207858 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
Semiconductor device package assemblies with direct leadframe attachment
#2Bonding apparatus and bonding method
#3Impedance controlled electrical interconnection employing meta-materials
#4SEMICONDUCTOR DEVICE PACKAGE WITH CONDUCTIVE VIAS AND METHOD OF MANUFACTURING
#5Semiconductor device package assemblies with direct leadframe attachment
#6THERMOCOMPRESSION BONDING DEVICE
#7BONDING APPARATUS AND BONDING METHOD
#8Apparatus and method for transferring semiconductor devices from a substrate and stacking semiconductor devices on each other
#9Impedance controlled electrical interconnection employing meta-materials
#10Mask-integrated surface protective tape with release liner
#11Formation of fine pitch traces using ultra-thin PAA modified fully additive process
#12Multi-stacked die package with flexible interconnect
#13Formation of fine pitch traces using ultra-thin PAA modified fully additive process
#14Liquid crystal panel, method for fabricating thereof and display apparatus
#15Film-like adhesive and method for producing semiconductor package using film-like adhesive
#16Power electronics assembly having an adhesion layer, and method for producing said assembly
#17Image pickup apparatus, endoscope, and method for manufacturing image pickup apparatus
#18Apparatus and method for transfering semiconductor devices from a substrate and stacking semiconductor devices on each other
#19Heterogeneous integration of ultrathin functional block by solid phase adhesive and selective transfer
#20Chip-on film and display device including the same
#21Radio frequency (RF) devices
#22Apparatus for the material-bonded connection of connection partners of a power-electronics component
#23Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement
#24Stacked ultrasound vibration device and ultrasound medical apparatus
#25High density interconnection of microelectronic devices
#26Tape for electronic devices with reinforced lead crack
#27Display device comprising remaining portion of inspection line with cut edge
#28Double-sided chip on film packaging structure and manufacturing method thereof
#29Method for producing a switching device with a moisture-tight and electrically insulating cover and for producing an arrangement therewith
#30Discrete flexible interconnects for modules of integrated circuits
#31Method of manufacturing semiconductor package having magnetic shield unit
#32Impedance controlled electrical interconnection employing meta-materials
#33LOW COST CONNECTOR FOR HIGH SPEED, HIGH DENSITY SIGNAL DELIVERY
#34Semiconductor component with chip for the high-frequency range
#35High density interconnection of microelectronic devices
#36Film transferable logic circuit, and methods for providing film transferable logic circuit
#37Semiconductor device and semiconductor package containing the same
#38Method of mounting a semiconductor wafer with a support board on a supporting adhesive tape joined to a ring frame
#39Method of manufacturing semiconductor package having no chip pad
#40Electronic device and a method for fabricating an electronic device
#41Semiconductor package including flip chip controller at bottom of die stack
#42De-skewed multi-die packages
#43Semiconductor device including semiconductor chips with different thickness
#44Method for fluid guided self-assembly of microcomponents
#45MOLD ARRAY PROCESS METHOD TO PREVENT EXPOSURE OF SUBSTRATE PERIPHERIES
#46Magnetic integration double-ended converter
#47Semiconductor device and a method of manufacturing the same
#48Semiconductor device having a vertical interconnect structure using stud bumps
#49Carrier tape for tab-package and manufacturing method thereof
#50High-speed, high-resolution electrophysiology in-vivo using conformal electronics
#51Simulated wirebond semiconductor package
#52MULTILAYERED POLYIMIDE FILM
#53Impedance controlled electrical interconnection employing meta-materials
#54Semiconductor Device
#55CHIP PACKAGE
#56Semiconductor chip and film and TAB package comprising the chip and film
#57Stacked semiconductor components having conductive interconnects
#58Method for forming a packaged semiconductor device having a ground plane
#59Carrier tape for tab-package and manufacturing method thereof
#60Method for connecting a die assembly to a substrate in an integrated circuit
#61Semiconductor package including flip chip controller at bottom of die stack
#62Method for application of a chip module to an antenna
#63Semiconductor device
#64Semiconductor device with pads overlapping wiring layers including dummy wiring
#65CONDUCTIVE REEL
#66Integrated circuit chip using top post-passivation technology and bottom structure technology
#67Semiconductor apparatus packaging structure having embossed tape over tab tape, the embossed tape and method of forming the semiconductor apparatus packaging structure
#68SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR DEVICE IN WHICH CIRCUIT BOARD AND SEMICONDUCTOR CHIP ARE CONNECTED BY LEADS
#69WINDOW TYPE SEMICONDUCTOR PACKAGE
#70Semiconductor device having wiring layers with power-supply plane and ground plane
#71Electronic member, electronic part and manufacturing method therefor
#72Method for producing an electrical and mechanical connection and an assembly comprising such a connection
#73Semiconductor package comprising alignment members
#74Multi-die building block for stacked-die package
#75Methods for fabricating semiconductor components with conductive interconnects having planar surfaces
#76ENHANCED TRACES OF FLEXIBLE TAB CIRCUIT FOR ATTACHMENT ON BOND PADS OF INKJET PRINTHEAD CHIP IN PRINTHEAD CARTRIDGE ASSEMBLY
#77Power semiconductor module with a hermetically tight circuit arrangement and method for producing such a module
#78STACK TYPE SEMICONDUCTOR DEVICE WITH REINFORCING RESIN
#79Semiconductor device having copper interconnect for bonding
#80CHIP PACKAGE STRUCTURE
#81Electronic circuit device and method for manufacturing same
#82Semiconductor device and method of forming vertical interconnect structure using stud bumps
#83Semiconductor device
#84Embedded die system and method
#85Semiconductor device including semiconductor chips with different thickness
#86Semiconductor package including flip chip controller at bottom of die stack
#87SEMICONDUCTOR STACK DEVICE AND MOUNTING METHOD
#88Semiconductor element chip, ink jet head employing semiconductor element chip, and method for bonding electrodes of semiconductor element chip
#89Integrated circuit package system with package integration
#90Semiconductor device having improved solder joint and internal lead lifetimes
#91Semiconductor device, method for manufacturing the same, and flexible substrate for mounting semiconductor
#92Semiconductor device
#93Semiconductor package, electronic part and electronic device
#94Stacked dual-die packages, methods of making, and systems incorporating said packages
#95Semiconductor device with semiconductor chip and method for producing it
#96TAPE CARRIER SUBSTRATE AND SEMICONDUCTOR DEVICE
#97SEMICONDUCTOR MODULE DEVICE, METHOD OF MANUFACTURING THE SAME, FLAT PANEL DISPLAY, AND PLASMA DISPLAY PANEL
#98Chip assembly with interconnection by metal bump
#99Electronic device manufacturing method and supporter
#100Chip package
#101System for fabricating semiconductor components with conductive interconnects
#102Tape carrier for semiconductor device and method for making same
#103Method and device for transferring a chip to a contact substrate
#104Methods for fabricating semiconductor components with conductive interconnects
#105Semiconductor components with conductive interconnects
#106SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
#107SEMICONDUCTOR ELEMENT UNIT AND COMPLEX THEREOF, SEMICONDUCTOR DEVICE AND MODULE THEREOF, ASSEMBLED STRUCTURE THEREOF AND FILM SUBSTRATE CONNECTION STRUCTURE
#108Stacked die package with die interconnects
#109Stacked die in die BGA package
#110Semiconductor device, method for manufacturing the same, and semiconductor device mounting structure
#111Semiconductor device and a method of manufacturing the same
#112SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE CONTAINING THE SAME
#113WIRING FILM HAVING WIRE, SEMICONDUCTOR PACKAGE INCLUDING THE WIRING FILM, AND METHOD OF FABRICATING THE SEMICONDUCTOR PACKAGE
#114Stacked die with a recess in a die BGA package
#115FLEXIBLE FILM SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#116SEMICONDUCTOR PACKAGE COMPRISING ALIGNMENT MEMBERS
#117Chip-mounted film package
#118Laminating system, IC sheet, scroll of IC sheet, and method for manufacturing IC chip
#119Web process interconnect in electronic assemblies
#120Semiconductor package having flexible lead connection plate for electrically connecting base and chip
#121Lead frame with included passive devices
#122Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers
#123Method of manufacturing a semiconductor device
#124Method of fabricating a stacked die having a recess in a die BGA package
#125Film splicer
#126Die package and probe card structures and fabrication methods
#127Semiconductor Module with Serial Bus Connection to Multiple Dies
#128Semiconductor Module with Serial Bus Connection to Multiple Dies
#129Semiconductor chip having fine pitch bumps and bumps thereon
#130Semiconductor Module with Serial Bus Connection to Multiple Dies
#131Semiconductor Module With Serial Bus Connection to Multiple Dies
#132Heat-radiating tape carrier package and method for manufacturing the same
#133Electrical component on a substrate and method for production thereof
#134Methods for fabricating stiffeners for flexible substrates
#135Leadless semiconductor package and method of manufacture
