H01L2924/01108 - CPC Classification Index

ClassID:

212110 ⎘

H01L2924/01108 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Groups of the periodic table Noble metals

Recent Application in this class:

20160074971

2016-03-17

Lead-Free Solder Alloy

20150318238

2015-11-05

Device packaging with substrates having embedded lines and metal defined pads

20150008578

2015-01-08

Device packaging with substrates having embedded lines and metal defined pads

20140295619

2014-10-02

Bump, method for forming the bump, and method for mounting substrate having the bump thereon

20140061897

2014-03-06

Bump structures for semiconductor package

20120161330

2012-06-28

Device packaging with substrates having embedded lines and metal defined pads

20120012993

2012-01-19

Die package including substrate with molded device

20110272802

2011-11-10

Bump, method for forming the bump, and method for mounting substrate having the bump thereon

20090174048

2009-07-09

Die package including substrate with molded device