ClassID:

212356

H01L2924/0951 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by with a principal constituent of the material being a combination of two or more materials provided in the groups  -  Glass epoxy laminates

Sub-classes:
  • H01L2924/09511 » FR-4 3
  • H01L2924/09512 » FR-5 0
  • H01L2924/09522 » G10 0
  • H01L2924/09523 » G11 0
Recent Application in this class: