207867 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die
#4502Apparatus for thermally enhanced semiconductor package
#4503Semiconductor device and production method thereof
#4504SEMICONDUCTOR PACKAGE AND MANUFACTRING METHOD THEREOF
#4505Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure
#4506Semiconductor device and method of forming prefabricated EMI shielding frame with cavities containing penetrable material over semiconductor die
#4507Semiconductor package with integrated inductor
#4508Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor
#4509Semiconductor device
#4510Small low-profile optical proximity sensor
#4511Semiconductor device and manufacturing method of the same
#4512Semiconductor package and method of forming the same
#4513PACKAGING METHOD OF SEMICONDUCTOR DEVICE
#4514Method for manufacturing a semiconductor component and structure therefor
#4515METHOD OF MAKING MICROELECTRONIC PACKAGE USING INTEGRATED HEAT SPREADER STIFFENER PANEL AND MICROELECTRONIC PACKAGE FORMED ACCORDING TO THE METHOD
#4516Semiconductor device with respective electrode pad rows and respective external electrodes electrically connected and arranged in the respective end portions of the substrate
#4517METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
#4518LEAD FRAME, ELECTRONIC COMPONENT INCLUDING THE LEAD FRAME, AND MANUFACTURING METHOD THEREOF
#4519Method and system for forming a thin semiconductor device
#4520Semiconductor device and method of forming conductive posts and heat sink over semiconductor die using leadframe
#4521Semiconductor device and method of manufacturing the same
#4522Light-emitting-device package and a method for producing the same
#4523Component mounting apparatus and method
#4524Method of forming a semiconductor device
#4525Method of fabricating wiring board and method of fabricating semiconductor device
#4526Electrical connections for multichip modules
#4527Integrated circuit packaging system with dual side connection and method of manufacture thereof
#4528Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP
#4529Leadless package system having external contacts
#4530Chip-exposed semiconductor device and its packaging method
#4531Semiconductor apparatus and power supply circuit
#4532Semiconductor light emitting device packages and methods
#4533Etch isolation LPCC/QFN strip
#4534Method of fabricating a semiconductor device with encapsulant
#4535Method For Encapsulating Semiconductor Dies
#4536Near chip scale semiconductor packages
#4537THIN QUAD FLAT PACKAGE WITH NO LEADS (QFN) FABRICATION METHODS
#4538Method for manufacturing a semiconductor component
#4539Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant
#4540Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#4541Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate
#4542Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation
#4543Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die
#4544Semiconductor device and method of forming discontinuous ESD protection layers between semiconductor die
#4545Method of manufacturing a printed circuit board (PCB)
#4546Stacked semiconductor package and method for manufacturing the same
#4547Semiconductor device and method for fabricating semiconductor device
#4548Semiconductor package and method of manufacturing same
#4549Nano-structured gasket for cold weld hermetic MEMS package and method of manufacture
#4550System for encapsulation of semiconductor dies
#4551LASER ABLATION ALTERNATIVE TO LOW COST LEADFRAME PROCESS
#4552Electronic component device and method for producing the same
#4553Semiconductor device and manufacturing method thereof
#4554Etch-back type semiconductor package, substrate and manufacturing method thereof
#4555TCE compensation for package substrates for reduced die warpage assembly
#4556Laser etch via formation
#4557INTEGRATED CIRCUIT PACKAGE STRUCTURE AND METHOD
#4558Lead frame based semiconductor package and a method of manufacturing the same
#4559LEAD FRAME AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
#4560Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof
#4561SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREOF
#4562LED wafer with laminated phosphor layer
#4563METHOD OF ASSEMBLING SEMICONDUCTOR DEVICES INCLUDING SAW SINGULATION
#4564Electromagnetic interference shielding on semiconductor devices
#4565Semiconductor device
#4566Semiconductor device with stacked semiconductor chips
#4567Semiconductor device having double side electrode structure
#4568Electronic device package and method of manufacture
#4569Power semiconductor device packaging
#4570Semiconductor device and method of forming openings in thermally-conductive frame of FO-WLCSP to dissipate heat and reduce package height
#4571Semiconductor device packages with electromagnetic interference shielding
#4572ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
#4573Stacked wafer manufacturing method
#4574Chip embedded substrate and method of producing the same
#4575Method for manufacturing LED package and substrate thereof
#4576Package-on-package system with through vias and method of manufacture thereof
#4577Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant
#4578Semiconductor device having multiple semiconductor elements
#4579LIGHT EMITTING DIODE PACKAGE, LIGHTING APPARATUS HAVING THE SAME, AND METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE
#4580Manufacturing method for electronic devices
#4581STACKED AND SHIELDED PACKAGES WITH INTERCONNECTS
#4582Method of manufacturing light-emitting device
#4583Circuit module
#4584METHOD AND APPARATUS FOR FABRICATING INTEGRATED CIRCUIT DEVICE USING SELF-ORGANIZING FUNCTION
#4585Semiconductor device and method of forming high routing density BOL BONL and BONP interconnect sites on substrate
#4586Semiconductor device having stacked components
#4587Lead frame for semiconductor device
#4588SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#4589Method for manufacture of inline integrated circuit system
#4590Semiconductor device manufacturing method, semiconductor device, and wiring board
#4591Packaging process to create wettable lead flank during board assembly
#4592Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads
#4593Embedded semiconductive chips in reconstituted wafers, and systems containing same
#4594Radiate under-bump metallization structure for semiconductor devices
#4595Device and method for manufacturing a device
#4596Semiconductor device packages with fan-out and with connecting elements for stacking and manufacturing methods thereof
#4597Semiconductor package
#4598Apparatus for and methods of attaching heat slugs to package tops
#4599Granular epoxy resin composition for encapsulating semiconductor, semiconductor device using the same and method for producing semiconductor device
#4600Semiconductor device and communication method
#4601Wafer level image sensor packaging structure and manufacturing method of the same
#4602Manufacturing method and structure of a wafer level image sensor module with package structure
#4603Semiconductor light emitting device
#4604Heat dissipation by through silicon plugs
#4605Resin composition, reflector for light-emitting semiconductor device, and light-emitting semiconductor unit
#4606Semiconductor package with through silicon vias
#4607Lighting device and method of manufacturing the same
#4608In system reflow of low temperature eutectic bond balls
#4609Method of forming package-on-package and device related thereto
#4610Electronic device wafer level scale packages and fabrication methods thereof
#4611Chipstack package and manufacturing method thereof
#4612METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING COMPRESSION MOLDING
#4613Conformal shielding process using process gases
#4614STACKED WAFER LEVEL PACKAGE HAVING A REDUCED SIZE
#4615Semiconductor device
#4616SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#4617Semiconductor device package having a buffer structure and method of fabricating the same
#4618Semiconductor device
#4619Encapsulated semiconductor chip with external contact pads and manufacturing method thereof
#4620Integrated circuit packaging system with interconnect and method of manufacture thereof
#4621Integrated circuit packaging system with stacking option and method of manufacture thereof
#4622Integrated circuit protruding pad package system and method for manufacturing thereof
#4623Integrated circuit packaging system with leadframe and method of manufacture thereof
#4624Manufacturing method of electronic device package, electronic device package, and oscillator
#4625Fabrication method for integrated circuit chip component, multi-chip module, and their integration structure
#4626Electronic circuit module component and method of manufacturing electronic circuit module component
#4627MULTI-FUNCTION CARD DEVICE
#4628MULTI-CHIP STACK STRUCTURE HAVING THROUGH SILICON VIA
#4629Surface-mounted electronic component
#4630Integrated circuit packaging system with bump contact on package leads and method of manufacture thereof
#4631Multi-layer lead frame package and method of fabrication
#4632PHOTOELECTRIC CONVERSION FILM-STACKED SOLID-STATE IMAGING DEVICE WITHOUT MICROLENSES, ITS MANUFACTURING METHOD, AND IMAGING APPARATUS
#4633Electronic component package and method for producing electronic component package
#4634Conformal shielding employing segment buildup
#4635Method of manufacture of integrated circuit packaging system with multi-tier conductive interconnects
#4636Underfill process for flip-chip LEDs
#4637Distributed semiconductor device methods, apparatus, and systems
#4638ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
#4639Semiconductor device having a semiconductor element buried in an insulating layer and method of manufacturing the same
#4640METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE
#4641QUAD FLAT NON-LEADED SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
#4642PRE-PROCESSING TO REDUCE WAFER LEVEL WARPAGE
#4643Leadframe based multi terminal IC package
#4644Quad flat non-leaded semiconductor package
#4645SEMICONDUCTOR ASSEMBLY PACKAGE HAVING SHIELDING LAYER AND METHOD THEREFOR
#4646Method of fabricating a semiconductor device that limits damage to elements of the semiconductor device that are exposed during processing
#4647Semiconductor device and method of forming insulating layer around semiconductor die
