208091 ⎘
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Devices controlled by radiation; Imager structures; Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof Post-treatment for the devices, e.g. annealing, impurity-gettering, shor-circuit elimination, recrystallisation
METHOD OF MANUFACTURING A SPECTROMETER DEVICE
#2METHODS OF FABRICATING NANOSCALE STRUCTURES USABLE IN MOLECULAR SENSORS AND OTHER DEVICES
#3METHOD FOR PROTECTING ACTIVE LAYERS OF ELECTRONIC CHIPS
#4IMAGE SENSING MODULE MANUFACTURING METHOD
#5IMAGE SENSOR AND METHOD OF FABRICATING THE SAME
#6BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR
#7PACKAGE WITH INTEGRATED OPTICAL DIE AND METHOD FORMING SAME
#8Bond pad structure for bonding improvement
#9PHOTOSENSITIVE IMAGING DEVICES AND ASSOCIATED METHODS
#10SIGNAL SHIELDING FOR INTEGRATED CIRCUITS
#11THIN PHOTODETECTOR DEVICE AND FABRICATION THEREOF
#12Back-Illuminated Sensor With Boron Layer Deposited Using Plasma Atomic Layer Deposition
#13VERTICAL TRANSFER GATE DOPING DISTRIBUTION FOR CHARGE TRANSFER FROM A PHOTODIODE
#14METHOD FOR REDUCING WHITE SPOTS IN IMAGE SENSOR
#15PHOTOSENSITIVE IMAGING DEVICES AND ASSOCIATED METHODS
#16METHODS FOR FABRICATING IMAGE SENSOR
#17SENSORS HAVING AN ACTIVE SURFACE
#18Image sensor device
#19PASSIVATION FOR A VERTICAL TRANSFER GATE IN A PIXEL SENSOR
#20METHOD OF MANUFACTURING PHOTO DETECTOR
#21SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#22Photoelectric conversion panel, X-ray imaging panel, and manufacturing method of photoelectric conversion panel
#23ENHANCED TRENCH ISOLATION STRUCTURE
#24MANUFACTURING METHOD OF IMAGE SENSOR PACKAGE
#25DEEP TRENCH ISOLATION STRUCTURE AND METHODS FOR FABRICATION THEREOF
#26GERMANIUM-SILICON LIGHT SENSING APPARATUS
#27Bond pad structure for bonding improvement
#28PASSIVATION FOR A DEEP TRENCH ISOLATION STRUCTURE IN A PIXEL SENSOR
#29FINGERPRINT SENSOR WITH WAFER-BONDED MICROLENS ARRAY
#30FULL WELL CAPACITY FOR IMAGE SENSOR
#31EPITAXIAL SILICON WAFER, METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
#32Geiger-Mode Avalanche Photodiode Arrays Fabricated on Silicon-on-Insulator Substrates
#33Passivation scheme for image sensor substrate
#34Method for Forming Backside Illumination CMOS Image Sensor
#35Package with integrated optical die and method forming same
#36Passivation-enhanced image sensor and surface-passivation method
#37IMAGE SENSOR BASED ON CHARGE CARRIER AVALANCHE
#38Atomic Layer-Based Surface Treatments for Infrared Detectors
#39OPTOELECTRONIC DEVICE INTEGRATED WITH MULTILAYER THIN-FILM CIRCUITRY
#40Image sensor device
#41IMAGING ELEMENT AND METHOD FOR MANUFACTURING IMAGING ELEMENT
#42IMAGE SENSOR AND METHOD OF FABRICATING THE SAME
#43IMAGE SENSOR BALL GRID ARRAY PACKAGE
#44Semiconductor device contact pad and method of contact pad fabrication
#45Camera module, and photosensitive component thereof and manufacturing method therefor
#46SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME
#47Detector array yield recovery
#48IMAGING ELEMENT PACKAGE AND METHOD OF MANUFACTURING IMAGING ELEMENT PACKAGE
#49BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR
#50Sensors having an active surface
#51APPARATUS AND METHODS FOR EFFECTIVE IMPURITY GETTERING
#52Method for forming chip package with second opening surrounding first opening having conductive structure therein
#53Semiconductor image sensor device having back side illuminated image sensors with embedded color filters
#54Methods of fabricating nanoscale structures usable in molecular sensors and other devices
#55Chip package and method for forming the same
#56Passivation scheme for image sensor substrate
#57Image sensor and manufacturing method thereof
#58Light detection substrate, manufacturing method thereof and light detection apparatus
#59Back-illuminated sensor with boron layer deposited using plasma atomic layer deposition
#60Method of manufacturing image sensing chip package structure including an adhesive loop
#61IMAGE SENSOR PACKAGE HAVING A CAVITY STRUCTURE FOR A LIGHT-TRANSMITTING MEMBER
#62Method for fabrication of NIR CMOS image sensor
