bonded unified semiconductor chips and fabrication and operation methods thereof
#2856Semiconductor die with decoupling capacitor and manufacturing method thereof
#2857Semiconductor package including a first semiconductor chip with a plurality of first chip pads directly bonded to a plurality of second chip pads of an upper semiconductor chip
#2858Backside contact for thermal displacement in a multi-wafer stacked integrated circuit
#2859Semiconductor packages
#2860BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHODS OF FORMING THE SAME
#2861ELECTRONIC DEVICE
#2862Microelectronic assemblies with inductors in direct bonding regions
#2863Microelectronic assemblies with inductors in direct bonding regions
#2864Method for fabricating semiconductor device with slanted conductive layers
#2865Semiconductor device including bond pad with fixing parts fixed onto insulating film
#2866Semiconductor package
#2867Semiconductor device with electrode pad having different bonding surface heights
#2868Method for fabricating semiconductor device with graphene layers
#2869Integrated circuit chip, integrated circuit package and display apparatus including the integrated circuit chip
#2870Interconnection structure of a semiconductor chip and semiconductor package including the interconnection structure
#2871Integrated structure with bifunctional routing and assembly comprising such a structure
#2872Semiconductor device with tilted insulating layers and method for fabricating the same
#2873Micro LED display and manufacturing method therefor
#2874Semiconductor device
#2875Straight wirebonding of silicon dies
#2876Electronic device package and method for manufacturing the same
#2877Semiconductor device assembly with embossed solder mask having non-planar features and associated methods and systems
#2878Semiconductor chip including through electrode, and semiconductor package including the same
#2879Semiconductor device with slanted conductive layers and method for fabricating the same
#2880BONDING PAD STRUCTURE, SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING SAME
#2881Method for fabricating semiconductor device with EMI protection structure
#2882Bonding structure and method for manufacturing the same
#2883Semiconductor package and manufacturing method of semiconductor package
#2884Semiconductor device
#2885Semiconductor device
#2886Display panel, manufacturing method thereof, and display device
#2887Three-dimensional semiconductor memory device and electronic system including the same
#2888Hybrid bonding structure and hybrid bonding method
#2889Semiconductor device having a plurality of first structural bodies provided below a connection terminal and manufacturing method thereof
#2890Bonded structure with interconnect structure
#2891Side wettable package
#2892Electronic package and implantable medical device including same
#2893Semiconductor package
#2894Semiconductor package
#2895Semiconductor package
#2896Sensor package and manufacturing method thereof
#2897Semiconductor package and manufacturing method thereof
#2898Wafer-level passive array packaging
#2899Pad-out structure for semiconductor device and method of forming the same
#2900Semiconductor packages having improved reliability in bonds between connection conductors and pads and methods of manufacturing the same
#2901Semiconductor device package and method of manufacture
#2902Semiconductor device with metal plugs and method for manufacturing the same
#2903Semiconductor device structure with conductive polymer liner and method for forming the same
#2904Method of fabricating a semiconductor device
#2905Chip with chip pad and associated solder flux outgassing trench
#2906Semiconductor memory device
#2907SURFACE FINISH STRUCTURE OF MULTI-LAYER SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
#2908Semiconductor device with graphene layers and method for fabricating the same
#2909Substrate structure having roughned upper surface of conductive layer
#2910Electrostatic protection device and electrostatic protection circuit
#2911Semiconductor package including a chip pad having a connection portion and test portion in a first surface of the chip pad
#2912Semiconductor device assembly with graded modulus underfill and associated methods and systems
#2913Memory device
#2914Memory device with improved program performance and method of operating the same
#2915Semiconductor apparatus and device
#2916Methods of forming microelectronic devices and memory devices
#2917Solder joints on nickel surface finishes without gold plating
#2918DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
#2919Method for fabricating semiconductor device
#2920Semiconductor device including bonding pad metal layer structure
#2921Method for manufacturing semiconductor package with air gap
#2922Method of manufacturing semiconductor device having hybrid bonding interface
#2923Nonvolatile memory device including erase transistors
#2924Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same
#2925Compliant Electronic Component Interconnection
