207883 ⎘
Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups - , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group the devices being arranged next and on each other, i.e. mixed assemblies
SEMICONDUCTOR PACKAGE
#2SEMICONDUCTOR PACKAGE
#3SEMICONDUCTOR PACKAGE
#4SEMICONDUCTOR PACKAGE
#5SEMICONDUCTOR PACKAGE WITH STACKED STRUCTURE
#6PACKAGE DEVICE AND MANUFACTURING METHOD THEREOF
#7MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER
#8SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
#9SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
#10THROUGH-SILICON VIA PITCH TRANSLATION FOR STACKED MEMORY DEVICES
#11WAFER-ON-WAFER CASCODE HEMT DEVICE
#12SEMICONDUCTOR PACKAGE INCLUDING FILLET STRUCTURE
#13LOW STRESS ASYMMETRIC DUAL SIDE MODULE
#14THREE-DIMENSIONAL PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
#15LOW STRESS ASYMMETRIC DUAL SIDE MODULE
#16SEMICONDUCTOR PACKAGES
#17SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#18SLANTED DIE STACKING TO MITIGATE OVERHANG DEFLECTION
#19SEMICONDUCTOR DEVICE
#20ELECTRONIC DEVICE AND A METHOD FOR FORMING THE SAME
#21POWER SEMICONDUCTOR DEVICE INTEGRATED SELECTABLE GATE RESISTANCE
#22SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE INTERCONNECTION AND METHOD OF FORMING THE SAME
#23PACKAGED POWER ELECTRONIC DEVICE, IN PARTICULAR BRIDGE CIRCUIT COMPRISING POWER TRANSISTORS, AND ASSEMBLING PROCESS THEREOF
#24CHIP ASSEMBLY, CHIP INTERPOSER AND FABRICATING METHOD FOR CHIP ASSEMBLY
#25SUBSTRATE AND METHODS FOR PRODUCING A SUBSTRATE
#26DIE-TO-DIE DENSE PACKAGING OF DETERMINISTIC STREAMING PROCESSORS
#27BACKSIDE-ILLUMINATION SOLID-STATE IMAGE PICKUP APPARATUS, IMAGE PICKUP APPARATUS, AND ELECTRONIC EQUIPMENT INCLUDING EMBEDMENT MEMBERS
#28POWER MODULE AND METHOD FOR PRODUCING A POWER MODULE
#29SEMICONDUCTOR DEVICE
#30MONOLITHIC SEMICONDUCTOR DEVICE ASSEMBLIES
#31SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
#32Semiconductor Device and a Method for Forming a Semiconductor Device
#33PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VIAS, AND METHODS OF MAKING SAME
#34SEMICONDUCTOR PACKAGE
#35SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME
#36Semiconductor device
#37SEMICONDUCTOR MODULE
#38MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER
#39CHIP-ON-CHIP POWER CARD HAVING IMMERSION COOLING
#40SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH INTERPOSER AND OPPOSING SUBSTRATES
#41METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCAPSULANT
#42LOW STRESS ASYMMETRIC DUAL SIDE MODULE
#43SANDWICH PACKAGE FOR MICROELECTRONICS
#44Methods for Manufacturing a Semiconductor Package and a Semiconductor Module
#45POWER MODULE
#46ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY
#47Packaged power electronic device, in particular bridge circuit comprising power transistors, and assembling process thereof
#48POWER ELECTRONICS PACKAGE WITH DUAL-SINGLE SIDE COOLING WATER JACKET
#49ELECTRONIC DEVICE
#50POWER MODULE
#51LOW STRESS ASYMMETRIC DUAL SIDE MODULE
#52SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH INTERPOSER AND OPPOSING SUBSTRATES
#53SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING THE SAME
#54METHOD AND STRUCTURE OF FORMING INDEPENDENT CONTACT FOR STAGGERED CFET
#55Semiconductor device and method of making the same
#56POWER MODULE PACKAGE
#57Monolithic semiconductor device assemblies
#58Wafer-on-wafer Cascode HEMT Device
#59Semiconductor package with front side and back side redistribution structures and fabricating method thereof
#60POWER MODULE
#61EMBEDDED TRANSISTOR DEVICES
#62Pad Design For Reliability Enhancement in Packages
#63Packaged integrated circuit devices with through-body conductive vias, and methods of making same
#64Semiconductor device and method of making the same
#65SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
#66Semiconductor chip stack module and method of fabricating the same
#67Disaggregated transistor devices
#68Method of manufacturing a semiconductor apparatus having stacked devices
#69Low stress asymmetric dual side module
#70Low stress asymmetric dual side module
#71Semiconductor package structure and method for manufacturing the same
#72High power density 3D semiconductor module packaging
#73Ultra small molded module integrated with die by module-on-wafer assembly
#74Semiconductor device
#75Packaged integrated circuit devices with through-body conductive vias, and methods of making same
#76Molded interconnects in bridges for integrated-circuit packages
#77Semiconductor device and a method of manufacturing a semiconductor device
#78Semiconductor packages having a die, an encapsulant, and a redistribution structure
#79Microelectronic device with embedded die substrate on interposer
#80Pressure sintering device and method for manufacturing an electronic component
#81Power semiconductor module for improved heat dissipation and power density, and method for manufacturing the same
#82Power electronics assembly having staggered and diagonally arranged transistors
#83Microelectronic device with embedded die substrate on interposer
#84Element module
#85Semiconductor package, semiconductor module and methods for manufacturing a semiconductor package and a semiconductor module
#86Backside-illumination solid-state image pickup apparatus, image pickup apparatus, and electronic equipment including embedment members
#87Monolithic semiconductor device assemblies
#88Module
#89Semiconductor device comprising a resin case and a wiring member that is flat in the resin case
#90Semiconductor package with front side and back side redistribution structures and fabricating method thereof
#91Electronic module
#92POWER MODULE
#93ELECTRONIC MODULE
#94Semiconductor package for discharging heat generated by semiconductor chip
