H01L2924/10336 - CPC Classification Index

#1

20250183205

2025-06-05

SEMICONDUCTOR STRUCTURE

#2

20240145413

2024-05-02

SEMICONDUCTOR DEVICE

#3

20210157142

2021-05-27

Surface emitting light source with lateral variant refractive index profile

#4

20210143131

2021-05-13

Device and Method for UBM/RDL Routing

#5

20200083156

2020-03-12

Dummy metal with zigzagged edges

#6

20200013720

2020-01-09

Stretchable form of single crystal silicon for high performance electronics on rubber substrates

#7

20190393195

2019-12-26

Device and method for UBM/RDL routing

#8

20190122975

2019-04-25

Dummy metal with zigzagged edges

#9

20180145048

2018-05-24

Method for applying a bonding layer

#10

20180001614

2018-01-04

APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING

#11

20170338204

2017-11-23

Device and Method for UBM/RDL Routing

#12

20170317043

2017-11-02

Method for wafer dicing

#13

20170229423

2017-08-10

METHOD FOR PERMANENTLY BONDING WAFERS

#14

20170103964

2017-04-13

Apparatus and methods for micro-transfer-printing

#15

20170084529

2017-03-23

Dummy metal with zigzagged edges

#16

20170005234

2017-01-05

Optoelectronic component and method of producing an optoelectronic component

#17

20160190092

2016-06-30

Method for applying a bonding layer

#18

20160181213

2016-06-23

Wafer structure and method for wafer dicing

#19

20160020130

2016-01-21

Apparatus and methods for micro-transfer-printing

#20

20160020127

2016-01-21

Apparatus and methods for micro-transfer-printing

#21

20160020120

2016-01-21

Apparatus and methods for micro-transfer-printing

#22

20160016399

2016-01-21

Apparatus and methods for micro-transfer-printing

#23

20150060039

2015-03-05

Structure and method for cooling three-dimensional integrated circuits

#24

20150001462

2015-01-01

Stretchable form of single crystal silicon for high performance electronics on rubber substrates

#25

20140361406

2014-12-11

Semiconductor device and radio communication device

#26

20140017877

2014-01-16

Method for permanently bonding wafers

#27

20130321082

2013-12-05

Semiconductor apparatus comprised of two types of transistors

#28

20130264596

2013-10-10

Optoelectronic component and method for producing same

#29

20130026467

2013-01-31

Dual metal for a backside package of backside illuminated image sensor

#30

20120326178

2012-12-27

Optoelectronic component and method for producing an optoelectronic component

#31

20120319170

2012-12-20

Electronic device and method for producing electronic device

#32

20120301607

2012-11-29

Connecting and bonding adjacent layers with nanostructures

#33

20120273974

2012-11-01

Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device

#34

20120261799

2012-10-18

Semiconductor device and radio communication device

#35

20120125537

2012-05-24

Connecting and bonding adjacent layers with nanostructures

#36

20120100672

2012-04-26

Methods and apparatus for a stacked-die interposer

#37

20120085579

2012-04-12

ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL AND CONNECTING STRUCTURE OF CIRCUIT MEMBER

#38

20120063109

2012-03-15

Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device

#39

20120048606

2012-03-01

ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER

#40

20120025256

2012-02-02

Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same

#41

20110241222

2011-10-06

Semiconductor package and multichip arrangement having a polymer layer and an encapsulant

#42

20110176288

2011-07-21

Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device

#43

20110155423

2011-06-30

Circuit board and its wire bonding structure

#44

20110133331

2011-06-09

Interface structure for copper-copper peeling integrity

#45

20110081738

2011-04-07

Semiconductor composite apparatus, method for manufacturing the semiconductor composite apparatus, LED head that employs the semiconductor composite apparatus, and image forming apparatus that employs the LED head

