Image sensor and image sensor integrated type active matrix type display device

CDS capable sensor with photon sensing layer on active pixel circuit

Method of forming elevated photosensor and resulting structure

SENSOR SEMICONDUCTOR DEVICE

Optically blocked reference pixels for focal plane arrays

Large dynamic range cameras

Camera module

Integration scheme for semiconductor photodetectors on an integrated circuit chip

Semiconductor image sensor module, method for manufacturing the same as well as camera and method for manufacturing the same

Gamma ray detector modules

INDIUM FEATURES ON MULTI-CONTACT CHIPS

Semiconductor device

Pasting method and pasting apparatus

Solid state imaging device and producing method thereof

Photo-detection device

Solid image-pickup device with flexible circuit substrate

Semiconductor device and manufacturing method thereof

Pixel detector and method of manufacture and assembly thereof

Gamma ray detector modules

Image sensor device having an active layer overlying a substrate and an isolating region in the active layer

Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers

CMOS (complementary metal oxide semiconductor) type solid-state image pickup device using N/Psubstrate in which N-type semiconductor layer is laminated on Ptype substrate main body

Plasma etching of tapered structures

Deep trench contact and isolation of buried photodetectors

Apparatus for multiple camera devices and method of operating same

Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers

Method for fabricating a high performance PIN focal plane structure using three handle wafers

System for programmable gate array with sensor array

Ionising radiation detector

Two coluor photon detector

Optoelectronics processing module and method for manufacturing thereof

Image sensor having dual gate pattern and method of manufacturing the same

Pixel having two semiconductor layers, image sensor including the pixel, and image processing system including the image sensor

Radiation sensor device and method

Digital camera module for detachably mounting with flex printed circuit board

SOLID-STATE IMAGING DEVICE AND METHOD OF MANUFACTURING SAME

IMAGE SENSOR

Semiconductor device and radiation detector employing it

Photodetecting device

Light sensor receiving light from backside

Image sensor

Radioactive ray detector

Camera and method having optics and photo detectors which are adjustable with respect to each other

Three dimensional device integration method and integrated device

Methods of flip-chip image sensor package fabrication

Optoelectronic system and method for its manufacture

Backside-illuminated photodetector

Photoconductor imagers with sandwich structure

Methods for manufacturing microelectronic imagers

Method for fabricating sensor semiconductor device

Wiring substrate and radiation detector using same

Non-planar x-ray sensor

Semiconductor package and manufacturing method thereof

Methods of packaging and testing microelectronic imaging devices

Photodiode array, method for manufacturing same, and radiation detector

Image sensors for reducing flicker and methods of manufacturing the same

Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers

Semiconductor device and radiation detector employing it

Image sensor and image sensor integrated type active matrix type display device

Semiconductor device and an image sensing device

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Package of a semiconductor device with a flexible wiring substrate and method for the same

Imaging module and method for forming the same

Method of manufacturing an image sensing apparatus in which two members are bonded together

Photodetector including a plurality of photodiodes

Solid-state image pickup device, electronic apparatus using such solid-state image pickup device and method of manufacturing solid-state image pickup device

Germanium infrared sensor for CMOS imagers

Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers

Active pixel image sensors

Hybrid infrared detector array and CMOS readout integrated circuit with improved dynamic range

High-density inter-die interconnect structure

Optical sensor

Methods of fabrication for flip-chip image sensor packages

Assembly having wafer with image sensor chips, a photo-sensitive adhesive pattern and plate thereof and method of manufacturing the same

Image sensor with stacked and bonded photo detection and peripheral circuit substrates

Array optical sub-assembly

Solid state imaging device and producing method thereof

Optically blocked reference pixels for focal plane arrays

Functional device and method for producing the same

Image sensor chip package and method of fabricating the same

Solid image-pickup device and method for manufacturing the solid image pickup device

Semiconductor image sensor module, method for manufacturing the same as well as camera and method for manufacturing the same

Multicolor photodiode array and method of manufacturing

High energy, real time capable, direct radiation conversion X-ray imaging system for Cd-Te and Cd-Zn-Te based cameras

