212390 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of semiconductor or other solid state devices to be connected; Material of the semiconductor or solid state bodies; Semiconducting materials; Compound semiconductors; III-V Boron nitride [BN], e.g. cubic, hexagonal, nanotube
Transient liquid phase bonding compositions and power electronics assemblies incorporating the same
#2Reusable wide bandgap semiconductor substrate
#3Electronics assemblies and cooling structures having metalized exterior surface
#4Reusable wide bandgap semiconductor substrate
#5Multilayer composite bonding materials and power electronics assemblies incorporating the same
#6Power electronics assemblies having a semiconductor cooling chip and an integrated fluid channel system
#7Multi-layered composite bonding materials and power electronics assemblies incorporating the same
#8Electronics assemblies and cooling structures having metalized exterior surface
#9Power electronics assemblies having a semiconductor cooling chip and an integrated fluid channel system
#10Power electronics assemblies having a wide bandgap semiconductor device and an integrated fluid channel system
#11Method for fabricating a semiconductor package with conductive carrier integrated heat spreader
#12Semiconductor Package with Integrated Heat Spreader
#13Method for fabricating a semiconductor package with conductive carrier integrated heat spreader
#14SOLDER-CONTAINING SEMICONDUCTOR DEVICE, MOUNTED SOLDER-CONTAINING SEMICONDUCTOR DEVICE, PRODUCING METHOD AND MOUNTING METHOD OF SOLDER-CONTAINING SEMICONDUCTOR DEVICE
#15Bonding method