#63Bond pad structure for bonding improvement
#64Enhanced trench isolation structure
#65Optoelectronic device having an array of germanium-based diodes with low dark current
#66METHOD FOR MANUFACTURING PHOTODETECTOR, AND PHOTODETECTOR
#67Apparatus and methods for effective impurity gettering
#68Photosensitive imaging devices and associated methods
#69Image sensor based on charge carrier avalanche
#70Compound semiconductor x-ray detector tiles and method of dicing thereof
#71Method for producing an imager
#72Back-side deep trench isolation structure for image sensor
#73Photoelectric conversion apparatus and manufacturing method therefor
#74Method for fabricating a throughput-scalable analytical system for molecule detection and sensing
#75Throughput-scalable analytical system using single molecule analysis sensors
#76Throughput-scalable analytical system using transmembrane pore sensors
#77Photodetector and manufacture method thereof, touch substrate and display panel
#78Full well capacity for image sensor
#79Packaging unit, component packaging structure and preparation method thereof
#80Structure and material engineering methods for optoelectronic devices signal to noise ratio enhancement
#81Method of forming image sensor device
#82Method for passivating full front-side deep trench isolation structure
#83Imaging device and method of manufacturing imaging device
#84Substrate treating apparatus and substrate transporting method
#85Molded image sensor chip scale packages and related methods
#86IMAGING PANEL AND METHOD FOR PRODUCING SAME
#87Methods of making a radiation detector
#88Semiconductor devices and methods for forming the same
#89Process for collectively curving a set of electronic chips
#90PROCESS TO IMPROVE INTERFACE STATE DENSITY Dit ON DEEP TRENCH ISOLATION (DTI) FOR CMOS IMAGE SENSOR
#91Semiconductor package structure and manufacturing method thereof
#92ARRAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
#93Method for manufacturing curved-surface detector, and curved-surface detector manufactured using the manufacturing method
#94IMAGE PICKUP APPARATUS FOR ENDOSCOPE, ENDOSCOPE, AND METHOD FOR MANUFACTURING IMAGE PICKUP APPARATUS FOR ENDOSCOPE
#95Semiconductor image sensor device having back side illuminated image sensors with embedded color filters
#96Wafer-level process for curving a set of electronic chips
#97Solid-state imaging device and solid-state imaging element
#98Image sensing chip package structure including adhesive loop
#99Method and apparatus
#100Back side illuminated image sensor with deep trench isolation structures and self-aligned color filters
#101Image sensing device and manufacturing method thereof
#102Sensors having an active surface
#103IMAGE SENSOR MODULE HAVING PROTECTIVE STRUCTURE THAT BLOCKS INCIDENT LIGHT TO ARRIVE AT BONDING WIRES AND PADS
#104Short-wave infrared detector and its integration with CMOS compatible substrates
#105Short-wave infrared detector array and fabrication methods thereof
#106Solid-state image sensor and method of manufacturing the same
#107Germanium-silicon light sensing apparatus
#108Image sensor packaging method, image sensor packaging structure, and lens module
#109Method for manufacturing an optical sensor and optical sensor
#110Imaging apparatus, method of manufacturing the same, and camera
#111Image sensor based on charge carrier avalanche
#112Method of producing semiconductor epitaxial wafer, semiconductor epitaxial wafer, and method of producing solid-state image sensor
#113Method of fabricating image sensor
#114Method for fabricating an optical device
#115Process for fabricating an array of germanium-based diodes with low dark current
#116Germanium metal-contact-free near-IR photodetector
#117Imaging device and manufacturing method thereof
#118Device comprising photodiode and method of making the same
#119Chip package with substrate having first opening surrounded by second opening and method for forming the same
#120Semiconductor image sensor device having back side illuminated image sensors with embedded color filters
