H01L2924/0135 - CPC Classification Index

ClassID:

212135 ⎘

H01L2924/0135 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Alloys Quinary Alloys

Recent Application in this class:

20240105667

ALUMINUM BONDING WIRE FOR POWER SEMICONDUCTOR

20210074657

Semiconductor device having first and second terminals

20200161272

Lead-free solder joining of electronic structures

20190006312

Lead-free solder joining of electronic structures

20160163668

Mounting structure and BGA ball

20150262926

Electronic device including soldered surface-mount component

20150194409

Stud bump and package structure thereof and method of manufacturing the same

20120292087

Method for soldering surface-mount component and surface-mount component

20110291282

Junction body, semiconductor module, and manufacturing method for junction body

20110065242

Method of fabricating a semiconductor package using a fluxing underfill composition applied to solder balls in a dip process

20100276803

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

20100193801

Solder material, method for manufacturing the same, joined body, method for manufacturing the same, power semiconductor module, and method for manufacturing the same

20090246910

Semiconductor device manufacturing method