212255 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Oxides composed of metals from groups of the periodic table 2nd Group
THERMAL CONDUCTION SHEET HOLDER AND METHOD OF MANUFACTURING HEAT DISSIPATING DEVICE
#2HEAT DISSIPATING STRUCTURE AND METHODS OF FORMING THE SAME
#3LOW TEMPERATURE SUBSTRATE BONDING METHOD
#4WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE MANUFACTURED USING THE SAME
#5Heat Dissipating Structure and Methods of Forming The Same
#6SEMICONDUCTOR PACKAGES
#7THERMAL CONDUCTION SHEET HOLDER AND METHOD OF MANUFACTURING HEAT DISSIPATING DEVICE
#8Laminate and electronic device
#9Semiconductor packaging structure and process
#10Semiconductor packaging structure and process
#11Composition for anisotropic conductive film, anisotropic conductive film, and connection structure using the same
#12Power module package and method for manufacturing the same
#13EPOXY RESIN COMPOSITION FOR ELECTRONIC MATERIAL, CURED PRODUCT THEREOF AND ELECTRONIC MEMBER
#14Power module with the integration of control circuit
#15Film for semiconductor back surface and its use
#16Source down semiconductor devices and methods of formation thereof
#17Power module and fabrication method for the same
#18SEMICONDUCTOR POWER MODULE USING DISCRETE SEMICONDUCTOR COMPONENTS
#19High-power electronic device packages and methods
#20Source down semiconductor devices and methods of formation thereof
#21Adhesive composition for semiconductors, adhesive film prepared using the same, and semiconductor device including the film
#22Adhesive for semiconductor bonding, adhesive film for semiconductor bonding, method for mounting semiconductor chip, and semiconductor device
#23THERMOSETTING DIE-BONDING FILM
#24Thermosetting die-bonding film
#25DIE BOND FILM, DICING DIE BOND FILM, METHOD OF MANUFACTURING DIE BOND FILM, AND SEMICONDUCTOR DEVICE HAVING DIE BOND FILM
#26FILL ROLL FOR PRODUCING SEMICONDUCTOR DEVICE
#27ADHESIVE FILM FOR SEMICONDUCTOR ASSEMBLY
#28ADHESIVE SHEET, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE
#29THERMOSETTING DIE BOND FILM, DICING DIE BOND FILM AND SEMICONDUCTOR DEVICE
#30Die bond film, dicing die bond film, and semiconductor device
#31Adhesive composition for a semiconductor device, adhesive film, and dicing die-bonding film
#32Acrylic insulating adhesive
#33THERMOSETTING DIE-BONDING FILM
#34THERMOSETTING DIE-BONDING FILM
#35Process for producing a semiconductor device
#36METHOD OF MANUFACTURING DICING DIE-BONDING FILM
#37Adhesive sheet for semiconductor, and dicing tape integrated adhesive sheet for semiconductor
#38THERMOSETTING DIE BONDING FILM
#39Adhesive sheet for manufacturing semiconductor device, manufacturing method of semiconductor device using the sheet, and semiconductor device obtained by the method
#40DEVICE CAPABLE OF THERMALLY COOLING WHILE ELECTRICALLY INSULATING
#41Dicing/die bonding film
#42Thermosetting die-bonding film
#43Adhesive compostion for die bonding in semiconductor assembly, adhesive film prepared therefrom, dicing die-bonding film prepared therefrom, device package including the same, and associated methods
#44ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SHEET, AND SEMICONDUCTOR DEVICE OBTAINED BY THE METHOD
#45B-stageable die attach adhesives
#46Stacked semiconductor chips having double adhesive insulating layer interposed therebetween
#47Thermally conductive composite and uses for microelectronic packaging
#48Adhesive sheet, semiconductor device, and process for producing semiconductor device
#49Adhesion method using gray-scale photolithography
#50Thermally conductive composite and uses for microelectronic packaging
#51Thermally conductive compositions and methods of making thereof