212012 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Boron [B]
STACK PACKAGE THAT PREVENTS WARPING AND CRACKING OF A WAFER AND SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THE SAME
#5402SEMICONDUCTOR DEVICE HAVING AN INTERCONNECT ELECTRICALLY CONNECTING A FRONT AND BACKSIDE THEREOF AND A METHOD OF MANUFACTURE THEREFOR
#5403Multi-chips Stacked package structure
#5404Semiconductor device and method of manufacturing the same
#5405Semiconductor device with flip-chip connection that uses gallium or indium as bonding material
#5406ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
#5407Semiconductor device, a method of manufacturing the same and an electronic device
#5408Forming a semiconductor package including a thermal interface material
#5409LOW TEMPERATURE THERMAL INTERFACE MATERIALS
#5410Semiconductor device having metal cap divided by slit
#5411Semiconductor device including semiconductor chips having contact elements
#5412CHIP STACKED STRUCTURE AND METHOD OF FABRICATING THE SAME
#5413Stackable package by using internal stacking modules
#5414Plastic-Encapsulated Semiconductor Device with an Exposed Radiator at the Top and Manufacture Thereof
#5415Semiconductor device
#5416Semiconductor device and method for manufacturing the same
#5417Packaged device and method of manufacturing the same
#5418Semiconductor device
#5419SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD
#5420Using a simultaneously tilting and moving bonding apparatus
#5421Micro-ball loading device and loading method
#5422Conformal shielding process using flush structures
#5423CONFORMAL SHIELDING EMPLOYING SEGMENT BUILDUP
#5424Heat sink formed with conformal shield
#5425Method of machining substrate
#5426METHOD FOR MAKING AN INTERCONNECT STRUCTURE AND INTERCONNECT COMPONENT RECOVERY PROCESS
#5427Formation of alpha particle shields in chip packaging
#5428Stack circuit member and method
#5429Manufacturing Method of Semiconductor Integrated Circuit Device
#5430Semiconductor apparatus and method for manufacturing the same
#5431Manufacturing method for semiconductor integrated device
#5432RECOVERABLE ELECTRONIC COMPONENT
#5433LOW-TEMPERATURE RECOVERABLE ELECTRONIC COMPONENT
#5434Demountable interconnect structure
#54353D electronic module
#5436Semiconductor memory device and semiconductor memory card using the same
#5437Apparatus for non-conductively interconnecting integrated circuits
#5438Quad flat non-leaded chip package
#5439Semiconductor device including a stress buffer
#5440Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
#5441Self-aligned wafer or chip structure, and self-aligned stacked structure
#5442Substrate bonding method and semiconductor device
#5443Structure and manufactruing method of chip scale package
#5444Semiconductor device
#5445Metal pad formation method and metal pad structure using the same
#5446CHIP PACKAGE
#5447Semiconductor device and manufacturing method thereof
#5448Electronic device manufacturing method and electronic device
#5449Package Structure with Flat Bumps for Integrate Circuit or Discrete Device and Method of Manufacture the Same
#5450Substrate including barrier solder bumps to control underfill transgression and microelectronic package including same
#5451Direct edge connection for multi-chip integrated circuits
#5452THREE-DIMENSIONAL CIRCUITRY FORMED ON INTEGRATED CIRCUIT DEVICE USING TWO-DIMENSIONAL FABRICATION
#5453Power Semiconductor Module And Method of Manufacturing the Power Semiconductor Module
#5454Bumpless flip-chip assembly with a complaint interposer contractor
#5455Array molded package-on-package having redistribution lines
#5456Semiconductor device with surface mounting terminals
#5457Method of making demountable interconnect structure
#5458Parallel chip embedded printed circuit board and manufacturing method thereof
#5459METHOD FOR MAKING AN INTERCONNECT STRUCTURE AND LOW-TEMPERATURE INTERCONNECT COMPONENT RECOVERY PROCESS
#5460Power composite integrated semiconductor device and manufacturing method thereof
#5461Method For Assembling Substrates By Depositing An Oxide Or Nitride Thin Bonding Layer
#5462Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
#5463Methods relating to the reconstruction of semiconductor wafers for wafer level processing including forming of alignment protrusion and removal of alignment material
#5464Apparatus for Producing Ic Chip Package
#5465Connected body and optical transceiver module
#5466Fabricated adhesive microstructures for making an electrical connection
#5467Die offset die to die bonding
#5468Under bump metallurgy structure and wafer structure using the same and method of manufacturing wafer structure
#5469SEMICONDUCTOR PACKAGE STRUCTURES
#5470Electronic structures including barrier layers defining lips
#5471Semiconductor device mounting structure, manufacturing method, and removal method of semiconductor device