#4648Light emitting diode wafer-level package with self-aligning features
#4649Methods and devices for fabricating and assembling printable semiconductor elements
#4650Carrier system with multi-tier conductive posts and method of manufacture thereof
#4651Method for singulating electronic components from a substrate
#4652Dummy wafers in 3DIC package assemblies
#4653SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#4654Method for manufacturing a semiconductor device and a semiconductor device
#4655Stacked semiconductor chips with separate encapsulations
#4656INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD OF MANUFACTURE THEREOF
#4657Chip package and method for fabricating the same
#4658MANUFACTURING METHOD OF ELECTRONIC DEVICE PACKAGE, ELECTRONIC DEVICE PACKAGE, AND OSCILLATOR
#4659LED PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#4660LED packaging with integrated optics and methods of manufacturing the same
#4661Processing method for package substrate
#4662High Frequency Power Supply Module Having High Efficiency and High Current
#4663Semiconductor device with hollow structure
#4664Semiconductor die having a redistribution layer
#46653D semiconductor package interposer with die cavity
#4666Manufacturing method for semiconductor package
#4667Semiconductor package and manufacturing method thereof
#4668Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
#4669LED multi-chip bonding die and light strip using the same
#4670LED module
#4671Method for manufacturing a semiconductor structure
#4672Integrated chip package structure using organic substrate and method of manufacturing the same
#4673Device including an encapsulated semiconductor chip and manufacturing method thereof
#4674Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier
#4675Semiconductor Device and Method of Forming 3D Inductor from Prefabricated Pillar Frame
#4676Manufacturing method of semiconductor device
#4677Semiconductor device and manufacturing method therefor
#4678PANELIZED PACKAGING WITH TRANSFERRED DIELECTRIC
#4679Lead frame ball grid array with traces under die
#4680Method of manufacturing a semiconductor device with a carrier having a cavity and semiconductor device
#4681Semiconductor device and electronic device
#4682Method for manufacturing semiconductor device
#4683Method for manufacturing a microelectronic package comprising at least one microelectronic device
#4684Quad flat non-leaded package structure with electromagnetic interference shielding function and method for fabricating the same
#4685Stacking package structure with chip embedded inside and die having through silicon via and method of the same
#4686Package process of stacked type semiconductor device package structure
#4687Electronic device package and method for fabricating the same
#4688Electronic device package and fabrication method thereof
#4689Semiconductor module, method for fabricating the semiconductor module, and mobile apparatus
#46903D IC architecture with interposer and interconnect structure for bonding dies
#4691Semiconductor device and semiconductor assembly with lead-free solder
#4692Manufacturing of a device including a semiconductor chip
#4693Image sensor package with trench insulator and fabrication method thereof
#4694Light emitting device and manufacturing method thereof
#4695LED module
#4696Vertical LED chip package on TSV carrier
#4697Method of making semiconductor package with improved standoff
#4698Semiconductor device and its manufacture method
#4699Semiconductor module and portable apparatus provided with semiconductor module
#4700Method of forming thin profile WLCSP with vertical interconnect over package footprint
#4701Semiconductor device and method of forming air gap adjacent to stress sensitive region of the die
#4702LED package and method for manufacturing same
#4703LED package
#4704LED package, method for manufacturing LED package, and packing member for LED package
#4705LED package and method for manufacturing the same
#4706LED package
#4707LED PACKAGE
#4708Manufacturing method of semiconductor device
#4709Semiconductor device
#4710Packaging method involving rearrangement of dice
#4711Packaging method involving rearrangement of dice
#4712Array-molded package-on-package having redistribution lines
#4713Dual carrier for joining IC die or wafers to TSV wafers
#4714Semiconductor device
#4715SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD
#4716Method of manufacturing layered chip package
#4717Integrated circuit package-in-package system with wire-in-film encapsulant and method for manufacturing thereof
#4718Semiconductor device
#4719Wafer-level semiconductor device packages with three-dimensional fan-out and manufacturing methods thereof
#4720Method for Producing Semiconductor Chips and Corresponding Semiconductor Chip
#4721Semiconductor packages including die and L-shaped lead and method of manufacture
#4722EMI shielding package structure and method for fabricating the same
#4723Semiconductor assemblies and methods of manufacturing such assemblies including trench and channel intersects with through-hole in the mold material
#4724LED package and fabrication method thereof