Module assembly for multiple die back-illuminated diode

Method and apparatus for producing ultra-thin semiconductor chip and method and apparatus for producing ultra-thin back-illuminated solid-state image pickup device

Apparatus for multiple camera devices and method of operating same

Apparatus for multiple camera devices and method of operating same

Photo-detection device

Through-wafer interconnects for photoimager and memory wafers

Sensor package

Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices

Integrated photoserver for CMOS imagers

Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers

Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Semiconductor module, MOS type solid-state image pickup device, camera and manufacturing method of camera

Solid-state image sensing device and method for manufacturing the same

High energy, real time capable, direct radiation conversion X-ray imaging system for Cd-Te and Cd-Zn-Te based cameras

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Method and apparatus for producing ultra-thin semiconductor chip and method and apparatus for producing ultra-thin back-illuminated solid-state image pickup device

Self-pixelating focal plane array with electronic output

Wafer-level packaged microelectronic imagers and processes for wafer-level packaging

Color light receiving device and image pickup device

Microelectronic devices and methods for packaging microelectronic devices

Chip scale image sensor and method for fabricating the same

Device for photoelectric detection and in particular of x or y radiation

Methods of fabrication for flip-chip image sensor packages

Flip-chip image sensor packages

Photoelectric conversion film-stacked type solid-state imaging device

Device with through-hole interconnection and method for manufacturing the same

Image sensor comprising isolated germanium photodetectors integrated with a silicon substrate and silicon circuitry

Silicon-on-insulator active pixel sensors

Camera module

Integrated circuit structure having a flip-chip mounted photoreceiver

Package of a semiconductor device with a flexible wiring substrate and method for the same

Image sensor and manufacturing method thereof

Solid image-pickup device and method for manufacturing the solid image pickup device

Pixelated cadmium zinc telluride based photon counting mode detector

Solid-state image sensing apparatus and method of manufacturing the same

Pixel sensor array having a layer of sensor material grown on a pre-fabricated wafer and method of manufacture thereof

Solid state imaging device and producing method thereof

Multiple chips image sensor package

Flat-panel detector utilizing electrically interconnecting tiled photosensor arrays

Method for producing ultra-thin semiconductor device

Microelectronic devices and methods for packaging microelectronic devices

Process for making contact with and housing integrated circuits

Optoelectronics processing module and method for manufacturing thereof

Solid-state image sensor including a microlens

Imaging system

Pixel sensors and methods of forming the same

Photodetector module comprising emitter and receiver

Interposer for curved detector

Image sensor having on-chip compute circuit

Sensor system based on stacked sensor layers

Image sensor module and method for forming the same

Monolithic collimator array

SPAD image sensor and associated fabricating method

Stacked image sensor with embedded FPGA and pixel cell with selectable shutter modes and in-pixel CDs

Stacked image sensor capacitors and related methods

Protective caps for small image sensor masking and mounting process

CMOS image sensor with reduced cross talk

Feedback capacitor formed by bonding-via in pixel level bond

Circuitry and method for readout of hybrid-bonded image sensors

Methods and apparatus for a CMOS image sensor with an in-pixel amplifier

System-in-package image sensor

Sensor device, image sensor array and manufacturing method of sensor device

Portable electronic device and image capturing module thereof

Stacked image sensor

Horizontal avalanche photodiode

High-speed CMOS camera

Thermo-compensated silicon photo-multiplier with on-chip thermistor

Image sensor chip scale packages and related methods

Direct read pixel alignment

Stacked integrated circuit system with thinned intermediate semiconductor die

Wafer Level optoelectronic device packages and methods for making the same

Monolithic visible-infrared focal plane array on silicon

Structure and method of integrating waveguides, photodetectors and logic devices

Integrated circuit stack with strengthened wafer bonding

Imager module with molded packaging

Curved image sensor systems and methods for manufacturing the same

Semiconductor and optoelectronic devices

Method of forming an image sensor device and method of forming the same

Reduced thickness and reduced footprint semiconductor packaging

Wide-band transparent electrical contacts and interconnects for FPAS and a method of making the same

Exposed die sensor package

Modified hybrid infrared focal plane array architecture for large scaling