#5472Semiconductor device, chip package and method of fabricating the same
#5473METHOD FOR PACKAGING SEMICONDUCTORS AT A WAFER LEVEL
#5474Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package
#5475Embedded chip package
#5476Chip package
#5477CHIP PACKAGE
#5478CHIP PACKAGE
#5479Photoelectric conversion element having a semiconductor and semiconductor device using the same
#5480Semiconductor device
#5481Camera module with window mechanical attachment
#5482BOND HEAD FOR A WIRE BONDER
#5483Implementation structure of semiconductor package
#5484Ubm Pad, Solder Contact and Methods for Creating a Solder Joint
#5485Electronic component and manufacturing method thereof
#5486Method of fabricating a semiconductor device
#5487Bonding structure with buffer layer and method of forming the same
#5488Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#5489Method of manufacturing a semiconductor device
#5490Bonding semiconductor wafer stuck on dicing tape laminated adhesive sheet onto mounting support
#5491SEMICONDUCTOR PACKAGE AND METHOD FOR DISCHARGING ELECTRONIC DEVICES ON A SUBSTRATE
#5492Patterned die attach and packaging method using the same
#5493Electronic circuit package
#5494METHOD FOR STACKING SEMICONDUCTOR CHIPS AND SEMICONDUCTOR CHIP STACK PRODUCED BY THE METHOD
#5495Circuit arrangement and integrated circuit
#5496Through silicon via dies and packages
#5497SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#5498SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE PRODUCT
#5499Contact pad and method of forming a contact pad for an integrated circuit
#5500Electronic Component
#5501HIGH-FREQUENCY CIRCUIT DEVICE AND RADAR
#5502Structure, method and system for assessing bonding of electrodes in FCB packaging
#5503Semiconductor device and method for manufacturing same
#5504Microelectronic packages having cavities for receiving microelectric elements
#5505Electrically interconnected stacked die assemblies
#5506Device configuration and method to manufacture trench MOSFET with solderable front metal
#5507Semiconductor subassemblies with interconnects and methods for manufacturing the same
#5508Concave face wire bond capillary and method
#5509Wiring method and device
#5510Conductive ball arraying apparatus
#5511Printed wiring board and a method of manufacturing a printed wiring board
#5512Fill head for injection molding of solder
#5513Dial module and process for manufacturing the same, LED display element, display module, movement module, connector module and meter employing the same
#5514Circuit device and manufacturing method therefor
#5515Thermal paste containment for semiconductor modules
#5516Chip scale package having flip chip interconnect on die paddle
#5517Integrated circuit die with logically equivalent bonding pads
#5518One piece method for integrated circuit (IC) assembly
#5519Dial module and process for manufacturing the same, LED display element, display module, movement module, connector module and meter employing the same
#5520Current sensor
#5521Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device
#5522Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier
#5523REDUCED-DIMENSION MICROELECTRONIC COMPONENT ASSEMBLIES WITH WIRE BONDS AND METHODS OF MAKING SAME
#5524MEMORY DEVICES INCLUDING SEPARATING INSULATING STRUCTURES ON WIRES AND METHODS OF FORMING
#5525SEMICONDUCTOR DEVICE
#5526Arrangement including a semiconductor device and a connecting element
#5527Semicondutor device
#5528Silicon carbide power devices including P-type epitaxial layers and direct ohmic contacts
#5529Semiconductor element and method of manufacturing the same
#5530Semiconductor device
#5531Cylindrical bonding structure and method of manufacture
#5532Semiconductor apparatus having a first and a second projection portion on opposite surfaces of a semiconductor wafer and method for manufacturing the same
#5533Lead frame and manufacturing method thereof, and semiconductor apparatus and manufacturing method thereof
#5534SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR CHIP AND ANTENNA
#5535Packages and assemblies including lidded chips
#5536Metal interconnect System and Method for Direct Die Attachment
#5537Semiconductor chip mounting board with multiple ports
#5538Manufacture of a layer including a component
#5539Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment
#5540Method of manufacturing chip integrated substrate
#5541Semiconductor device and manufacturing method of the same
#5542Reactive solder material
#5543Method of bonding aluminum electrodes of two semiconductor substrates
#5544Method for mounting anisotropically-shaped members
#5545Method of fabricating a semiconductor device package
#5546Semiconductor device with integrated coils
#5547Semiconductor device and process for fabrication thereof
#5548SEMICONDUCTOR DEVICE WITH BONDING PAD SUPPORT STRUCTURE
#5549SEMICONDUCTOR PACKAGE HAVING MOLDED BALLS AND METHOD OF MANUFACTURING THE SAME