#4725SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#4726Method of manufacturing semiconductor device
#47274D device process and structure
#4728MOLDING APPARATUS AND MOLDING METHOD
#4729SEMICONDUCTOR DEVICE
#4730Semiconductor package and manufacturing method thereof and encapsulating method thereof
#4731Semiconductor package with single sided substrate design and manufacturing methods thereof
#4732Small size light emitting device and manufacturing method of the same
#4733Method for Fabricating Array-Molded Package-on-Package
#4734METHOD OF PACKAGING SEMICONDUCTOR DEVICE
#4735Integrated circuit micro-module
#4736Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
#4737Semiconductor device
#4738SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
#4739Dice Rearrangement Package Structure Using Layout Process to Form a Compliant Configuration
#4740Electronic device, electronic module, and methods for manufacturing the same
#4741SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
#4742Method of manufacturing semiconductor device
#4743Method for making a chip package
#4744Semiconductor laser device, optical pickup device and semiconductor device
#4745Flip-chip fan-out wafer level package for package-on-package applications, and method of manufacture
#4746METHOD FOR MANUFACTURING A FAN-OUT EMBEDDED PANEL LEVEL PACKAGE
#4747Thermally enhanced expanded wafer level package ball grid array structure and method of making the same
#4748Stack package
#4749SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#4750Image sensor packaging structure with black encapsulant
#4751Manufacturing method of semiconductor device
#4752LED packaging method
#4753Systems employing a stacked semiconductor package
#4754Semiconductor device capable of suppressing generation of cracks in semiconductor chip during manufacturing process
#4755Lead frame land grid array with routing connector trace under unit
#4756Semiconductor component of semiconductor chip size with flip-chip-like external contacts
#4757Pre-soldered leadless package
#4758Semiconductor device and communication method
#4759Manufacturing method for semiconductor device
#4760Semiconductor package with a support structure and fabrication method thereof
#4761External storage device and method of manufacturing external storage device
#4762Light emitting device and manufacturing method therefor
#4763High-density inter-package connections for ultra-thin package-on-package structures, and processes of forming same
#4764Panel based lead frame packaging method and device
#4765DAP GROUND BOND ENHANCEMENT
#4766Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof
#4767Tie bar and mold cavity bar arrangements for multiple leadframe stack package
#4768Integrated circuit packaging system with shielded package and method of manufacture thereof
#4769MICROELECTROMECHANICAL SENSOR DEVICE PACKAGE AND METHOD FOR MAKING THE SAME
#4770Leadframe for leadless package, structure and manufacturing method using the same
#4771REBUILT WAFER ASSEMBLY
#4772Semiconductor Device and Method of Confining Conductive Bump Material with Solder Mask Patch
#4773Semiconductor device and method of manufacturing the same
#4774Leadframe for leadless package, structure and manufacturing method using the same
#4775Integrated circuit package system for electromagnetic isolation and method for manufacturing thereof
#4776SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SEMICONDUCTOR COMPONENTS
#4777Lead frame, its manufacturing method, and semiconductor light emitting device using the same
#4778Semiconductor device has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant
#4779Method for manufacturing semiconductor package system with die support pad
#4780Encapsulation method for packaging semiconductor components with external leads
#4781Process to form semiconductor packages with external leads
#4782Integrated circuit packaging system with embedded circuitry and post
#4783Semiconductor package having a stacked wafer level package and method for fabricating the same
#4784Semiconductor-device mounted board and method of manufacturing the same
#4785Semiconductor Package and Manufacturing Methods Thereof
#4786Light emitting device and method of manufacturing the same
#4787Light emitting diode package and method of manufacturing the same
#4788Thermal enhanced upper and dual heat sink exposed molded leadless package and method
#4789Semiconductor device and method of packaging a semiconductor device with a clip
#4790Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP
#4791Package structure and package process
#4792Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield
#4793LIGHT EMITTING MODULE AND MANUFACTURING METHOD THEREOF
#4794Apparatus and method for processing a substrate
#4795Stackable semiconductor device packages
#4796Light emitting device and method for manufacturing the same
#4797Camera module having lens mount with ir filter
#4798SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CONSTRUCT INSTALLED ON BASE PLATE, AND MANUFACTURING METHOD OF THE SAME
#4799Wafer and substructure for use in manufacturing electronic component packages
#4800Integrated circuit micro-module