212012 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Boron [B]
Dual-leadframe multi-chip package and method of manufacture
#2102Integrated circuit packages
#2103Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#2104Semiconductor device and lead frame
#2105SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#2106Micro-fluidic injection molded solder (IMS)
#2107Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide
#2108Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel
#2109Apparatus for mounting semiconductor device
#2110Methods and apparatus for measuring analytes using large scale FET arrays
#2111Semiconductor device, manufacturing method of semiconductor device, and RFID tag
#2112Method of providing an electronic device including dies, a dielectric layer, and an encapsulating layer
#2113Fabrication method for integrated circuit chip component, multi-chip module, and their integration structure
#2114Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making the same
#2115Method for disposing a component
#2116Coupling heat sink to integrated circuit chip with thermal interface material
#2117MULTI-FUNCTION CARD DEVICE
#2118Packaged electronic device having metal comprising self-healing die attach material
#2119FILLING COMPOSITION, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE
#2120Embedded die with protective interposer
#2121Enhanced WLP for superior temp cycling, drop test and high current applications
#2122Under-Bump Metallization Structure for Semiconductor Devices
#2123Wiring board and method of manufacturing the same, and semiconductor device and method of manufacturing the same
#2124Structure for multi-row lead frame and semiconductor package capable of minimizing an under-cut
#2125SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
#2126Vertical MOSFET with through-body via for gate
#2127Power MOS transistor device and switch apparatus comprising the same
#2128Light emitting diode and method of fabricating the same
#2129Bonding method, bonding apparatus, and manufacturing method of semiconductor device using the same
#2130Die stacking with an annular via having a recessed socket
#2131Electronic component package and method for producing electronic component package
#2132Conformal shielding employing segment buildup
#2133Silicon nitride passivation layer for covering high aspect ratio features
#2134Electronic component manufacturing method
#2135Method of fabricating a capillary-flow underfill compositions
#2136Fabrication method for resin-encapsulated semiconductor device
#2137Semiconductor device and manufacturing method of the same
#2138Semiconductor device and automotive ac generator
#2139Pin-type chip tooling
#2140Distributed semiconductor device methods, apparatus, and systems
#2141Electronic assembly with detachable components
#2142Method of sensing magnitude of current through semiconductor power device
#2143Semiconductor device
#2144Method of manufacturing electronic device and electronic device
#2145Layered chip package with wiring on the side surfaces
#2146ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
#2147Semiconductor device having a semiconductor element buried in an insulating layer and method of manufacturing the same
#2148METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE
#2149Process for fabricating electronic components using liquid injection molding
#2150Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces
#2151Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die
#2152PRE-PROCESSING TO REDUCE WAFER LEVEL WARPAGE
#2153Leadframe based multi terminal IC package
#2154Electronic device, relay member, and mounting substrate, and method for manufacturing the electronic device
#2155High power semiconductor device for wireless applications and method of forming a high power semiconductor device
#2156Semiconductor packaging and fabrication method using connecting plate for internal connection
#2157Integrated circuit package for semiconductior devices with improved electric resistance and inductance
#2158Method of manufacturing electronic apparatus, electronic component-mounting board, and method of manufacturing the same
#2159Ferroelectric component and manufacturing the same
#2160Method for metalizing blind vias
#2161METHOD FOR SIMULTANEOUSLY FORMING A MECHANICAL AND ELECTRICAL CONNECTION BETWEEN TWO PARTS
#2162CONNECTING PAD PRODUCING METHOD
#2163Semiconductor device
#2164Method for fabricating circuit component
#2165Multi-surface IC packaging structures
#2166Through Silicon via Bridge Interconnect
#2167METHOD FOR FORMING A DOUBLE EMBOSSING STRUCTURE
#2168Bump-on-lead flip chip interconnection
#2169Semiconductor device capable of switching operation mode and operation mode setting method therefor
#2170METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
#2171Semiconductor device with copper wirebond sites and methods of making same
#2172Processing method for package substrate
#2173Rigid-backed, membrane-based chip tooling
#2174Assembled multi-component electronic apparatus using alignment and reference marks
#2175Carbon nanotubes for the selective transfer of heat from electronics
#2176Die bond film, dicing die bond film, and semiconductor device
#2177Semiconductor device with hollow structure
#2178Thermal vias in an integrated circuit package with an embedded die
#2179Semiconductor chip and film and TAB package comprising the chip and film
#2180SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#2181Method for placing a component onto a target platform by an apparatus using a probe
#2182SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
#2183Method for manufacturing a semiconductor structure
#2184Formation method of metallic electrode of semiconductor device and metallic electrode formation apparatus
#2185Integrated chip package structure using organic substrate and method of manufacturing the same
#2186Electronic component
#2187Wireless communication system
#2188Circuit component with conductive layer structure
#2189IC die including RDL capture pads with notch having bonding connectors or its UBM pad over the notch
#2190Device including an encapsulated semiconductor chip and manufacturing method thereof
#2191Wirebondless wafer level package with plated bumps and interconnects
#2192Chip structure
#2193Semiconductor device and method of forming IPD in fan-out level chip scale package
#2194Thermal interface material design for enhanced thermal performance and improved package structural integrity
#2195Method of manufacturing a semiconductor device
#2196Device having wire bond and redistribution layer
#2197Semiconductor device
#2198Low temperature bonding material comprising coated metal nanoparticles, and bonding method
#2199Printed wiring board and method for manufacturing same
#2200Method for mounting a component
#2201Method for integrating an electronic component into a printed circuit board
#2202System for semiconductor device, method for manufacturing semiconductor device, semiconductor device and method for bonding substrates
#2203Flip chip mounting method and bump forming method
#2204Direct IMS (injection molded solder) without a mask for forming solder bumps on substrates
#2205Method of making a semiconductor device having a conductive particle on an electric pad
#2206Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive trace
#2207Manufacturing method of semiconductor device
#2208Stress-reduced Ni-P/Pd stacks for bondable wafer surfaces
#2209Semiconductor device with a selection circuit selecting a specific pad
#2210Semiconductor package
#2211Wiring board and liquid crystal display device
#2212RFID integrated circuit with integrated antenna structure
#2213PANELIZED PACKAGING WITH TRANSFERRED DIELECTRIC
#2214Solder alloy and semiconductor device
#2215Lead frame ball grid array with traces under die
#2216Semiconductor chip, electrode structure therefor and method for forming same
#2217Method of fabricating a conductive post on an electrode
#2218Conductive pillar structure for semiconductor substrate and method of manufacture
#2219Wafer-level packaged device having self-assembled resilient leads
#2220Method of manufacturing a semiconductor device with a carrier having a cavity and semiconductor device
#2221Semiconductor device and electronic device
#2222Semiconductor storage device and manufacturing method thereof
#2223Assembly of a microelectronic chip having a groove with a wire element in the form of a strand, and method for assembly
#2224Semiconductor device and method of patterning resin insulation layer on substrate of the same
#2225Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace
#2226Nitride semiconductor element and method for production thereof
#2227ADHESIVE BONDING METHOD
#2228Solder bump structure for flip chip semiconductor devices and method of manufacturing therefore
#2229Semiconductor device and a method of manufacturing the same
#2230Rule-based semiconductor die stacking and bonding within a multi-die package
#2231Polymer matrices for polymer solder hybrid materials
#2232ADHESIVE FILM AND PROCESS FOR PREPARING THE SAME AS WELL AS ADHESIVE SHEET AND SEMICONDUCTOR DEVICE
#2233Electronic device package and method for fabricating the same
#2234SEMICONDUCTOR DEVICE, CHIP-ON-CHIP MOUNTING STRUCTURE, METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE CHIP-ON-CHIP MOUNTING STRUCTURE
#2235Semiconductor module, method for fabricating the semiconductor module, and mobile apparatus
#2236Pillar structure having a non-planar surface for semiconductor devices
#2237Semiconductor device and semiconductor assembly with lead-free solder
#2238Solder interconnect with non-wettable sidewall pillars and methods of manufacture
#2239Manufacturing of a device including a semiconductor chip
#2240LEAD FRAME FOR SEMICONDUCTOR DIE
#2241Semiconductor device and method of manufacturing the same
#2242Micro-fluidic injection molded solder (IMS)
#2243Semiconductor device
#2244Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device
#2245Power semiconductor device
#2246Integrated circuits having TSVs including metal gettering dielectric liners
#2247Semiconductor module and portable apparatus provided with semiconductor module
#2248Protruding TSV tips for enhanced heat dissipation for IC devices
#2249Method of manufacturing a semiconductor device
#2250Semiconductor device and method of manufacturing the same
#2251LED package and method for manufacturing same
#2252LED package, method for manufacturing LED package, and packing member for LED package
#2253LED assembly with a protective frame
#2254LED PACKAGE
#2255RFID tags and processes for producing RFID tags
#2256Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, and light-emitting device
#2257Semiconductor device and a method of manufacturing the same
#2258Electronic device and manufacturing method of the same
#2259Integrated semiconductor substrate structure using incompatible processes
#2260Semiconductor device
#2261Array-molded package-on-package having redistribution lines
#2262Dual carrier for joining IC die or wafers to TSV wafers
#2263Interconnection structure and its design method
#2264Semiconductor device having a chip bonding using a resin adhesive film and method of manufacturing the same
#2265Semiconductor device
#2266SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD
#2267Method of manufacturing layered chip package
#2268Etched recess package on package system
#2269Co-axial restraint for connectors within flip-chip packages
#2270Integrated circuit package-in-package system with wire-in-film encapsulant and method for manufacturing thereof
#2271Method of stacking flip-chip on wire-bonded chip
#2272Semiconductor device
#2273Packaged semiconductor product and method for manufacture thereof
#2274Encapsulation, MEMS and encapsulation method
#2275Semiconductor device and a method of manufacturing the same
#2276Power semiconductor devices integrated with clamp diodes having separated gate metal pads to avoid breakdown voltage degradation
#2277Enhanced magnetic self-assembly using integrated micromagnets
#2278Polishing solution for CMP, and method for polishing substrate using the polishing solution for CMP
#2279PACKAGING BOARD AND MANUFACTURING METHOD THEREFOR, SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR, AND PORTABLE DEVICE
#2280Semiconductor device
#2281Wafer-level semiconductor device packages with three-dimensional fan-out and manufacturing methods thereof
#2282Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
#2283Multilayer printed circuit board
#2284Semiconductor device and manufacturing method thereof
#2285Method for Producing Semiconductor Chips and Corresponding Semiconductor Chip
#2286Semiconductor device, flip-chip mounting method and flip-chip mounting apparatus
#2287Semiconductor integrated circuit
#2288Bonded structure and manufacturing method for bonded structure
#2289Stacked semiconductor components having conductive interconnects
#2290Semiconductor device having conductive pads and a method of manufacturing the same
#2291PACKAGE ASSEMBLY HAVING A SEMICONDUCTOR SUBSTRATE
#2292Integrated void fill for through silicon via
#2293Semiconductor assemblies and methods of manufacturing such assemblies including trench and channel intersects with through-hole in the mold material
#2294Method of teaching eyepoints for wire bonding and related semiconductor processing operations
#2295ELEMENT MOUNTING BOARD, SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, METHOD FOR FABRICATING THE ELEMENT MOUNTING BOARD, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
#2296Method and system for drug delivery to the eye
#2297SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#2298Semiconductor device manufacturing method
#2299Method of manufacturing semiconductor device
#2300IC chip, antenna, and manufacturing method of the IC chip and the antenna
#23014D device process and structure
#2302System and Method To Embed A Wireless Communication Device Into Semiconductor Packages
#2303System and method for integrated inductor
#2304Dual Interconnection in Stacked Memory and Controller Module
#2305Grid array connection device and method
#2306Semiconductor device sealed in a resin section and method for manufacturing the same
#2307Wiring substrate, manufacturing method thereof, and semiconductor package
#2308Attaching passive components to a semiconductor package
#2309Semiconductor device
#2310REAL TIME MONITORING OF INDIUM BUMP REFLOW AND OXIDE REMOVAL ENABLING OPTIMIZATION OF INDIUM BUMP MORPHOLOGY
#2311Microelectronic devices
#2312Semiconductor package with single sided substrate design and manufacturing methods thereof
#2313Contactless communication medium
#2314Manufacturing method of lead frame substrate and semiconductor apparatus
#2315Die package including multiple dies and lead orientation
#2316Method for establishing and closing a trench of a semiconductor component
#2317Wireless Communication Device for Remote Authenticity Verification of Semiconductor Chips, Multi-Chip Modules and Derivative Products
#2318Semiconductor device including a DC-DC converter having a metal plate
#2319Power semiconductor devices integrated with clamp diodes having separated gate metal pads to avoid breakdown voltage degradation
#2320System and Method To Embed A Wireless Communication Device Into Semiconductor Packages, including Chip-Scale Packages and 3D Semiconductor Packages
#2321System and Method To Embed A Wireless Communication Device Into Semiconductor Packages
#2322Wireless Communication Device for Remote Authenticity Verification of Semiconductor Chips, Multi-Chip Modules and Derivative Products
#2323Nanotube modified solder thermal intermediate structure, systems, and methods
#2324Plating method, semiconductor device fabrication method and circuit board fabrication method
#2325Bond pad connection to redistribution lines having tapered profiles
#2326Method of manufacturing semiconductor device
#2327METHOD OF PACKAGING SEMICONDUCTOR DEVICE
#2328Apparatus and method for predetermined component placement to a target platform
#2329ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
#2330Integrated circuit micro-module
#2331Electroless plating of porous and non-porous nickel layers, and gold layer in semiconductor device
#2332Semiconductor device having elastic solder bump to prevent disconnection
#2333Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
#2334Semiconductor device
#2335SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
#2336Wiring board, semiconductor device and method for manufacturing the same
#2337Lead frame substrate and method of manufacturing the same, and semiconductor device
#2338Lead frame substrate, manufacturing method thereof, and semiconductor apparatus
#2339Leadframe Structure, Advanced Quad Flat No Lead Package Structure Using the Same, and Manufacturing Methods Thereof
#2340Dice Rearrangement Package Structure Using Layout Process to Form a Compliant Configuration
#2341Method for stacking serially-connected integrated circuits and multi-chip device made from same
#2342Semiconductor device and method of manufacturing the same
#2343Flip-chip mounting method and bump formation method
#2344Adhesive composition for a semiconductor device, adhesive film, and dicing die-bonding film
#2345Acrylic insulating adhesive
#2346Method of manufacturing semiconductor device
#2347Method for making a stackable package
#2348PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE FILM ADHESIVE, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT
#2349Semiconductor device and method of manufacturing the same, and electronic apparatus
#2350Inductive relayed coupling circuit between substrates
#2351Dicing tape-integrated film for semiconductor back surface
#2352Semiconductor module
#2353Semiconductor Process, Semiconductor Element and Package Having Semiconductor Element
#2354Semiconductor element and package having semiconductor element
#2355INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING SAME
#2356Electromigration-resistant under-bump metallization of nickel-iron alloys for Sn-rich solder bumps in Pb-free flip-clip
#2357CARBON NANOTUBE-BASED FILLER FOR INTEGRATED CIRCUITS
#2358Semiconductor device and method for manufacturing the same
#2359Semiconductor package and method of manufacturing the same
#2360METHOD FOR MANUFACTURING A FAN-OUT EMBEDDED PANEL LEVEL PACKAGE
#2361Semiconductor package having chip using copper process
#2362Fan-out chip scale package
#2363Stack package
#2364Semiconductor memory device, semiconductor package and system having stack-structured semiconductor chips
#2365Semiconductor device package having a semiconductor chip on wiring board connected to plurality of leads including power MOSFETs
#2366SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#2367Circular shield of a circuit-substrate laminated module and electronic apparatus
#2368Integrated circuit device and electronic instrument
#2369ELECTRICAL MODULE
#2370Manufacturing method for composite substrate
#2371Bonding apparatus
#2372Wiring board capable of containing functional element and method for manufacturing same
#2373Circuit board and its wire bonding structure
#2374Manufacturing method of semiconductor device
#2375Heat-resistant adhesive sheet for substrateless semiconductor package fabrication and method for fabricating substrateless semiconductor package using the adhesive sheet
#2376Method of manufacturing semiconductor device
#2377Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods
#2378Method for manufacturing chips
#2379METHOD AND MAGNETIC TRANSFER STAMP FOR TRANSFERRING SEMICONDUCTOR DICE USING MAGNETIC TRANSFER PRINTING TECHNIQUES
#2380PHOTOSENSITIVE ADHESIVE COMPOSITION, AND FILM ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER AND SEMICONDUCTOR DEVICE USING THE PHOTOSENSITIVE ADHESIVE COMPOSITION
#2381Method for assembling at least one chip with a wire element, electronic chip with a deformable link element, fabrication method of a plurality of chips, and assembly of at least one chip with a wire element
#2382Apparatus and method for embedding components in small-form-factor, system-on-packages
#2383Dicing die-bonding film
#2384Wafer-level stack package and method of fabricating the same
#2385Semiconductor device capable of suppressing generation of cracks in semiconductor chip during manufacturing process
#2386Metal plugged substrates with no adhesive between metal and polyimide
#2387Contact-based encapsulation
#2388Lead frame land grid array with routing connector trace under unit
#2389Semiconductor device and method for fabricating the same
#2390Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier
#2391Structures and methods to reduce maximum current density in a solder ball
#2392Apparatus and method for embedding components in small-form-factor, system-on-packages
#2393Window ball grid array (BGA) semiconductor packages
#2394Integrated circuit package with embedded components
#2395Semiconductor chip device with solder diffusion protection
#2396Combined power mesh transition and signal overpass/underpass
#2397METHOD FOR STACKING DIE IN THIN, SMALL-OUTLINE PACKAGE
#2398METHOD OF VERTICALLY MOUNTING AN INTEGRATED CIRCUIT
#2399SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#2400Solder in cavity interconnection technology