207785 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas ; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
#1802SEMICONDUCTOR DEVICE
#1803SEMICONDUCTOR DEVICE
#1804METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE
#1805MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE THEREOF
#1806Redistribution lines with protection layers and method forming same
#1807Semiconductor Device and Method of Forming SIP Module Absent Substrate
#1808NARROW BORDER REFLECTIVE DISPLAY DEVICE
#1809Semiconductor memory
#1810Integrated circuit with coil below and overlapping a pad
#1811SEMICONDUCTOR STRUCTURE HAVING PHOTONIC DIE AND ELECTRONIC DIE
#1812Copper-bonded memory stacks with copper-bonded interconnection memory systems
#1813DIE SURFACE TREATMENT APPARATUS AND DIE BONDING SYSTEM INCLUDING THE SAME
#1814Semiconductor packages and methods of forming the same
#1815SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#1816EXPANSION CONTROLLED STRUCTURE FOR DIRECT BONDING AND METHOD OF FORMING SAME
#1817WAFER BONDING STRUCTURE, WAFER BONDING METHOD AND CHIP BONDING STRUCTURE
#1818ELECTRONIC COMPONENT
#1819SEMICONDUCTOR STRUCTURE HAVING THROUGH SUBSTRATE VIA AND MANUFACTURING METHOD THEREOF
#1820Semiconductor Packages and Methods of Forming RDL and Side and Back Protection for Semiconductor Device
#1821SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
#1822ELECTROHYDRODYNAMIC EJECTION PRINTING AND ELECTROPLATING FOR PHOTORESIST-FREE FORMATION OF METAL FEATURES
#1823SEMICONDUCTOR DEVICE
#1824Device structure with a redistribution layer and a buffer layer
#1825Semiconductor packages and methods of forming the same
#1826Semiconductor device and method of manufacturing thereof
#1827RADIO FREQUENCY (RF) SWITCH WITH DRAIN/SOURCE CONTACTS
#1828SEMICONDUCTOR DEVICE
#1829SEMICONDUCTOR PACKAGES
#1830Info structure with copper pillar having reversed profile
#1831DISPLAY DEVICE AND METHOD OF MANUFACTURING THE DISPLAY DEVICE
#1832DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME
#1833DELAMINATION/CRACKING IMPROVEMENT AT SOLDER JOINTS IN MICROELECTRONICS PACKAGE
#1834CHIP-ON-FILM PACKAGE
#1835FLIP CHIP BONDING METHOD AND CHIP USED THEREIN
#1836SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#1837Clamped semiconductor wafers and semiconductor devices
#1838Semiconductor structure comprising various via structures
#1839Semiconductor storage device
#1840DISPLAY PANEL AND DISPLAY DEVICE
#1841INTEGRATED DIAMOND SUBSTRATE FOR THERMAL MANAGEMENT
#1842BOND HEAD DESIGN FOR THERMAL COMPRESSION BONDING
#1843SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#1844HYBRID BONDING A DIE TO A SUBSTRATE WITH VIAS CONNECTING METAL PADS ON BOTH SIDES OF THE DIE
#1845FINE-PITCH JOINING PAD STRUCTURE
#1846Semiconductor device having a metal pad and a protective layer for corrosion prevention due to exposure to halogen
#1847CONNECTION STRUCTURAL BODY AND SEMICONDUCTOR DEVICE
#1848SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
#1849Semiconductor Devices and Methods of Manufacture
#1850PROTECTIVE ELEMENTS FOR BONDED STRUCTURES
#1851GLASS SUBSTRATE PACKAGE WITH HYBRID BONDED DIE
#1852Bonded structures with integrated passive component
#1853SEMICONDUCTOR PACKAGE
#1854Package structure, optical structure and method for manufacturing the same
#1855SEMICONDUCTOR DEVICE COMPRISING CONTACT PAD STRUCTURE
#1856ELECTRONIC PACKAGE AND SUCTION DEVICE
#1857APPROACH TO PREVENT PLATING AT V-GROOVE ZONE IN PHOTONICS SILICON DURING BUMPING OR PILLARING
#1858CURRENT SENSOR
#1859DISPLAY APPARATUS
#1860DISPLAY DEVICE, METHOD OF MANUFACTURING THE SAME AND TILED DISPLAY DEVICE INCLUDING THE SAME
#1861SEMICONDUCTOR PACKAGE WITH ENHANCED BONDING FORCE
