H01L24/23 - CPC Classification Index

ClassID:

207801 ⎘

H01L24/23 - CPC Classification

Classification description:

Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; High density interconnect [HDI] connectors; Manufacturing methods related thereto Structure, shape, material or disposition of the high density interconnect connectors after the connecting process

Sub-classes:

H01L24/24 » {of an individual high density interconnect connector} 3,0K
H01L24/25 » {of a plurality of high density interconnect connectors} 721

Recent Application in this class:

20250266417

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

20240347457

PITCH TRANSLATION ARCHITECTURE FOR SEMICONDUCTOR PACKAGE INCLUDING EMBEDDED INTERCONNECT BRIDGE

20240088124

Semiconductor structure and manufacturing method thereof

20240006365

Manufacturing method of semiconductor package structure

20230369152

Package and package-on-package structure having elliptical columns and ellipsoid joint terminals

20230352451

THREE-DIMENSIONAL FAN-OUT MEMORY POP STRUCTURE AND PACKAGING METHOD THEREOF

20230290728

Pitch translation architecture for semiconductor package including embedded interconnect bridge

20220301964

Package and package-on-package structure having elliptical columns and ellipsoid joint terminals

20220285241

METHOD OF FORMING SEMICONDUCTOR PACKAGES HAVING THERMAL THROUGH VIAS (TTV)

20220271024

Semiconductor structure and manufacturing method thereof

20220148968

Pitch translation architecture for semiconductor package including embedded interconnect bridge

20220045025

Semiconductor package structure and manufacturing method thereof

20210183784

Substrate having electronic component embedded therein

20200373219

Semiconductor packages having thermal through vias (TTV)

20200357785

Semiconductor structure and manufacturing method thereof

20200235051

Pitch translation architecture for semiconductor package including embedded interconnect bridge

20200194326

Package and package-on-package structure having elliptical columns and ellipsoid joint terminals

20190206792

Pitch translation architecture for semiconductor package including embedded interconnect bridge

20190130152

Fan-out semiconductor package

20180204828

Semiconductor structure and manufacturing method thereof

20180199438

Electronic device with embedded component carrier

20160270221

Resin multilayer substrate and component module

20160247763

High density substrate interconnect formed through inkjet printing

20150228568

Fan-out high-density packaging methods and structures

20120319254

Wiring board with built-in semiconductor element

16521526

Semiconductor package and method for manufacturing the same