H01L2924/068 - CPC Classification Index

ClassID:

212340 ⎘

H01L2924/068 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Polymers Polycarbonate

Recent Application in this class:

20250112124

2025-04-03

DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING

20190139850

2019-05-09

Temporary bonding scheme

20180269175

2018-09-20

Thermal bonding sheet and thermal bonding sheet with dicing tape

20170243849

2017-08-24

Conductive composition and electronic parts using the same

20170170085

2017-06-15

Molded composite enclosure for integrated circuit assembly

20160351432

2016-12-01

Film for semiconductor back surface and its use

20160268178

2016-09-15

Molded composite enclosure for integrated circuit assembly

20160254244

2016-09-01

Systems and Methods Utilizing Anisotropic Conductive Adhesives

20160075920

2016-03-17

ADHESIVE FILM FOR SEMICONDUCTOR DEVICE

#10

20160056086

2016-02-25

Temporary bonding scheme

#11

20150155260

2015-06-04

Temporary bonding scheme

#12

20120141786

2012-06-07

ADHESIVE FILM FOR SEMICONDUCTOR DEVICE

#13

20080128664

2008-06-05

Flip-chip mounting resin composition and bump forming resin composition