H01L2924/066 - CPC Classification Index

#1

20260018547

2026-01-15

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE

#2

20250309157

2025-10-02

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

#3

20250246489

2025-07-31

PACKAGE STRUCTURE

#4

20240421095

2024-12-19

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

#5

20240203924

2024-06-20

DIE AND PACKAGE STRUCTURE

#6

20230060577

2023-03-02

Connection structure and manufacturing method therefor

#7

20220399292

2022-12-15

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE

#8

20220352134

2022-11-03

DISPLAY DEVICE

#9

20220208711

2022-06-30

Die and package structure

#10

20220049085

2022-02-17

Reinforcing resin composition, electronic component, method for manufacturing electronic component, mounting structure, and method for manufacturing mounting structure

#11

20200308121

2020-10-01

Adhesive composition for semiconductor circuit connection and adhesive film including the same

#12

20200118958

2020-04-16

Package structure and method of manufacturing the same

#13

20200075522

2020-03-05

Fabrication of solder balls with injection molded solder

#14

20190237423

2019-08-01

Package structure and method of manufacturing the same

#15

20190181113

2019-06-13

Film-like adhesive and method for producing semiconductor package using film-like adhesive

#16

20180269173

2018-09-20

Fabrication of solder balls with injection molded solder

#17

20180174992

2018-06-21

SEMICONDUCTOR DEVICE WITH COPPER MIGRATION STOPPING OF A REDISTRIBUTION LAYER

#18

20180108631

2018-04-19

Fabrication of solder balls with injection molded solder

#19

20170330852

2017-11-16

Module, method for manufacturing the same, and electronic device

#20

20170233610

2017-08-17

Adhesive film for semiconductor

#21

20170198182

2017-07-13

Adhesive composition for semiconductor, adhesive film for semiconductor, and dicing die bonding film

#22

20170162531

2017-06-08

Composition for anisotropic conductive film, anisotropic conductive film, and connection structure using the same

#23

20160351432

2016-12-01

Film for semiconductor back surface and its use

#24

20160336290

2016-11-17

Adhesive resin compostition for bonding semiconductors and adhesive film for semiconductors

#25

20160293816

2016-10-06

SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE ARRAY, AND IMAGE FORMATION APPARATUS

#26

20160289443

2016-10-06

Encapsulating resin composition, semiconductor device using the encapsulating resin composition, and method for manufacturing semiconductor device using the encapsulating resin composition

#27

20160190028

2016-06-30

METHOD AND STRUCTURE FOR FAN-OUT WAFER LEVEL PACKAGING

#28

20160075871

2016-03-17

THERMOSETTING RESIN COMPOSITION AND METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE

#29

20150318257

2015-11-05

Semiconductor device connected by anisotropic conductive film

#30

20150318228

2015-11-05

MODULE AND METHOD FOR PRODUCING MODULE

#31

20150270220

2015-09-24

SEMICONDUCTOR DEVICES HAVING THROUGH ELECTRODES AND METHODS OF MANUFACTURING THE SAME

#32

20120281376

2012-11-08

Epoxy resin composition, method for producing composite unit using the epoxy resin composition, and composite unit

#33

20120135242

2012-05-31

Thermosetting die-bonding film

#34

20120104134

2012-05-03

FILL ROLL FOR PRODUCING SEMICONDUCTOR DEVICE

#35

20120029117

2012-02-02

ADHESIVE FILM FOR SEMICONDUCTOR ASSEMBLY

#36

20110201195

2011-08-18

Flip chip mounting method and bump forming method

#37

20100323191

2010-12-23

Pressure-Sensitive Adhesive Tape

#38

20100197080

2010-08-05

Adhesive sheet for manufacturing semiconductor device, manufacturing method of semiconductor device using the sheet, and semiconductor device obtained by the method

#39

20100186894

2010-07-29

Method for packing electric components on a substrate

#40

20100093154

2010-04-15

Dicing/die bonding film

#41

20100081258

2010-04-01

Thermosetting die-bonding film

#42

20100055842

2010-03-04

Thermosetting die-bonding film

#43

20100019365

2010-01-28

DICING/DIE BONDING FILM

#44

20090168354

2009-07-02

Thermally and electrically conductive interconnect structures

#45

20090136748

2009-05-28

Adhesive compostion for die bonding in semiconductor assembly, adhesive film prepared therefrom, dicing die-bonding film prepared therefrom, device package including the same, and associated methods

#46

20090126876

2009-05-21

Flip chip mounting method and method for connecting substrates

#47

20090117688

2009-05-07

Flip chip mounting method and bump forming method

#48

20090115071

2009-05-07

Flip chip mounting method and method for connecting substrates

#49

20090110940

2009-04-30

Adhesive film composition, associated dicing die bonding film, die package, and associated methods

#50

20090023245

2009-01-22

Flip chip mounting method and bump forming method

#51

20090014498

2009-01-15

COMPRESSION BONDING DEVICE

#52

20090001611

2009-01-01

ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SHEET, AND SEMICONDUCTOR DEVICE OBTAINED BY THE METHOD

#53

20080284046

2008-11-20

Flip chip mounting method and bump forming method

#54

20080128664

2008-06-05

Flip-chip mounting resin composition and bump forming resin composition

#55

20080066856

2008-03-20

Process for manufacturing semiconductor devices

#56

20080063871

2008-03-13

Adhesive film composition for semiconductor assembly, associated dicing die bonding film and semiconductor package

#57

20060001023

2006-01-05

Method of manufacturing active matrix substrate with height control member

#58

20050243229

2005-11-03

Active matrix substrate with height control member

#59

15297269

2017-12-05

Fabrication of solder balls with injection molded solder