212353 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Polymers; Adhesive characteristics other than chemical being an ohmic electrical conductor Intrinsic, e.g. polyaniline [PANI]
CONDUCTIVE ADHESIVE ASSEMBLY FOR SEMICONDUCTOR DIE ATTACHMENT
#2Modular electronics apparatuses and methods
#3Methods for adhesive bonding of electronic devices
#4Systems for adhesive bonding of electronic devices
#5Device contact, electric device package and method of manufacturing an electric device package
#6Method and apparatus for electrostatic discharge protection using a temporary conductive coating