#1862SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#1863Package
#1864Insulating paste-based conductive device and manufacturing method thereof
#1865Interconnect Structures, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices
#1866Die bonding pads and methods of forming the same
#1867Power Semiconductor Module with Two Opposite Half-Bridges
#1868Semiconductor device and method of forming micro interconnect structures
#1869Chip scale package (CSP) semiconductor device having thin substrate
#1870Semiconductor structure and manufacturing method thereof
#1871Nonvolatile memory device and method of programming in the same
#1872ELECTRONIC DEVICE
#1873SEMICONDUCTOR PACKAGE HAVING ORDERED WIRE ARRANGEMENT BETWEEN DIFFERENTIAL PAIR CONNECTION PADS
#1874METHOD OF ATOMIC DIFFUSION HYBRID BONDING AND APPARATUS MADE FROM SAME
#1875Semiconductor device with solder on pillar
#1876STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING
#1877WAFER LEVEL CHIP SCALE PACKAGE OF POWER SEMICONDUCTOR AND MANUFACUTRING METHOD THEREOF
#1878SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING APPARATUS
#1879BUMPING FOR LIQUID METAL SOCKET INTERCONNECTS
#1880Semiconductor device with composite conductive features and method for fabricating the same
#1881SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
#1882SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE
#1883Semiconductor device
#1884SEMICONDUCTOR DEVICE
#1885Backside contact for thermal displacement in a multi-wafer stacked integrated circuit
#1886ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME
#1887ISOLATION STRUCTURE FOR BOND PAD STRUCTURE
#1888Sensor package and manufacturing method thereof
#1889SEMICONDUCTOR DIE STACKS AND ASSOCIATED SYSTEMS AND METHODS
#1890DISPLAY DEVICE, METHOD OF MANUFACTURING THE SAME, AND TILED DISPLAY DEVICE HAVING THE SAME
#1891Method of manufacturing a semiconductor device
#1892DISPLAY APPARATUS
#1893SEMICONDUCTOR DIE PACKAGE
#1894METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS REFLOW
#1895Solder based hybrid bonding for fine pitch and thin BLT interconnection
#1896SEMICONDUCTOR PACKAGE HAVING A THICK LOGIC DIE
#1897SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#1898POWER ELECTRONIC ASSEMBLY AND POWER MODULE FOR EMBEDDING IN A PRINTED CIRCUIT BOARD
#1899SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#1900SEMICONDUCTOR PACKAGE
#1901DISPLAY DEVICE, METHOD OF MANUFACTURING THE SAME AND TILED DISPLAY DEVICE INCLUDING THE SAME
#1902CURVED LIGHT-EMITTING SUBSTRATE
#1903DISPLAY DEVICE
#1904DISPLAY BACKPLANE ASSEMBLY, LED DISPLAY MODULE, AND RELATED METHODS FOR MANUFACTURING THE SAME
#1905Chip package structure and manufacturing method thereof
#1906Semiconductor device and method of forming insulating layers around semiconductor die
#1907Semiconductor devices and semiconductor packages including the same
#1908SEMICONDUCTOR DEVICE
#1909SILVER- AND GOLD-PLATED CONDUCTIVE MEMBERS
#1910Shifting Contact Pad for Reducing Stress
#1911CHIP ARRANGEMENT, CHIP PACKAGE, METHOD OF FORMING A CHIP ARRANGEMENT, AND METHOD OF FORMING A CHIP PACKAGE
#1912Method for forming semiconductor die package with ring structure comprising recessed parts
#1913Oscillator
#1914IC including capacitor having segmented bottom plate
#1915Semiconductor devices
#1916Semiconductor package and manufacturing method thereof
#1917SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
#1918CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
#1919SEMICONDUCTOR DEVICE WITH INTERCONNECT STRUCTURE HAVING GRAPHENE LAYER AND METHOD FOR PREPARING THE SAME
#1920DIE AND MANUFACTURING METHOD THEREFOR, AND CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR
#1921ELECTRONIC DEVICE
