Patents-Review.com
ClassID:

212267 ⎘

H01L2924/0541 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Oxides composed of metals from groups of the periodic table 11th Group

Recent Application in this class:
#1
20240274563
2024-08-15

SOLDER STRUCTURE WITH DISRUPTABLE COATING AS SOLDER SPREADING PROTECTION

 #2
20240266320
2024-08-08

METHOD OF INTERCONNECTING SEMICONDUCTOR DEVICES AND ASSEMBLY OF INTERCONNECTED SEMICONDUCTOR DEVICES

 #3
20240067855
2024-02-29

LIQUID ALLOY THERMAL PASTE AND FABRICATION METHOD THEREOF

 #4
20240006359
2024-01-04

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

 #5
20230299059
2023-09-21

MICRO LIGHT-EMITTING DIODE

 #6
20220328448
2022-10-13

Manufacturing method of an electronic apparatus

 #7
20210098418
2021-04-01

Manufacturing method for semiconductor device

 #8
20190252348
2019-08-15

SINTERING BONDING METHOD FOR SEMICONDUCTOR DEVICE

 #9
20190109098
2019-04-11

Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the same

 #10
20180301424
2018-10-18

Package structure

 #11
20180082977
2018-03-22

Method of manufacturing semiconductor device

 #12
20180082972
2018-03-22

Method of manufacturing bonded body

 #13
20170229404
2017-08-10

Package structure and method for forming the same

 #14
20170179054
2017-06-22

Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the same

 #15
20170154863
2017-06-01

COPPER BONDING WIRE WITH ANGSTROM (Å) THICK SURFACE OXIDE LAYER

 #16
20160079190
2016-03-17

Package with UBM and methods of forming

 #17
20160064348
2016-03-03

Packaging device having plural microstructures disposed proximate to die mounting region

 #18
20150137366
2015-05-21

REACTIVE BONDING OF A FLIP CHIP PACKAGE

 #19
20150104903
2015-04-16

Treating copper surfaces for packaging

 #20
20140363966
2014-12-11

Pillar bumps and process for making same

 #21
20140110740
2014-04-24

Semiconductor device and production method therefor

 #22
20130320529
2013-12-05

Reactive bonding of a flip chip package

 #23
20130134544
2013-05-30

Energy harvesting in integrated circuit packages

 #24
20120153486
2012-06-21

Light emitting semiconductor element bonded to a base by a silver coating

 #25
20120056320
2012-03-08

Semiconductor device and manufacturing method of semiconductor device

 #26
20120049346
2012-03-01

Pillar bumps and process for making same

 #27
20100270515
2010-10-28

Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same

 #28
20100190298
2010-07-29

Semiconductor device and production method therefor

 #29
20100187563
2010-07-29

Semiconductor device and production method therefor

 #30
20100035381
2010-02-11

Method of manufacturing stacked semiconductor device

 #31
20080156398
2008-07-03

Bonding method and bonding material using metal particle

 #32
15165054
2017-05-16

Lead frame

 #33
14970962
2016-11-29

Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the same

 #34
14659905
2016-07-05

Integrated circuit packaging system with surface treatment and method of manufacture thereof