H01L25/041 - CPC Classification Index

ClassID:

207872 ⎘

H01L25/041 - CPC Classification

Classification description:

Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups - , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group

Sub-classes:

H01L25/042 » {the devices being arranged next to each other } 155
H01L25/043 » {Stacked arrangements of devices} 192

Recent Application in this class:

20250264677

Asic Package With Photonics And Vertical Power Delivery

20240213215

Asic Package With Photonics And Vertical Power Delivery

20220139876

ASIC package with photonics and vertical power delivery

20210288190

Sensor package structure

20210080648

CMOS compatible material platform for photonic integrated circuits

20210074677

ASIC package with photonics and vertical power delivery

20180323178

Structures and methods for electrical connection of micro-devices and substrates

20180097139

Monolithically integrated photodetector and receiver

20150285702

Cavity-down pressure sensor device

20130292786

Integrated optical sensor module

20120090171

Method for manufacturing a radiation imaging panel comprising imaging tiles

20110168240

TRANSLUCENT COVER FOR SOLAR CELLS

20100255629

Method for manufacturing a radiation imaging panel comprising imaging tiles

20100218805

SUBSTRATE, AN ASSEMBLY PROCESS, AND AN ASSEMBLY APPARATUS

20090272427

Photovoltaic module and the use thereof

20050067622

Semiconductor device and method of making the same