#95Stacked chips comprising interconnects
#96Semiconductor device and method of making the same
#97Low parasitic inductance power module and double-faced heat-dissipation low parasitic inductance power module
#98Semiconductor device with shield for electromagnetic interference
#99Semiconductor apparatus having stacked devices and method of manufacture thereof
#100Semiconductor device for downsizing and reducing resistance and inductance
#101Pad design for reliability enhancement in packages
#102Packaged power electronic device, in particular bridge circuit comprising power transistors, and assembling process thereof
#103Semiconductor device
#104Low stress asymmetric dual side module
#105Semiconductor module structure
#106Semiconductor package structure and method for manufacturing the same
#107Semiconductor package having redistribution layer
#108Three-dimensional integrated package device for high-voltage silicon carbide power module
#109Power semiconductor module with power semiconductor switches
#110Semiconductor module
#111Microelectronic assemblies
#112ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY
#113Packaged integrated circuit devices with through-body conductive vias, and methods of making same
#114ELECTRONIC MODULE
#115Conformal shielding for solder ball array
#116Semiconductor package structure having stacked die structure
#117Power semiconductor module for improved heat dissipation and power density, and method for manufacturing the same
#118Stack packages relating to bridge die
#119Semiconductor device and method of forming the semiconductor device
#120Semiconductor device
#121Electronic power module and electrical power converter incorporating same
#122Semiconductor device
#123Semiconductor module
#124Semiconductor device with shield for electromagnetic interference
#125Package structure having adhesive layer surrounded dam structure
#126Flexible shield for semiconductor devices
#127Wafer-level packaging method and package structure
#128Semiconductor device
#129Semiconductor package for discharging heat generated by semiconductor chip
#130Stacked chips comprising interconnects
#131Semiconductor package having redistribution layer
#132Semiconductor separation device
#133Structure and method to form nanosheet devices with bottom isolation
#134Microelectronic device with embedded die substrate on interposer
#135Heterogeneous miniaturization platform
#136Methods of forming semiconductor packages having a die with an encapsulant
#137Embedded power module
#138Power semiconductor module
#139Pad design for reliability enhancement in packages
#140Electronic device, method of manufacturing electronic device, and electronic apparatus
#141Semiconductor package
#142SEMICONDUCTOR DEVICE
#143Semiconductor package and fabricating method thereof
#144Heat sink for a semiconductor chip device
#145Semiconductor device and method of making the same
#146Stacked modules
#147Semiconductor package having stacked substrates with cavities
#148Semiconductor packages
#149Cooled electronics package with stacked power electronics components
#150LIGHT EMITTING APPARATUS
#151Semiconductor device
#152Semiconductor device with shield for electromagnetic interference
#153Semiconductor module
#154Electronic module
#155Semiconductor device with shield for electromagnetic interference
#156Power semiconductor chip module
#157Ultra small molded module integrated with die by module-on-wafer assembly
#158Semiconductor device including vertically integrated groups of semiconductor packages
#159Parallel plate waveguide for power semiconductor package
#160Power semiconductor package having a parallel plate waveguide
#161High power gallium nitride devices and structures
#162SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH INTERPOSER AND OPPOSING SUBSTRATES
#163Semiconductor package and fabricating method thereof
#164Semiconductor device and method of integrating power module with interposer and opposing substrates
#165Semiconductor device and method for manufacturing semiconductor device
#166High power gallium nitride devices and structures
#167Integrated Cylindrical Power Cell Module and Manufacturing Method Thereof
#168Semiconductor device and method of forming the semiconductor device
#169Semiconductor device and method of manufacture
#170Spring element for a power semiconductor module
#171Heterogeneous miniaturization platform
#172Heat sink for a semiconductor chip device
#173Electronic module assembly having low loop inductance
#174Pad design for reliability enhancement in packages
#175Power module
#176Semiconductor device having switching element suppressing potential variation
#177Semiconductor device and method of integrating power module with interposer and opposing substrates
#178Power electronics module with first and second coolers
#179Dies-on-package devices and methods therefor
#180Package on-package devices with upper RDL of WLPS and methods therefor
#181Fan out semiconductor device including a plurality of semiconductor die
#182Semiconductor device
#183Electronic power device with vertical 3D switching cell
#184Semiconductor device and method of manufacture
#185Semiconductor packages
#186Electronic part mounting heat-dissipating substrate
#187Semiconductor structure and method of fabricating the same
#188Semiconductor module and stack arrangement of semiconductor modules
#1893D semiconductor device and structure
#190Converter circuit
#191Semiconductor package and fabricating method thereof
#192Semiconductor module having stacked insulated substrate structures
#193Chip packaging module
#194Semiconductor device
#195POWER SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME
