212256 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Oxides composed of metals from groups of the periodic table 3rd Group
STACKED HIGH-POWER RF SWITCH
#2HIGH CAPACITANCE HYBRID BONDED CAPACITOR DEVICE
#3Chemical bonding method, package-type electronic component, and hybrid bonding method for electronic device
#4Protrusion bump pads for bond-on-trace processing
#5Bond materials with enhanced plasma resistant characteristics and associated methods
#6Bonding interface layer
#7Narrow-gap flip chip underfill composition
#8Protrusion bump pads for bond-on-trace processing
#9Narrow-gap flip chip underfill composition
#10Electrode for low-leakage devices