#1922RESIST PATTERNED REDISTRIBUTION WIRING ON COPPER POLYIMIDE VIA LAYER
#1923Fan-out semiconductor package and electronic device including the same
#1924Method for manufacturing semiconductor structure with resistive elements
#1925SEMICONDUCTOR DEVICE PACKAGES INCLUDING AN INDUCTOR AND A CAPACITOR
#1926SEMICONDUCTOR DIE ASSEMBLIES WITH FLEXIBLE INTERCONNECTS AND ASSOCIATED METHODS AND SYSTEMS
#1927Semiconductor Device and Method
#1928Patterning Polymer Layer to Reduce Stress
#1929Integrated circuit bond pad with multi-material toothed structure
#1930Semiconductor device and method for fabricating the same
#1931Flip chip package structure and manufacturing method thereof
#1932Transistor with integrated passive components
#1933Semiconductor package and antenna module comprising the same
#1934SEMICONDUCTOR DEVICE WITH INTEGRATED DEEP TRENCH CAPACITORS
#1935WAFER STRUCTURE AND SEMICONDUCTOR DEVICE
#1936DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME
#1937Multilevel semiconductor device and structure with oxide bonding
#1938Packaged die and RDL with bonding structures therebetween
#1939Forming Recesses in Molding Compound of Wafer to Reduce Stress
#1940Semiconductor package including stacked semiconductor chips
#1941Bump-on-Trace Design for Enlarge Bump-to-Trace Distance
#1942Bonded assembly containing different size opposing bonding pads and methods of forming the same
#1943INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
#1944SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF AND POWER CONVERTER
#1945Interconnection structure of a semiconductor chip having pads of different widths and semiconductor package including the interconnection structure
#1946SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
#1947Heterogeneous fan-out structure and method of manufacture
#1948Semiconductor device with capacitor and method for forming the same
#1949DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
#1950JOINT STRUCTURE
#1951Method of forming integrated chip structure having slotted bond pad in stacked wafer structure
#1952Semiconductor package and method of fabricating the same
#1953SURFACE FINISH STRUCTURE OF MULTI-LAYER SUBSTRATE
#1954Semiconductor device package with isolated semiconductor die and electric field curtailment
#1955HEAT DISSIPATING SYSTEM FOR ELECTRONIC DEVICES
#1956LAMINATE, CURABLE RESIN COMPOSITION, METHOD FOR MANUFACTURING LAMINATE, METHOD FOR MANUFACTURING SUBSTRATE HAVING JUNCTION ELECTRODE, SEMICONDUCTOR DEVICE, AND IMAGE CAPTURING DEVICE
#1957Cantilevered dies in ceramic packages
#1958Semiconductor device structure with magnetic element
#1959Sensor package structure
#1960DISPLAY DEVICE AND TILED DISPLAY DEVICE
#1961DISPLAY DEVICE AND TILED DISPLAY DEVICE
#1962DISPLAY DEVICE AND TILE-SHAPED DISPLAY DEVICE INCLUDING THE SAME
#1963DISPLAY DEVICE AND TILED DISPLAY DEVICE INCLUDING THE SAME
#1964DISPLAY DEVICE AND TILED DISPLAY DEVICE
#1965Method of forming a bonded semiconductor structure
#1966Semiconductor structure and method for preparing same
#1967HIGH-YIELDING AND ULTRAFINE PITCH PACKAGES FOR LARGE-SCALE IC OR ADVANCED IC
#1968Semiconductor device and method of manufacturing the same
#1969THICK BONDING PAD STRUCTURE FOR WIRE BOND STRESS REDUCTION
#1970Semiconductor package and method for manufacturing the same
#1971CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
#1972Semiconductor device for attaching to a flexible display
#1973ELECTRONIC DEVICE
#19743D INTEGRATED CIRCUIT (3DIC) STRUCTURE
#1975IC PACKAGE WITH MULTIPLE DIES
#1976SEMICONDUCTOR DEVICE HAVING A REDISTRIBUTION BONDING INTERCONNECTION, A METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE, AND A CHIP STACK PACKAGE INCLUDING THE SEMICONDUCTOR DEVICE