#196Semiconductor device including a connection unit and semiconductor device fabrication method of the same
#197Power module with the integration of control circuit
#198Arrangement of multiple power semiconductor chips and method of manufacturing the same
#199Semiconductor assembly having a press pack stack
#200Stacked half-bridge package
#201Electronic module and method of manufacturing the same
#202Forming a panel of triple stack semiconductor packages
#203Triple stack semiconductor package
#204Semiconductor module
#205Semiconductor device
#206POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
#207High-power electronic module and method for making such a module
#208Multi-chip silicon substrate-less chip packaging
#209Pad design for reliability enhancement in packages
#210Packaged integrated circuit devices with through-body conductive vias, and methods of making same
#211Method for fabricating embedded chips
#212Stacked semiconductor package
#213Chip to wafer package with top electrodes and method of forming
#214Module, module combined body and module production method
#215MICROWAVE SWITCH AND METHOD OF MANUFACTURING MICROWAVE SWITCH
#216Device including two power semiconductor chips and manufacturing thereof
#217Semicondutor device with through-silicon via-less deep wells
#218High density microelectronics packaging
#219Chip stack cache extension with coherency
#220Multichip device including a substrate
#221Charge damage protection on an interposer for a stacked die assembly
#222Power transistor arrangement and package having the same
#223Semiconductor package and method for routing the package
#224Semiconductor device
#225Flip-chip, face-up and face-down wirebond combination package
#226Semiconductor device and stacked semiconductor package having the same
#227Modular liquid-cooled power semiconductor module, and arrangement therewith
#228System in package and method for manufacturing the same
#229SEMICONDUCTOR PACKAGE
#230Device including two power semiconductor chips and manufacturing thereof
#231System in package process flow
#232Semiconductor device and method for manufacturing same
#233MOTOR DRIVE CIRCUIT MODULE
#234POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#235Flip-chip, face-up and face-down wirebond combination package
#236Power module, method for manufacturing power module, and molding die
#237Semiconductor device
#238Stacked half-bridge power module
#239Laminate electronic device
#240Power module package and method for manufacturing the same
#241Flip-chip, face-up and face-down wirebond combination package
#242Semiconductor module
#243T-coil network design for improved bandwidth and electrostatic discharge immunity
#244Power semiconductor package structure and manufacturing method thereof
#245Stacked half-bridge package with a common conductive leadframe
#246Semiconductor module including a switch and non-central diode
#247Power semiconductor module and method of manufacturing the same
#248Stacked-die package for battery power management
#249Press-pack module with power overlay interconnection
#250Semiconductor device with a zigzag radiator
#251T-coil network design for improved bandwidth and electrostatic discharge immunity
#252Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package
#253Laminate electronic device
#254Power semiconductor package
#255Power semiconductor module and method of manufacturing the same
#256Packaged integrated circuit devices with through-body conductive vias, and methods of making same
#257Stacked busbar assembly with integrated cooling
#258Power semiconductor device and method for its production
#259POWER SEMICONDUCTOR MODULE
#260Power semiconductor module
#261Semiconductor module including a switch and non-central diode
#262Semiconductor device
#263SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#264Direct dipping cooled power module and packaging
#265Electrical module
#266SEMICONDUCTOR COOLING STRUCTURE
#267Semiconductor device and its manufacture
#268Semiconductor unit, and power conversion system and on-vehicle electrical system using the same
#269Semiconductor module with switching components and driver electronics
#270Semiconductor device having a stacked multi structure that has layered insulated gate-type bipolar transistors
#271Stacked-die package for battery power management
#272Electronic component module
#273Packaged integrated circuit devices with through-body conductive vias, and methods of making same
#274Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package
#275Insulated gate bipolar transistor
#276Semiconductor device having plural regions and elements with varying areas depending on the region
#277POWER MODULE WITH LAMINAR INTERCONNECT
#278Power semiconductor device connected in distinct layers of plastic
#279Electric rotating machine
#280Power module
#281Power semiconductor module
#282Power semiconductor component having chip stack
#283Electric motor comprising an electronic unit with a punched grid
#284Circuit arrangement comprising having plurality of half bridges
#285Semiconductor unit, and power conversion system and on-vehicle electrical system using the same
#286Power semiconductor device comprising a semiconductor chip stack and method for producing the same
#287Semiconductor device
#288Power module, and phase leg assembly
#289Power module and electric transportation apparatus incorporating the same
#290Semiconductor component and production method suitable therefor
#291Vertical laminated electrical switch circuit
#292Double-sided chip stack assembly
#293Display device
#294Semiconductor packages including through mold ball connectors on elevated pads and methods of manufacturing the same
#295Heterogeneous miniaturization platform
#296Semiconductor package and fabricating method thereof