#136Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
#137Method for making stacked integrated circuits (ICs) using prepackaged parts
#138WIRE EMBEDDED BRIDGE
#139High frequency chip packages with connecting elements
#140Semiconductor device packaging for avoiding metal contamination
#141Semiconductor structure and method of assembly
#142Flexible substrate for package of die
#143Manufacturing method of electronic device
#144Die pad for semiconductor packages and methods of making and using same
#145Method for connecting a die assembly to a substrate in an integrated circuit and a semiconductor device comprising a die assembly
#146Semiconductor package having dual interconnection form and manufacturing method thereof
#147Method of fabricating a stacked die in die BGA package
#148Method of fabricating a stacked die in die BGA package
#149Stacked die in die BGA package
#150Semiconductor device and a method of manufacturing the same
#151In-package connection between integrated circuit dies via flex tape
#152Semiconductor device and manufacturing method thereof
#153Backside method for fabricating semiconductor components with conductive interconnects
#154Semiconductor device with semiconductor chip and rewiring layer and method for producing the same
#155Inlet for an electronic tag
#156Method of fabricating semiconductor chip assemblies
#157Stacked die-in-die BGA package with die having a recess
#158Flexible printed wiring board, method for fabricating flexible printed wiring board, and semiconductor device
#159Semiconductor device and a manufacturing method of the same
#160FLEXIBLE TYPE UNIT, FLEXIBLE TYPE REEL, AND METHOD OF MANUFACTURING FLEXIBLE TYPE REEL
#161Methods for assembling semiconductor devices and interposers
#162Chip on board leadframe for semiconductor components having area array
#163Semiconductor package using flexible film and method of manufacturing the same
#164Flexible substrate for package
#165Copper interconnect
#166Methods for fabricating stiffeners for flexible substrates
#167Microelectronic assemblies incorporating inductors
#168Copper interconnect
#169COF flexible printed wiring board and method of producing the wiring board
#170Copper interconnect
#171Copper interconnect
#172Copper interconnect
#173Copper interconnect for semiconductor device
#174Electronic component with multilayered rewiring plate and method for producing the same
#175System and method for assembly of semiconductor dies to flexible circuits
#176Interposers and other carriers including a slot with laterally recessed area at an end thereof and semiconductor device assemblies and packages including such carriers
#177Semiconductor device and method for manufacturing the same
#178Semiconductor device including a semiconductor chip formed on an insulating element such as a tape, and including an improved insulating arrangement
#179Semiconductor device having improved solder joint and internal lead lifetimes
#180Method and semiconductor device having copper interconnect for bonding
#181Semiconductor device and manufacturing metthod thereof
#182Copper interconnect
#183Semiconductor device and manufacturing method thereof
#184Semiconductor device and method for manufacturing the same
#185spliced film carrier tape
#186Electronic circuit module
#187Semiconductor device and stacked semiconductor device that can increase flexibility in designing a stacked semiconductor device
#188Methods of making microelectronic assemblies
#189Method for manufacturing semiconductor device with plural semiconductor chips
#190Semiconductor device and manufacturing method for the same
#191Semiconductor device
#192Chip-mounted film package
#193Substrate for mounting semiconductor chip, mounting structure of semiconductor chip, and mounting method of semiconductor chip
#194Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers
#195Method and semiconductor device having copper interconnect for bonding
#196Semiconductor device with semiconductor chip and rewiring layer and method for producing the same
#197Semiconductor device, process of producing semiconductor device, and ink jet recording head
#198Semiconductor device and its manufacturing method
#199Method of producing an electronic component and a panel with a plurality of electronic components
#200Electronic devices with small functional elements supported on a carrier
#201High-frequency chip packages
#202Semiconductor package using flexible film and method of manufacturing the same
#203Film substrate, semiconductor device, method of manufacturing film substrate, method of manufacturing semiconductor device and method of manufacturing circuit board with semiconductor device
#204Method for fabricating semiconductor component with chip on board leadframe
#205Semiconductor component having chip on board leadframe
#206Imaging system
#207Chip packaging device, chip packaging method, and package chip