#121Method of manufacturing solid-state image sensor, solid-state image sensor, and camera
#122Metal-contact-free photodetector
#123Manufacturing method of image sensing device
#124Semiconductor surface passivation
#125Semiconductor device, solid-state image sensor and camera system
#126External gettering method and device
#127IMAGE SENSORS AND FORMING METHODS OF THE SAME
#128Monolithic silicon pixel detector, and systems and methods for particle detection
#129Solid-state image sensor and method of manufacturing the same
#130Image sensor and manufacturing method therefor
#131Imaging panel and method for producing same
#132Back-side illuminated image sensor
#133Germanium-modified, back-side illuminated optical sensor
#134Low dark current backside illumination sensor
#135Photoelectric conversion device, method of manufacturing the same, and equipment
#136Image sensor device and method of forming the same
#137Image sensing device and manufacturing method thereof
#138Semiconductor device, solid-state image sensor and camera system
#139CAMERA MODULE, AND PHOTOSENSITIVE COMPONENT THEREOF AND MANUFACTURING METHOD THEREFOR
#140Semiconductor image sensor device having back side illuminated image sensors with embedded color filters
#141Photoelectric conversion device, manufacturing method thereof, and apparatus
#142Image sensor packaging method, image sensor package and lens module
#143METHOD FOR FABRICATING AN IMAGE SENSOR
#144Device comprising photodiode and method of making the same
#145X RAY FLAT PANEL DETECTOR AND FABRICATION METHOD THEREOF
#146Imaging device and method of manufacturing imaging device
#147Method of producing semiconductor epitaxial wafer, semiconductor epitaxial wafer, and method of producing solid-state image sensor
#148Method for manufacturing improved NIR CMOS sensors
#149IMAGE SENSOR MODULE HAVING PROTECTIVE STRUCTURE
#150Secondary packaging method and secondary package of through silicon via chip
#151Image pickup apparatus, endoscope and image pickup apparatus manufacturing method
#152IMAGE SENSOR AND FABRICATION METHOD THEREOF
#153Semiconductor device structure with anti-acid layer and method for forming the same
#154Metal-contact-free photodetector
#155Image sensor and method of manufacturing the same
#156Hermetic electronic-component package, in particular for an image sensor
#157Solid-state image sensor and method of manufacturing the same
#158Image sensor and method of fabricating the same
#159Germanium-silicon light sensing apparatus
#160Ray detection substrate, manufacturing method thereof and ray detection device
#161Molded image sensor chip scale packages and related methods
#162Heterogeneous integration using wafer-to-wafer stacking with die size adjustment
#163Semiconductor die and method of packaging multi-die with image sensor
#164Fingerprint identification device, mobile device using the same and method for manufacturing fingerprint identification device
#165PHOTOSENSITIVE IMAGING DEVICES AND ASSOCIATED METHODS
#166Germanium-silicon light sensing apparatus
#167IMAGE SENSOR AND MANUFACTURING METHOD THEREFOR
#168Heterogeneous integration using wafer-to-wafer stacking with die size adjustment
#169Back-side illuminated image sensor
#170Solid-state image sensor and method of manufacturing the same
#171Semiconductor device, solid-state image sensor and camera system
#172Semiconductor device and manufacturing method thereof
#173Packaging method and packaging structure
#174Back side illuminated image sensor with deep trench isolation structures and self-aligned color filters
#175High-performance radiation detectors and methods of fabricating thereof
#176Semiconductor image sensor device having back side illuminated image sensors with embedded color filters
#177Germanium-silicon light sensing apparatus
#178Germanium-silicon light sensing apparatus
#179Germanium-silicon light sensing apparatus
#180Wafer level packaging of infrared camera detectors
#181Metal oxide interface passivation for photon counting devices
#182Three-dimensional wafer scale integration of heterogeneous wafers with unequal die sizes