#46

20110068465

2011-03-24

Strong interconnection post geometry

#47

20110018158

2011-01-27

Vacuum coupled tool apparatus for dry transfer printing semiconductor elements

#48

20100224890

2010-09-09

Light emitting diode chip with electrical insulation element

#49

20100213471

2010-08-26

Light-emitting device having a thermal conductive member with wiring function and method of manufacturing the same

#50

20100181283

2010-07-22

Dual metal for a backside package of backside illuminated image sensor

#51

20100164112

2010-07-01

Semiconductor device

#52

20100164103

2010-07-01

Semiconductor device

#53

20100123268

2010-05-20

Printing semiconductor elements by shear-assisted elastomeric stamp transfer

#54

20100109052

2010-05-06

Semiconductor device and manufacturing method thereof

#55

20100059863

2010-03-11

Stretchable form of single crystal silicon for high performance electronics on rubber substrates

#56

20100032720

2010-02-11

Semiconductor device and radio communication device

#57

20090309220

2009-12-17

Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device

#58

20090146172

2009-06-11

Component attach methods and related device structures

#59

20090130996

2009-05-21

Semiconductor device

#60

20090129422

2009-05-21

High-volume on-wafer heterogeneous packaging of optical interconnects

#61

20090095972

2009-04-16

Light-emitting device

#62

20090072408

2009-03-19

Connecting and bonding adjacent layers with nanostructures

#63

20080280394

2008-11-13

Systems and methods for post-circuitization assembly

#64

20080251808

2008-10-16

Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same

#65

20080224174

2008-09-18

Semiconductor device and manufacturing method of the same

#66

20080191220

2008-08-14

Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices

#67

20080116077

2008-05-22

System and method for solder bump plating

#68

20070278511

2007-12-06

Light-emitting device manufacturing method and light-emitting device

#69

20070190962

2007-08-16

RF module including control IC without the aid of a relay pad

#70

20070126019

2007-06-07

Light emitting device

#71

20070105250

2007-05-10

Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices

#72

20070023897

2007-02-01

Semiconductor device, power amplifier device and PC card

#73

20060286785

2006-12-21

Stretchable form of single crystal silicon for high performance electronics on rubber substrates

#74

20060269666

2006-11-30

Optical element

#75

20060231852

2006-10-19

Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same

#76

20060199353

2006-09-07

Wafer bonding of thinned electronic materials and circuits to high performance substrate

#77

20060160504

2006-07-20

System-in-package wireless communication device comprising prepackaged power amplifier

#78

20060138460

2006-06-29

Semiconductor device and radio communication device

#79

20060097354

2006-05-11

Semiconductor composite apparatus, method for manufacturing the semiconductor composite apparatus, LED head that employs the semiconductor composite apparatus, and image forming apparatus that employs the LED head

#80

20060091565

2006-05-04

LED with self aligned bond pad

#81

20060001117

2006-01-05

Semiconductor device, optoelectronic board, and production methods therefor

#82

20050277255

2005-12-15

Compound semiconductor device and manufacturing method thereof

#83

20050264352

2005-12-01

Integrated power amplifier module with power sensor

#84

20050214963

2005-09-29

Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices

#85

20050195028

2005-09-08

Power amplifier module for wireless communication devices

#86

20050151062

2005-07-14

Semiconductor device, optoelectronic board, and production methods therefor

#87

20050140436

2005-06-30

Dual band power amplifier module for wireless communication devices

#88

20050133810

2005-06-23

Opto-electronic assembly having an encapsulant with at least two different functional zones

#89

20050122167

2005-06-09

Power amplifier module for wireless communication devices

#90

20050098775

2005-05-12

Method of forming wirings for tile-shaped elements, structures of wirings for tile-shaped elements, and electronic equipment

#91

20050082643

2005-04-21

Semiconductor element, semiconductor device, method for manufacturing semiconductor element, method for manufacturing semiconductor device, and electronic apparatus

#92

20050077623

2005-04-14

Semiconductor radiation emitter package

#93

20050029529

2005-02-10

Light-emitting diode array

#94

15333433

2017-08-22

Electromagnetic wall in millimeter-wave cavity