212134 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Alloys Quaternary Alloys
PAD OVER ACTIVE SENSOR CELLS INTEGRATED IN A CHIP PACKAGE
#2SEMICONDUCTOR DEVICE WITH ADVANCED PAD STRUCTURE AND METHOD FOR FORMING SAME
#3ALUMINUM BONDING WIRE FOR POWER SEMICONDUCTOR
#4Carrier Substrate
#5CHIP-SCALE PACKAGE
#6DISPLAY PANEL
#7LIQUID METAL THERMAL INTERFACE
#8Solid metal foam thermal interface material
#9Electronic device
#10Aluminum alloy material, and conductive member, conductive component, spring member, spring component, semiconductor module member, semiconductor module component, structural member and structural component including the aluminum alloy material
#11Semiconductor device and method for manufacturing same
#12Imaging device having a photoelectric conversion layer
#13Anisotropic conductive material, electronic device including anisotropic conductive material, and method of manufacturing electronic device
#14Lead-free soldering method and soldered article
#15Lead-Free Solder Alloy
#16Electronic device including soldered surface-mount component
#17Stud bump and package structure thereof and method of manufacturing the same
#18Electronic device, solid state imaging apparatus, and method of producing electrode for electronic device
#19Electrode for low-leakage devices
#20Method for producing semiconductor device
#21Semiconductor device having a chip mounting portion on which a separated plated layer is disposed
#22Device including a semiconductor chip and metal foils
#23SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
#24Method for soldering surface-mount component and surface-mount component
#25Die-bonded LED
#26Lead component and method for manufacturing the same, and semiconductor package
#27Mosfet package
#28Semiconductor device, method for manufacturing the same, and power supply unit
#29Bonding structure and bonding method of heat diffusion member, and cooling unit using the same
#30Connecting member for connecting a semiconductor element and a frame, formed of an Al-based layer and first and second Zn-based layers provided on surfaces of the Al-based layer
#31Internal packaging of a semiconductor device mounted on die pads
#32Semiconductor device
#33Junction body, semiconductor module, and manufacturing method for junction body
#34Method of making a semiconductor chip assembly with a post/dielectric/post heat spreader
#35Components joining method and components joining structure
#36SEMICONDUCTOR CHIP ASSEMBLY WITH POST/DIELECTRIC/POST HEAT SPREADER
#37ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOUND THICKNESSES AND OXIDATION OF METALS AND ALLOYS
#38Flip chip mounting method and bump forming method
#39Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive trace
#40Solder alloy and semiconductor device
#41Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace
#42Manufacturing of a device including a semiconductor chip
#43Method of manufacturing semiconductor device
#44Die-bonding method of LED chip and LED manufactured by the same
#45Semiconductor device, production method for the same, and substrate
#46Method of making a semiconductor chip assembly with a post/base heat spreader with an ESD protection layer
#47Semiconductor chip assembly with post/base heat spreader with ESD protection layer
#48THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF
#49Semiconductor device
#50Semiconductor device package structure and method for the same
#51BONDING MATERIAL, ELECTRONIC COMPONENT AND BONDED STRUCTURE
#52Semiconductor power module
#53SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#54Solder material, method for manufacturing the same, joined body, method for manufacturing the same, power semiconductor module, and method for manufacturing the same
#55Semiconductor device having lead free solders between semiconductor chip and frame and fabrication method thereof
#56Semiconductor device and method for fabricating the same
#57Device including a semiconductor chip and metal foils
#58High temperature, stable SiC device interconnects and packages having low thermal resistance
#59Semiconductor device and manufacturing method thereof
#60Electroconductive fine particles, anisotropic electroconductive material, and electroconductive connection structure
#61Optoelectronic device having a multi-layer solder and manufacturing method thereof
#62Semiconductor device
#63Semiconductor device, production method for the same, and substrate
#64Method for connecting between substrates, flip-chip mounting structure, and connection structure between substrates
#65Electronic components mounting adhesive and electronic components mounting structure
#66Manufacturing method of semiconductor device having underfill resin formed without void between semiconductor chip and wiring board
#67Solder preform and electronic component
#68Soldering Method, Soldering Apparatus and Method for Manufacturing Semiconductor Device
#69Semiconductor device using lead-free solder as die bonding material and die bonding material not containing lead
#70Semiconductor device and method of manufacturing the same
#71Component attach methods and related device structures
#72Die warpage control
#73Components joining method and components joining structure
#74Flip chip mounting method and bump forming method
#75Power Semiconductor Module And Method of Manufacturing the Power Semiconductor Module
#76Chip assembly with interconnection by metal bump
#77Semiconductor device
#78High temperature, stable SiC device interconnects and packages having low thermal resistance
#79MOSFET package
#80Articles and assembly for magnetically directed self assembly and methods of manufacture
#81ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOUND THICKNESS AND OXIDATION OF METALS AND ALLOYS
#82Semiconductor power module including epoxy resin coating
#83ELECTRONIC DEVICE MOUNTING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#84High-temperature solder, high-temperature solder paste and power semiconductor using same
#85Semiconductor device
#86MOSFET package
#87MOSFET package
#88Solder composition for electronic devices
#89Semiconductor device
#90Chip package with dam bar restricting flow of underfill
#91MOSFET package
#92MOSFET package
#93Method of making a semiconductor chip assembly using multiple etch steps to form a pillar after forming a routing line
#94Semiconductor device and method of manufacturing a semiconductor device
#95Semiconductor device and method for producing the same
#96Semiconductor apparatus and manufacturing method
#97High temperature, stable SiC device interconnects and packages having low thermal resistance
#98Semiconductor device and manufacturing method of the same
#99Solder foil, semiconductor device and electronic device
#100Semiconductor device and method for manufacturing semiconductor device
#101Semiconductor device and method of manufacturing the same
#102Underfill fluxing curative
#103Semiconductor device and method of manufacturing the same
#104Die attach by temperature gradient lead free soft solder metal sheet or film
#105Method of making a microelectronic assembly
#106Semiconductor device having heat radiation plate and bonding member
#107Thermal interface adhesive
#108Mount for semiconductor light emitting device