H01L2924/0695 - CPC Classification Index

#1

20250210471

2025-06-26

SEMICONDUCTOR CHIP PACKAGING DEFECT FREE DIMPLE PROCESS AND DEVICE

#2

20250140746

2025-05-01

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

#3

20250087549

2025-03-13

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

#4

20240363512

2024-10-31

PACKAGES WITH SI-SUBSTRATE-FREE INTERPOSER AND METHOD FORMING SAME

#5

20240363465

2024-10-31

DIE ISOLATION WITH CONFORMAL COATING

#6

20240332272

2024-10-03

ELECTRONIC DEVICES ANDMETHODS OF MANUFACTURING ELECTRONIC DEVICES

#7

20240203754

2024-06-20

METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT ASSEMBLY AND AN INTEGRATED CIRCUIT FORMED THEREFROM

#8

20230230909

2023-07-20

Packages with Si-substrate-free interposer and method forming same

#9

20220352134

2022-11-03

DISPLAY DEVICE

#10

20220336402

2022-10-20

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

#11

20210391300

2021-12-16

Semiconductor packaging structure

#12

20210391292

2021-12-16

Method of manufacturing substrate layered body and layered body

#13

20210233890

2021-07-29

PACKAGING STRUCTURES

#14

20200075522

2020-03-05

Fabrication of solder balls with injection molded solder

#15

20200027859

2020-01-23

Package structure with improvement layer and fabrication method thereof

#16

20200027858

2020-01-23

Packaging structure and forming method thereof

#17

20200027857

2020-01-23

Packaging structure and forming method thereof

#18

20190333829

2019-10-31

Method of detecting delamination in an integrated circuit package structure

#19

20190237389

2019-08-01

Cooling bond layer and power electronics assemblies incorporating the same

#20

20180269173

2018-09-20

Fabrication of solder balls with injection molded solder

#21

20180203353

2018-07-19

Cured film formed by curing photosensitive resin composition and method for manufacturing same

#22

20180156865

2018-06-07

Integrated circuit package structure and testing method using the same

#23

20180108631

2018-04-19

Fabrication of solder balls with injection molded solder

#24

20170170085

2017-06-15

Molded composite enclosure for integrated circuit assembly

#25

20170162531

2017-06-08

Composition for anisotropic conductive film, anisotropic conductive film, and connection structure using the same

#26

20170011991

2017-01-12

Assembly comprising an element that is capable of transmitting heat, a film of a polymer that is a good thermal conductor and electrical insulator, a sintered joint and a radiator and manufacturing method

#27

20160351432

2016-12-01

Film for semiconductor back surface and its use

#28

20160268178

2016-09-15

Molded composite enclosure for integrated circuit assembly

#29

20160148894

2016-05-26

Conductive die attach film for large die semiconductor packages and compositions useful for the preparation thereof

#30

20160013160

2016-01-14

Wafer-to-wafer bonding structure

#31

20150262917

2015-09-17

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

#32

20150255413

2015-09-10

Enhanced board level reliability for wafer level packages

#33

20150048513

2015-02-19

Method for obtaining three-dimensional actin structures and uses thereof

#34

20110201195

2011-08-18

Flip chip mounting method and bump forming method

#35

20110101349

2011-05-05

Semiconductor package, method of evaluating same, and method of manufacturing same

#36

20110033983

2011-02-10

Method of manufacturing a semiconductor device

#37

20100224972

2010-09-09

Leadless integrated circuit package having standoff contacts and die attach pad

#38

20100224970

2010-09-09

Leadless integrated circuit package having standoff contacts and die attach pad

#39

20100203675

2010-08-12

Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus

#40

20100148368

2010-06-17

Semiconductor device

#41

20100007033

2010-01-14

Method for connecting between substrates, flip-chip mounting structure, and connection structure between substrates

#42

20090230551

2009-09-17

Semiconductor device

#43

20090218670

2009-09-03

Storage medium and semiconductor package

#44

20090203170

2009-08-13

Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body

#45

20090191702

2009-07-30

Semiconductor device and manufacturing method thereof

#46

20090146301

2009-06-11

Semiconductor device and method of manufacturing the same

#47

20090057891

2009-03-05

Semiconductor device and plural semiconductor elements with suppressed bending

#48

20090023245

2009-01-22

Flip chip mounting method and bump forming method

#49

20090008800

2009-01-08

Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus

#50

20080211095

2008-09-04

Semiconductor device and manufacturing method of the semiconductor device

#51

20080196245

2008-08-21

Method for mounting electronic components

#52

20080150157

2008-06-26

Semiconductor device and manufacturing method of the same

#53

20080128664

2008-06-05

Flip-chip mounting resin composition and bump forming resin composition

#54

20070218651

2007-09-20

Manufacturing method of a semiconductor device

#55

20070170600

2007-07-26

Semiconductor device sealed with electrical insulation sealing member

#56

20070080444

2007-04-12

Electronic circuit chip, and electronic circuit device and method for manufacturing the same

#57

20060281872

2006-12-14

Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same

#58

20060264022

2006-11-23

Semiconductor device

#59

20060121690

2006-06-08

Three-dimensional device fabrication method

#60

15297269

2017-12-05

Fabrication of solder balls with injection molded solder