#5550Semiconductor device and fabrication method thereof
#5551Chip Assembly and Method of Manufacturing Thereof
#5552Compliant thermal contactor
#5553Semiconductor packages with enhanced joint reliability and methods of fabricating the same
#5554Semiconductor device and a method of manufacturing the same
#5555LEAD FRAME FOR SEMICONDUCTOR DEVICE
#5556SEMICONDUCTOR DEVICE, LEADFRAME AND STRUCTURE FOR MOUNTING SEMICONDUCTOR DEVICE
#5557LEAD-FRAME ARRAY PACKAGE STRUCTURE AND METHOD
#5558Semiconductor integrated circuit with solder bump
#5559Solderable top metal for silicon carbide semiconductor devices
#5560Semiconductor device and a method of manufacturing the same
#5561METHOD FOR FABRICATING METAL PAD
#5562Downhill Wire Bonding for QFN L - Lead
#5563Method for manufacturing semiconductor package
#5564Semiconductor device packaged into chip size and manufacturing method thereof
#5565Method of manufacturing a semiconductor device
#5566Method of making integrated circuit package with transparent encapsulant
#5567Dicing tape laminated with adhesive sheet of polymer, epoxy resin and filler
#5568Packaging Substrate with Flat Bumps for Electronic Devices and Method of Manufacturing the Same
#5569Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability
#5570Flip chip mounting method and bump forming method
#5571Semiconductor device and method of manufacturing same
#5572Semiconductor device including covering a semiconductor with a molding compound and forming a through hole in the molding compound
#5573Semiconductor device with multilayered metal pattern
#5574SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING BOAC/COA
#5575Semiconductor package with under bump metallization aligned with open vias
#5576Method for manufacturing semiconductor device, and semiconductor device
#5577Semiconductor module manufacturing method, semiconductor module, and mobile device
#5578Dimple free gold bump for drive IC
#5579Semiconductor device
#5580Methods of assembling integrated circuit packages
#5581Compact multi-port CAM cell implemented in 3D vertical integration
#5582Chip-On-Lead and Lead-On-Chip Stacked Structure
#5583Semiconductor Package Having Reduced Thickness
#5584Semiconductor Device and Its Fabrication Method
#5585Semiconductor device
#5586Composite ceramic substrate
#5587METHODS FOR FORMING PACKAGE STRUCTURES
#5588CONVEX DIE ATTACHMENT METHOD
#5589Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel
#5590RF-coupled digital isolator
#5591RF-coupled digital isolator
#5592Device comprising an element with electrodes coupled to connections
#5593Semiconductor device
#5594Semiconductor device with improved resin configuration
#5595Semiconductor device and a method of manufacturing the same
#5596Package structure for integrated circuit device
#5597Semiconductor chip and manufacturing method thereof
#5598Flash memory card
#5599Multi-die molded substrate integrated circuit device
#5600Substrate and multilayer circuit board
#5601POWER SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, LEAD FRAME MEMBER, AND METHOD OF MAKING POWER SEMICONDUCTOR DEVICE
#5602Package integrated soft magnetic film for improvement in on-chip inductor performance
#5603Semiconductor device, semiconductor wafer structure and method for manufacturing the semiconductor wafer structure
#5604Semiconductor device for high frequency
#5605LIGHT-EMITTING DIODE ASSEMBLY WITHOUT SOLDER
#5606Electronic device manufacturing method and supporter
#5607Methods of forming a semiconductor device including a diffusion barrier film
#5608Structure and method for enhancing resistance to fracture of bonding pads
#5609Semiconductor package having through-hole via on saw streets formed with partial saw
#5610Semiconductor device package with multi-chips and method of the same
#5611Manufacturing method of semiconductor device
#5612Semiconductor device and method of fabricating the same, circuit board, and electronic instrument
#5613Method of assembling electronic components of an electronic system, and system thus obtained
#5614Memory card and method for fabricating the same
#5615Package-in-package using through-hole via die on saw streets
#5616Packaging board, rewiring, roughened conductor for semiconductor module of a portable device, and manufacturing method therefor
#5617Semiconductor device and method for manufacturing semiconductor device
#5618Package substrate and its solder pad
#5619SYSTEM FOR IMPLEMENTING HARD-METAL WIRE BONDS
#5620Package-on-package using through-hole via die on saw streets
#5621Through-hole via on saw streets
#5622Semiconductor packaging device comprising a semiconductor chip including a MOSFET
#5623Semiconductor die with through-hole via on saw streets and through-hole via in active area of die
#5624Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer
#5625Extended redistribution layers bumped wafer
#5626Vacuum wire tensioner for wire bonder
