H01L2924/07001 - CPC Classification Index

ClassID:

212345 ⎘

H01L2924/07001 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Polymers; Polyamine or polyimide Polyamine

Recent Application in this class:

20240203754

2024-06-20

METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT ASSEMBLY AND AN INTEGRATED CIRCUIT FORMED THEREFROM

20230060577

2023-03-02

Connection structure and manufacturing method therefor

20170243849

2017-08-24

Conductive composition and electronic parts using the same

20080128664

2008-06-05

Flip-chip mounting resin composition and bump forming resin composition