#183Heterogeneous integration using wafer-to-wafer stacking with die size adjustment
#184Method for making a device for detecting electromagnetic radiation comprising a layer of getter material
#185Photosensitive imaging devices and associated methods
#186Image sensing device and manufacturing method thereof
#187Image sensor and method for fabricating the same
#188Solid-state image sensor and method of manufacturing the same
#189Photodetector and methods of manufacture
#190Amorphous lead oxide based energy detection devices and methods of manufacture thereof
#191Image sensors having photodiode regions implanted from multiple sides of a substrate
#192Wafer-level back-end fabrication systems and methods
#193Semiconductor device and manufacturing method thereof
#194Chip package and manufacturing method thereof
#195Semiconductor photo-detector
#196SEMICONDUCTOR DEVICE STRUCTURE WITH ANTI-ACID LAYER AND METHOD FOR FORMING THE SAME
#197Chip package and manufacturing method thereof
#198Pixels with photodiodes formed from epitaxial silicon
#199Image sensor bending by induced substrate swelling
#200Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus
#201External gettering method and device
#202Manufacture of a CdHgTe multispectral photodiode array by cadmium diffusion
#203Method of manufacturing optical apparatus
#204Method of manufacturing a semiconductor device
#205Method of forming a stress released image sensor package structure
#206Method of producing semiconductor epitaxial wafer, semiconductor epitaxial wafer, and method of producing solid-state image sensing device
#207Microlens for a phase detection auto focus (PDAF) pixel of a composite grid structure
#208Deep trench isolation structures and methods of forming same
#209Germanium-silicon light sensing apparatus
#210Imaging device and manufacturing method thereof
#211Method of fabricating semiconductor image sensor device having back side illuminated image sensors with embedded color filters
#212Backside illumination (BSI) image sensor and manufacturing method thereof
#213Method of manufacturing image sensor including nanostructure color filter
#214Semiconductor device, solid-state image sensor and camera system
#215IMAGE SENSOR CHIP PACKAGE AND FABRICATING METHOD THEREOF
#216Method of manufacturing a plurality of island-shaped dipoles having self-aligned electrodes
#217Imaging apparatus, method of manufacturing the same, and camera
#218CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
#219Image pickup apparatus and method for manufacturing image pickup apparatus
#220Image pickup apparatus, image pickup system, and method for manufacturing image pickup apparatus
#221Method of manufacturing photoelectric conversion device
#222Fingerprint detection apparatus, mobile device using the same and manufacturing method thereof
#223Sealed-sidewall device die, and manufacturing method thereof
#224Photoelectric conversion apparatus, image pickup system, and method for manufacturing photoelectric conversion apparatus
#225Method of producing semiconductor epitaxial wafer, semiconductor epitaxial wafer, and method of producing solid-state image sensor
#226Method of manufacturing photoelectric conversion device
#227Image sensor, an inspection system and a method of inspecting an article
#228Semiconductor device
#229Image sensing device and manufacturing method thereof
#230Imaging element and imaging device
#231Bending semiconductor chip in molds having radially varying curvature
#232Free-edge semiconductor chip bending
#233Image sensor and method of manufacturing the same
#234Curved image sensor systems
#235Fabricating method of back-illuminated image sensor with dishing depression surface
#236Aerogel-encapsulated image sensor and manufacturing method for same
#237Semiconductor element having grooves which divide an electrode layer, and method of forming the grooves
#238Stress released image sensor package structure and method
#239Image sensor and method for fabricating the same
#240High-performance radiation detectors and methods of fabricating thereof