#2926Microelectronic devices, electronic systems having a memory array region and a control logic region, and methods of forming microelectronic devices
#2927Semiconductor Device, Method Making It And Packaging Structure
#2928Semiconductor package with under-bump metal structure
#2929Wire bond pad design for compact stacked-die package
#2930Integrated circuit bond pad with multi-material toothed structure
#2931Bonding structures of semiconductor devices
#2932Methods of forming microvias with reduced diameter
#2933Semiconductor package having a sidewall connection
#2934SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
#2935Reinforcing resin composition, electronic component, method for manufacturing electronic component, mounting structure, and method for manufacturing mounting structure
#2936SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS OF THE SAME
#2937Driving chip and display panel
#2938Semiconductor package including stacked semiconductor chips
#2939Vias in composite IC chip structures
#2940Leadframes in semiconductor devices
#2941Semiconductor package for improving bonding reliability
#2942Semiconductor device
#2943Method of manufacturing a molded flip chip package to facilitate electrical testing
#2944Electrical component with a dielectric passivation stack
#2945Multichip package manufacturing process
#2946Semiconductor package including stacked semiconductor chips
#2947INTERLAYER CONNECTION OF STACKED MICROELECTRONIC COMPONENTS
#2948Contact and die attach metallization for silicon carbide based devices and related methods of sputtering eutectic alloys
#2949Semiconductor wafer and method of ball drop on thin wafer with edge support ring
#2950Semiconductor structure and method for forming semiconductor structure
#2951Electronic substrate and electronic device
#2952Memory devices with backside bond pads under a memory array
#2953Semiconductor device and electronic device
#2954Semiconductor device with stress-relieving structures and method for fabricating the same
#2955Semiconductor device
#2956Integrated circuit test method and structure thereof
#2957Image sensor
#2958Wafer-bonding structure and method of forming thereof
#2959Semiconductor package
#2960Semiconductor device including uneven contact in passivation layer and method of manufacturing the same
#2961Interlocked redistribution layer interface for flip-chip integrated circuits
#2962Semiconductor device including a package substrate and a semiconductor chip
#2963Nonvolatile memory device, storage device, and operating method of nonvolatile memory device
#2964Semiconductor device including a circuit for transmitting a signal
#2965Chip, circuit board and electronic device comprising polygonal pads
#2966Passivation structure with increased thickness for metal pads
#2967SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#2968Package and method of fabricating the same
#2969Method for forming conductive layer, and conductive structure and forming method therefor
#2970Iterative formation of damascene interconnects
#2971Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, wire bonding structure using the same, semiconductor device and manufacturing method thereof
#2972Solid-state imaging device and electronic apparatus
#2973MICRODEVICE CARTRIDGE STRUCTURE
#2974Semiconductor structure containing pre-polymerized protective layer and method of making thereof
#2975Semiconductor structure containing pre-polymerized protective layer and method of making thereof
#2976SEMICONDUCTOR DIE WITH CONVERSION COATING
#2977Low profile integrated circuit
#2978System and method for superconducting multi-chip module
#2979Fabricating method of semiconductor device with exposed input/output pad in recess
#2980Semiconductor package
#2981Semiconductor package structure and method of manufacturing the same
#2982Semiconductor package
#2983Semiconductor device and manufacturing method for semiconductor device
#2984Flip-chip flexible under bump metallization size
#2985SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#2986Semiconductor device having a resin that seals a rewiring
#2987Semiconductor structure and forming method therefor
#2988Integrated circuit device and semiconductor package including the same
#2989Display device with alternating fan-out lines
#2990Three-dimensional (3D) integrated circuit with passive elements formed by hybrid bonding
#2991Display device and method for manufacturing the same
#2992Bonded body, circuit board, and semiconductor device
#2993Semiconductor device and method for manufacturing semiconductor device
#2994Semiconductor package having enlarged gate pad and method of making the same
#2995Microelectronic devices and electronic systems
#2996Topside-cooled semiconductor package with molded standoff
#2997Chip packaging method and package structure
#2998Semiconductor device including sense insulated-gate bipolar transistor
#2999Semiconductor device, method of manufacturing semiconductor device, and imaging element
#3000Backside contact to improve thermal dissipation away from semiconductor devices