H01L2924/05 - CPC Classification Index

ClassID:

212219 ⎘

H01L2924/05 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Nitrides composed of metals from groups of the periodic table 10th Group

Recent Application in this class:

20230326899

2023-10-12

DELAMINATION/CRACKING IMPROVEMENT AT SOLDER JOINTS IN MICROELECTRONICS PACKAGE

20110101527

2011-05-05

Mechanisms for forming copper pillar bumps

20110101523

2011-05-05

PILLAR BUMP WITH BARRIER LAYER