#5627WEDGE-BONDING OF WIRES IN ELECTRONIC DEVICE MANUFACTURE WITH REVERSIBLE WEDGE BONDING
#5628Temperature control of a bonding stage
#5629METHOD, SYSTEM, AND APPARATUS FOR TRANSFER OF DIES USING A DIE PLATE
#5630Substrate with feedthrough and method for producing the same
#5631SEMICONDUCTOR CHIP PACKAGE AND METHOD OF FABRICATING THE SAME
#5632Manufacturing method of a semiconductor device
#5633SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#5634METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
#5635Chip package
#5636Fabricating process of a chip package structure
#5637Adhesive composition and a method of using the same
#5638Bidirectional multiplexed RF isolator
#5639Pressure-contact power semiconductor module and method for producing the same
#5640METHOD AND APPARATUS FOR HEAT DISSIPATION
#5641Method transparent member, optical device using transparent member and method of manufacturing optical device
#5642Marks for the Alignment of Wafer-Level Underfilled Silicon Chips and Method to Produce Same
#5643Semiconductor device and method of manufacturing the same
#5644Semiconductor device with a semiconductor chip and electrical connecting elements to a conductor structure
#5645Die bonding agent and a semiconductor device made by using the same
#5646Package equipped with semiconductor chip and method for producing same
#5647Semiconductor device
#5648Semiconductor device
#5649Highly reliable low cost structure for wafer-level ball grid array packaging
#5650Integrated chip package structure using organic substrate and method of manufacturing the same
#5651Semiconductor device and method of fabricating the semiconductor device
#5652WAFER LEVEL PACKAGE AND FABRICATING METHOD THEREOF
#5653Semiconductor device and method for manufacturing the same
#5654Semiconductor device
#5655Semiconductor layer structure and method of making the same
#5656Semiconductor device and method for producing the same
#5657Semiconductor device
#5658Semiconductor device
#5659Electronic flame-off electrode with ball-shaped tip
#5660Selective etch of TiW for capture pad formation
#5661Method for manufacturing printed circuit board having embedded component
#5662METHOD FOR FORMING BUMPS ON UNDER BUMP METALLURGY
#5663Semiconductor layer structure and method of making the same
#5664Method for manufacturing an electronics module comprising a component electrically connected to a conductor-pattern layer
#5665Semiconductor device and manufacturing method thereof
#5666Adhesive Sheet and Method for Manufacturing the Same, Semiconductor Device Manufacturing Method and Semiconductor Device
#5667Sheet to Form a Protective Shield for Chips
#5668Apparatus for detecting press-bonded ball at bonding portion in bonding apparatus and method for detecting press-bonded ball at bonding portion
#5669Connecting microsized devices using ablative films
#5670Semiconductor device
#5671Integration type semiconductor device and method for manufacturing the same
#5672Semiconductor Device and Method for Fabricating the Same
#5673Low fabrication cost, fine pitch and high reliability solder bump
#5674Semiconductor device and manufacturing method of the same
#5675Wiring board manufacturing method, semiconductor device manufacturing method and wiring board
#5676Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related device
#5677SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
#5678Leadframe for leadless package, structure and manufacturing method using the same
#5679Partially patterned lead frames and methods of making and using the same in semiconductor packaging
#5680Semiconductor device comprising a semiconductor chip stack and method for producing the same
#5681Non-leaded semiconductor package and a method to assemble the same
#5682Semiconductor package and method
#5683Package Structure With Flat Bumps For Electronic Device and Method of Manufacture the Same
#5684Semiconductor device with improved pads
#5685Semiconductor device and method for manufacturing the same
#5686Semiconductor device with power noise suppression
#5687Semiconductor device
#5688Integrated circuits and interconnect structure for integrated circuits
#5689Integrated circuits and interconnect structure for integrated circuits
#5690Wiring board manufacturing method
#5691Spring interconnect structures
#5692Semiconductor device and a method of manufacturing the same
#5693Semiconductor device and process for manufacturing the same
#5694Manufacturing method of a tray, a socket for inspection, and a semiconductor device
#5695ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME
#5696Chip package structure
#5697Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus using semiconductor apparatus, and wire substrate for semiconductor apparatus
#5698Semiconductor device
#5699Flip chip with interposer, and methods of making same
#5700Semiconductor device and manufacturing method thereof