Patents-Review.com
ClassID:

207837 ⎘

H01L24/71 - CPC Classification

Classification description:

Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto Means for bonding not being attached to, or not being formed on, the surface to be connected

Sub-classes:
Recent Application in this class:
#1
20250219019
2025-07-03

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

 #2
20240355759
2024-10-24

LOCALIZED DAMPING ELEMENTS FOR MITIGATING INTERCONNECT VIBRATION DAMAGE

 #3
20230343744
2023-10-26

Semiconductor device and method for manufacturing the same

 #4
20230115289
2023-04-13

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

 #5
20220278072
2022-09-01

Semiconductor device and method for manufacturing semiconductor device

 #6
20220059406
2022-02-24

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

 #7
20210063439
2021-03-04

Small pitch integrated knife edge temporary bonding microstructures

 #8
20200321308
2020-10-08

Semiconductor device and method for manufacturing semiconductor device

 #9
20200066675
2020-02-27

Semiconductor device and method for manufacturing semiconductor device

 #10
20190341378
2019-11-07

Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography

 #11
20190157239
2019-05-23

Semiconductor device and method for manufacturing semiconductor device

 #12
20190088637
2019-03-21

Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography

 #13
20180158719
2018-06-07

Method for direct bonding of substrates including thinning of the edges of at least one of the two substrates

 #14
20170207192
2017-07-20

Semiconductor device and method for manufacturing semiconductor device to prevent separation of terminals

 #15
20160218052
2016-07-28

Semiconductor device and method for manufacturing semiconductor device

 #16
20150194362
2015-07-09

Chip-embedded packages with backside die connection

 #17
20140021627
2014-01-23

Semiconductor device and method for manufacturing semiconductor device

 #18
20110042793
2011-02-24

LEAD FRAME ASSEMBLY FOR A SEMICONDUCTOR PACKAGE

 #19
20080120833
2008-05-29

Interconnect For Microelectronic Structures With Enhanced Spring Characteristics

 #20
20060211278
2006-09-21

Method of forming an interconnection element

 #21
20060131712
2006-06-22

Semiconductor wafer, an electronic component, and a component carrier for producing the electronic component