#1977Display device, and tiled display device including the display device
#1978SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONNECT LAYER FOR HIGH POWER ELECTRONICS
#1979PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
#1980SEMICONDUCTOR PACKAGE
#1981Method for fabricating an integrated circuit device
#1982SEMICONDUCTOR CHIP INCLUDING LOW-K DIELECTRIC LAYER
#1983Packages with Si-substrate-free interposer and method forming same
#1984SEMICONDUCTOR CHIP, CHIP SYSTEM, METHOD OF FORMING A SEMICONDUCTOR CHIP, AND METHOD OF FORMING A CHIP SYSTEM
#1985CHIP-SCALE PACKAGE
#1986Display device
#1987ELECTRONIC MODULE
#1988SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
#1989Bonded wafer device structure and methods for making the same
#1990Package comprising spacers between integrated devices
#1991Integrated circuit device having redistribution pattern
#1992Semiconductor package
#1993SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#1994Semiconductor package structure and method for manufacturing the same
#1995SEMICONDUCTOR PACKAGE HAVING TWO-DIMENSIONAL INPUT AND OUTPUT DEVICE
#1996SEMICONDUCTOR PACKAGING ASSEMBLY AND SEMICONDUCTOR PACKAGING STRUCTURE
#1997DISPLAY DEVICE
#1998LIGHT EMITTING DISPLAY APPARATUS
#1999DISPLAY APPARATUS
#2000DRIVING BACKPLANE, TRANSFER METHOD FOR LIGHT-EMITTING DIODE CHIP, DISPLAY APPARATUS
#2001LOGIC DRIVE BASED ON CHIP SCALE PACKAGE COMPRISING STANDARDIZED COMMODITY PROGRAMMABLE LOGIC IC CHIP AND MEMORY IC CHIP
#2002SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
#2003STRUCTURES AND METHODS FOR REDUCING THERMAL EXPANSION MISMATCH DURING INTEGRATED CIRCUIT PACKAGING
#2004SEMICONDUCTOR PACKAGE
#2005Method of bonding substrates utilizing a substrate holder with holding fingers
#2006Multi-Layered Metal Frame Power Package
#2007DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
#2008MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
#2009Semiconductor device and electronic equipment
#2010Sensor package structure
#2011DISPLAY DEVICE INCLUDING A WIRING PAD AND METHOD FOR MANUFACTURING THE SAME
#2012Integrated circuit device
#2013STACKING POWER DELIVERY DEVICE DIES
#2014Semiconductor package for thermal dissipation
#2015Stacked semiconductor structure and method
#2016MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#2017Semiconductor package
#2018CHIP-PACKAGE DEVICE
#2019STRESS ARREST LIP ON COPPER PAD FOR LOW ROUGHNESS COPPER
#2020Semiconductor structure and method of manufacturing same
#2021SURFACE-MOUNT DEVICE WIRE BONDING IN SEMICONDUCTOR DEVICE ASSEMBLIES
#2022Methods of forming a microelectronic device
#2023Semiconductor device with interconnectors of different density
#2024Semiconductor device with composite middle interconnectors
#2025Semiconductor device and method for manufacturing the same
#2026SEMICONDUCTOR PACKAGE HAVING IMPROVED HEAT DISSIPATION CHARACTERISTICS
#2027COMPOSITE SUBSTRATE AND PRODUCTION METHOD THEREFOR
#2028Low temperature hybrid bonding
#2029Quantum Bit Chip and Method for Fabricating Quantum Bit Chip
#2030DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME
#2031Multi-chip package
#2032POWER SEMICONDUCTOR MODULE AND POWER CONVERSION APPARATUS
#2033MICROELECTRONIC ASSEMBLIES WITH SILICON NITRIDE MULTILAYER
#2034Temperature hierarchy solder bonding
#2035Semiconductor interconnect structures with vertically offset bonding surfaces, and associated systems and methods
#2036LOW STRESS DIRECT HYBRID BONDING
#2037PACKAGE STRUCTURE AND PACKAGING METHOD
#2038Semiconductor device having a wire bonding pad structure connected through vias to lower wiring
#2039SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SAME, AND ELECTRIC POWER CONVERTER
