ClassID:

207850

H01L24/79 - CPC Classification

Classification description:

Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies Apparatus for Tape Automated Bonding [TAB]

Recent Application in this class:
#1
20230133340
2023-05-04

Bonding apparatus and bonding method

#2
20220310553
2022-09-29

BONDING AND INDEXING METHOD

#3
20220063947
2022-03-03

CONNECTION JIG TAPE

#4
20210005571
2021-01-07

Bonding Device

#5
20200411466
2020-12-31

THERMOCOMPRESSION BONDING DEVICE

#6
20200144221
2020-05-07

BONDING APPARATUS AND BONDING METHOD

#7
20200135688
2020-04-30

Apparatus and method for transferring semiconductor devices from a substrate and stacking semiconductor devices on each other

#8
20200017728
2020-01-16

Mask-integrated surface protective tape with release liner

#9
20190206829
2019-07-04

Bonding and indexing apparatus

#10
20190043820
2019-02-07

Power electronics assembly having an adhesion layer, and method for producing said assembly

#11
20180226376
2018-08-09

Apparatus and method for transfering semiconductor devices from a substrate and stacking semiconductor devices on each other

#12
20170144246
2017-05-25

Apparatus for the material-bonded connection of connection partners of a power-electronics component

#13
20080026212
2008-01-31

Film splicer

#14
20060065956
2006-03-30

COF flexible printed wiring board and method of producing the wiring board

#15
20060022273
2006-02-02

System and method for assembly of semiconductor dies to flexible circuits

#16
20050186418
2005-08-25

spliced film carrier tape

#17
20050161793
2005-07-28

Semiconductor device and stacked semiconductor device that can increase flexibility in designing a stacked semiconductor device

#18
18300379
2023-09-19

Chip packaging device, chip packaging method, and package chip