ClassID:

208103

H01L27/14875 - CPC Classification

Classification description:

Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Devices controlled by radiation; Imager structures; Charge coupled imagers Infra-red CCD or CID imagers

Sub-classes:
Recent Application in this class:
#1
20240113146
2024-04-04

Imaging system with selective readout for visible-infrared image capture

#2
20230343887
2023-10-26

Nanophotonic hot-electron devices for infrared light detection

#3
20230146048
2023-05-11

Imaging in curved arrays: methods to produce free-formed curved detectors

#4
20230059212
2023-02-23

SOLID-STATE IMAGING DEVICE

#5
20230029519
2023-02-02

Nanophotonic hot-electron devices for infrared light detection

#6
20220293666
2022-09-15

Multi-Bandgap Charge-Coupled Device (CCD)

#7
20210139708
2021-05-13

Composition, film, near infrared cut filter, laminate, pattern forming method, solid image pickup element, image display device, infrared sensor, and color filter

#8
20210091136
2021-03-25

Imaging in curved arrays: methods to produce free-formed curved detectors

#9
20200116862
2020-04-16

Time-of-flight RGB-IR image sensor

#10
20200044111
2020-02-06

Nanophotonic hot-electron devices for infrared light detection

#11
20200013758
2020-01-09

Semiconductor device and manufacturing method thereof

#12
20190273115
2019-09-05

Sequential Integration Process

#13
20180305552
2018-10-25

Composition, film, near infrared cut filter, laminate, pattern forming method, solid image pickup element, image display device, infrared sensor, and color filter

#14
20180247965
2018-08-30

Dielectric mirror based multispectral filter array

#15
20180076260
2018-03-15

Sequential integration process

#16
20170373042
2017-12-28

Semiconductor device and manufacturing method thereof

#17
20170370769
2017-12-28

SOLID-STATE IMAGE SENSOR AND IMAGING DEVICE USING SAME

#18
20170186794
2017-06-29

Dielectric mirror based multispectral filter array

#19
20160225811
2016-08-04

NANOWIRE STRUCTURED COLOR FILTER ARRAYS AND FABRICATION METHOD OF THE SAME

#20
20160181314
2016-06-23

Physical layout and structure of RGBZ pixel cell unit for RGBZ image sensor

#21
20160050383
2016-02-18

Multiple gated pixel per readout

#22
20160025572
2016-01-28

Thermo-optical array devices and methods of processing thermo-optical array devices

#23
20150144790
2015-05-28

Video and 3D time-of-flight image sensors

#24
20150091065
2015-04-02

Pixel structures of CMOS imaging sensors and fabrication method thereof

#25
20150090883
2015-04-02

TUNABLE LASER-BASED INFRARED IMAGING SYSTEM AND METHOD OF USE THEREOF

#26
20150076355
2015-03-19

Mulitple gated pixel per readout

#27
20140027640
2014-01-30

BDI IR readout circuit using pinned photodiode as integration node

#28
20110248166
2011-10-13

Tunable laser-based infrared imaging system and method of use thereof

#29
20100065743
2010-03-18

Use of a combination of iron monoxide and spinel oxides as a sensitive material for detecting infrared radiation

#30
20060255240
2006-11-16

Back-illuminated image device having signal charges suppressing region

#31
20060212206
2006-09-21

Road surface friction sensor and road surface friction coefficient detector, and vehicle antilock braking device

#32
20060071156
2006-04-06

Infrared imaging apparatus for processing emissions in infrared and visible spectrum

#33
20050004740
2005-01-06

Road surface friction sensor and road surface friction coefficient detector, and vehicle antilock braking device