#241CHIP PACKAGE AND METHOD FOR FORMING THE SAME
#242Photosensitive module and method for forming the same
#243Method of manufacturing semiconductor device
#244Method of manufacturing semiconductor device
#245Methods of forming image sensor integrated circuit packages
#246Method of fabricating semiconductor image sensor device having back side illuminated image sensors with embedded color filters
#247Method of manufacturing semiconductor device
#248Germanium metal-contact-free near-IR photodetector
#249Wafer-level packaging method of BSI image sensors having different cutting processes
#250Method for producing image pickup apparatus and method for producing semiconductor apparatus
#251Photodiode insulation structure
#252Miniature wafer-level camera modules
#253Image sensor bending by induced substrate swelling
#254Methods of forming an image sensor
#255Backside illuminated image sensor
#256Manufacturing method of using hydrogen plasma processing on a semiconductor wafer
#257Solid-state image sensor and method of manufacturing the same
#258External gettering method and device
#259Method of manufacturing semiconductor device
#260Image sensor device with damage reduction
#261Low noise CdHgTe photodiode array
#262SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING SOLID-STATE IMAGING DEVICE
#263Solid state image sensor and method for manufacturing the same
#264METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#265Method of manufacturing semiconductor device and structure including passivation film with a trench having sections of different depths and widths
#266Imaging detector having an integrated wide bandgap layer and method of manufacturing thereof
#267Method of manufacturing solid-state image sensor, solid-state image sensor, and camera
#268Precise annealing of focal plane arrays for optical detection
#269Apparatus for and method of crystallizing active layer of thin film transistor
#270Wafer-level bonding method for camera fabrication
#271Back side illuminated image sensor with deep trench isolation structures and self-aligned color filters
#272Grid topography for patterned semiconductor coating that minimizes optical scatter and obscuration
#273Semiconductor image sensing device and manufacturing method thereof
#274CMOS image sensor with epitaxial passivation layer
#275Photodiode insulation structure
#276METHOD OF MANUFACTURING SOLID-STATE IMAGE SENSOR
#277PHOTOSENSITIVE IMAGING DEVICES AND ASSOCIATED METHODS
#278Pixel cell, image sensor, and manufacturing method
#279Image sensor and manufacturing method thereof
#280Reflowed gold nanostructures for surface enhanced raman spectroscopy
#281Device and method of gettering on silicon on insulator (SOI) substrate
#282Method for manufacturing semiconductor device
#283Manufacturing method for photoelectric conversion apparatus and photoelectric conversion apparatus
#284X-ray sensor and method of manufacturing the same
#285Method of manufacturing semiconductor device
#286Solid-state image pick-up device and manufacturing method thereof, image-pickup apparatus, semiconductor device and manufacturing method thereof, and semiconductor substrate
#287Process for enhancing image quality of backside illuminated image sensor
#288Semiconductor device
#289Hydrogen plasma cleaning of germanium oxide surfaces
#290Ultra-low resistivity contacts
#291Image sensors including hydrophobic interfaces and methods of fabricating the same
#292Fluorine Passivation in CMOS Image Sensors
#293Optical output photodetector
#294Semiconductor device having a bonding pad and shield structure and method of manufacturing the same
#295Solid-state image sensor and method of manufacturing the same
#296Method for producing amorphous oxide thin film and thin film transistor
#297Solid-state image pick-up device and manufacturing method thereof, image-pickup apparatus, semiconductor device and manufacturing method thereof, and semiconductor substrate
#298Back-illuminated image sensor with dishing depression surface
#299UV radiation recovery of image sensor
#300Method for manufacturing semiconductor device