#2040DISPLAY PANEL AND DISPLAY APPARATUS
#2041MULTILAYER GLASS SUBSTRATE
#2042Semiconductor device with a dielectric between portions
#2043SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#2044Semiconductor packages
#2045Non-volatile memory device and method of operating the same
#2046Memory device with improved program performance and method of operating the same
#2047ADHESIVE BONDING COMPOSITION AND METHOD OF USE
#2048Display panel
#2049Packages With Deep Bond Pads and Method Forming Same
#2050Methods of manufacturing semiconductor packages
#2051BOND ENHANCEMENT FOR DIRECT-BONDING PROCESSES
#2052OXIDE AND CARBON LAYERS AT A SURFACE OF A SUBSTRATE FOR HYBRID BONDING
#2053SEMICONDUCTOR DEVICE
#2054Redistribution layers and methods of fabricating the same in semiconductor devices
#2055Package and method of fabricating the same
#2056SEMICONDUCTOR DIE WITH DISSOLVABLE METAL LAYER
#2057Electronic package and fabrication method thereof
#2058ELECTRONIC DEVICE HAVING ALIGNMENT MARK
#2059Semiconductor package
#2060Radio frequency packages containing substrates with coefficient of thermal expansion matched mount pads and associated fabrication methods
#2061INTERCONNECT STRUCTURES
#2062SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE
#2063Dielectric sidewall protection and sealing for semiconductor devices in a in wafer level packaging process
#2064Package having an electronic component and an encapsulant encapsulating a dielectric layer and a semiconductor die of the electronic component
#2065APPARATUS FOR MOUNTING SOLDER BALLS
#2066Backside and sidewall metallization of semiconductor devices
#2067DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME
#2068SEMICONDUCTOR DEVICE
#2069Reducing loss in stacked quantum devices
#2070Semiconductor package
#2071METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
#2072STEP INTERCONNECT METALLIZATION TO ENABLE PANEL LEVEL PACKAGING
#2073POWER SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THE SAME, AND POWER CONVERSION APPARATUS
#2074Semiconductor structure having polygonal bonding pad
#2075METHODS AND APPARATUS TO REDUCE THICKNESS OF ON-PACKAGE MEMORY ARCHITECTURES
#2076Method of manufacturing semiconductor structure having polygonal bonding pad
#2077SEMICONDUCTOR DEVICE
#2078DIE ATTACH SYSTEM
#2079METHOD OF CLEANING CHAMBER
#2080DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
#2081Backlight Unit and Display Device Including the Same
#2082Semiconductor device
#2083SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGING STRUCTURE
#2084PASSING SIGNALS THROUGH MICRO DEVICE SIDEWALLS
#2085Solder stop feature for electronic devices
#2086Method and Apparatus for Achieving Package-Level Chip-Scale Packaging that Allows for the Incorporation of In-Package Integrated Passives
#2087Multilevel semiconductor device and structure with oxide bonding
#2088Semiconductor memory device with a plurality of sense ampilifers overlapping a plurality of metal joints
#2089Array substrate, method for fabricating same, and display device
#2090Transistor with odd-mode oscillation stabilization circuit
#2091THREE-DIMENSIONAL FAN-OUT INTEGRATED PACKAGE STRUCTURE, PACKAGING METHOD THEREOF, AND WIRELESS HEADSET
#2092BONDING STRUCTURE AND MANUFACTURING METHOD THEREFOR
#2093SEMICONDUCTOR PACKAGES
#2094Packaged multi-chip semiconductor devices and methods of fabricating same
#2095SEMICONDUCTOR PACKAGE
#2096SEMICONDUCTOR DEVICE
#2097Fan-out semiconductor packages
#2098STACK TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#2099SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
#2100DIRECT SUBSTRATE TO SOLDER BUMP CONNECTION FOR THERMAL MANAGEMENT IN FLIP CHIP AMPLIFIERS