212327 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Polymers Styrenic polymer
THERMAL CONDUCTION SHEET HOLDER AND METHOD OF MANUFACTURING HEAT DISSIPATING DEVICE
#2SEMICONDUCTOR DIE SINGULATION USING DIE ATTACH FILM AND PLASMA DICING
#3ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND RELATED METHODS
#4METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT ASSEMBLY AND AN INTEGRATED CIRCUIT FORMED THEREFROM
#5THERMAL CONDUCTION SHEET HOLDER AND METHOD OF MANUFACTURING HEAT DISSIPATING DEVICE
#6ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME
#7Resin particles, electrically conductive particles, electrically conductive material, and connection structure
#8Nanoscale interconnect array for stacked dies
#9Nanoscale interconnect array for stacked dies
#10Molded composite enclosure for integrated circuit assembly
#11Composition for anisotropic conductive film, anisotropic conductive film, and connection structure using the same
#12Molded composite enclosure for integrated circuit assembly
#13UNDERFILL MATERIAL INCLUDING BLOCK COPOLYMER TO TUNE COEFFICIENT OF THERMAL EXPANSION AND TENSILE MODULUS
#14ADHESIVE FILM FOR SEMICONDUCTOR DEVICE
#15ADHESIVE FILM FOR SEMICONDUCTOR DEVICE
#16Dicing die bonding film having excellent burr property and reliability and semiconductor device using the same
#17Flip-chip mounting resin composition and bump forming resin composition