Patents-Review.com
ClassID:

207841 ⎘

H01L24/741 - CPC Classification

Classification description:

Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies Apparatus for manufacturing means for bonding, e.g. connectors

Sub-classes:
Recent Application in this class:
#1
20250323206
2025-10-16

TEMPERATURE CONTROLLABLE BONDER EQUIPMENT FOR SUBSTRATE BONDING

 #2
20250309182
2025-10-02

SEMICONDUCTOR-PACKAGING DEVICE

 #3
20250300124
2025-09-25

SUBSTRATE BONDING METHOD AND SUBSTRATE BONDING APPARATUS

 #4
20240379616
2024-11-14

DYNAMIC BONDING GAP CONTROL AND TOOL FOR WAFER BONDING

 #5
20240033840
2024-02-01

LASER BONDING APPARATUS FOR THREE-DIMENSIONAL MOLDED SCULPTURES

 #6
20230284426
2023-09-07

Apparatus for mounting components on a substrate

 #7
20230067088
2023-03-02

TEMPERATURE CONTROLLABLE BONDER EQUIPMENT FOR SUBSTRATE BONDING

 #8
20230019415
2023-01-19

Dynamic bonding gap control and tool for wafer bonding

 #9
20220165789
2022-05-26

Methods for transfer of micro-devices

 #10
20220076980
2022-03-10

Substrate bonding apparatus and method of manufacturing a semiconductor device

 #11
20220045029
2022-02-10

Bonding apparatus and bonding method

 #12
20210392802
2021-12-16

Methods of attaching die to substrate using compliant die attach system having spring-driven bond tool

 #13
20210280436
2021-09-09

Method of applying conductive adhesive and manufacturing device using the same

 #14
20210195816
2021-06-24

Apparatus and method for mounting components on a substrate

 #15
20210013258
2021-01-14

Systems and methods for transfer of micro-devices

 #16
20200335344
2020-10-22

Laser bonding apparatus for three-dimensional molded sculptures

 #17
20200273836
2020-08-27

Manufacturing method and manufacturing apparatus for stacked substrate, and program

 #18
20200144077
2020-05-07

Method of applying conductive adhesive and manufacturing device using the same

 #19
20200126948
2020-04-23

Die bonding apparatus and method and substrate bonding apparatus and method

 #20
20200077550
2020-03-05

Compliant die attach systems having spring-driven bond tools

 #21
20190378811
2019-12-12

Vertically die-stacked bonder and method using the same

 #22
20190244818
2019-08-08

Laser bonding apparatus for three-dimensional molded sculptures

 #23
20190164928
2019-05-30

Bonding method

 #24
20190148333
2019-05-16

Method for bonding wafers and bonding tool

 #25
20190132960
2019-05-02

Method for correcting solder bump

 #26
20190001426
2019-01-03

Method for bonding flexible part including inclined leads

 #27
20180323165
2018-11-08

Vertically die-stacked bonder and method using the same

 #28
20180317353
2018-11-01

Apparatus and method for mounting components on a substrate

 #29
20180315793
2018-11-01

Systems and methods for transfer of micro-devices

 #30
20180164171
2018-06-14

METHOD OF CORRECTING ESTIMATED FORCE OF BONDING APPARATUS

 #31
20180151804
2018-05-31

Integration of micro-devices into system substrate

 #32
20180082969
2018-03-22

Chip alignment utilizing superomniphobic surface treatment of silicon die

 #33
20180006083
2018-01-04

Systems and methods for transfer of micro-devices

 #34
20170278817
2017-09-28

Chip alignment utilizing superomniphobic surface treatment of silicon die

 #35
20170179066
2017-06-22

BULK SOLDER REMOVAL ON PROCESSOR PACKAGING

 #36
20170053889
2017-02-23

Bonding device

 #37
20170023617
2017-01-26

SHAPING OF CONTACT STRUCTURES FOR SEMICONDUCTOR TEST, AND ASSOCIATED SYSTEMS AND METHODS

 #38
20160365323
2016-12-15

Electronic devices with semiconductor die attached with sintered metallic layers, and methods of formation of such devices

 #39
20160099199
2016-04-07

Electronic devices with semiconductor die coupled to a thermally conductive substrate

 #40
20150334849
2015-11-19

Method of manufacturing semiconductor device, substrate processing apparatus and recording medium

 #41
20150235982
2015-08-20

Apparatus for eutectic bonding

 #42
20150017782
2015-01-15

BONDING DEVICE AND BONDING METHOD

 #43
20150007958
2015-01-08

Solder bump forming method and apparatus

 #44
20140212678
2014-07-31

Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method

 #45
20130119046
2013-05-16

Misalignment correction for embedded microelectronic die applications

 #46
20120292773
2012-11-22

Method for producing a metal layer on a substrate and device

 #47
20120009738
2012-01-12

Misalignment correction for embedded microelectronic die applications

 #48
20110198733
2011-08-18

Semiconductor device and method of patterning resin insulation layer on substrate of the same

 #49
20080314742
2008-12-25

ELECTROLYTIC NI PLATING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE