212120 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Semiconductor purity grades 5N purity grades, i.e. 99.999%
Wire bonding systems and related methods
#2Semiconductor device
#3Method of producing low alpha-ray emitting bismuth, and low alpha-ray emitting bismuth
#4METHOD OF MANUFACTURING SOFT-DILUTE-COPPER-ALLOY-MATERIAL
#5SOFT DILUTE COPPER ALLOY WIRE, SOFT DILUTE COPPER ALLOY PLATE AND SOFT DILUTE COPPER ALLOY STRANDED WIRE
#6Ag—Au—Pd ternary alloy bonding wire
#7Semiconductor device
#8Ultrasonic wire bonding method for a semiconductor device
#9ALUMINUM FOR ULTRASONIC BONDING
#10Bonding wire for semiconductor
#11Bonding structure of bonding wire
#12SEMICONDUCTOR DEVICE
#13Copper alloy bonding wire for semiconductor device
#14Gold alloy wire for ball bonding
#15SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#16Wirebonded semiconductor package
#17Ultrahigh-Purity Copper and Process for Producing the Same, and Bonding Wire Comprising Ultrahigh-Purity Copper
#18GOLD ALLOY WIRE FOR BONDING WIRE HAVING HIGH INITIAL BONDABILITY, HIGH BONDING RELIABILITY, HIGH ROUNDNESS OF COMPRESSION BALL, HIGH STRAIGHTNESS, HIGH RESIN FLOWABILITY RESISTANCE, AND LOW SPECIFIC RESISTANCE
#19Gold alloy wire for bonding wire having high bonding reliability, high roundness of compression ball, high straightness and high resin flowability resistance
#20Gold wire for semiconductor element connection
#21Gold alloy wire for bonding wire having high initial bondability, high bonding reliability, high roundness of compression ball, high straightness, and high resin flowability resistance
#22Wire Bonds Having Pressure-Absorbing Balls
#23Gold wire for connecting semiconductor chip
#24Wire Bump Material
#25Copper alloy bonding wire for semiconductor device
#26Au Alloy Bonding Wire
#27Au bonding wire for semiconductor device
#28Au alloy bonding wire
#29Copper bonding wire for semiconductor packaging
#30Wire bonds having pressure-absorbing balls