Patents-Review.com
ClassID:

212402 ⎘

H01L2924/10337 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of semiconductor or other solid state devices to be connected; Material of the semiconductor or solid state bodies; Semiconducting materials; Compound semiconductors; III-V Indium gallium arsenide [InGaAs]

Recent Application in this class:
#1
20250183205
2025-06-05

SEMICONDUCTOR STRUCTURE

 #2
20240145413
2024-05-02

SEMICONDUCTOR DEVICE

 #3
20210184022
2021-06-17

Semiconductor device

 #4
20210143131
2021-05-13

Device and Method for UBM/RDL Routing

 #5
20210126591
2021-04-29

Semiconductor device and power amplifier module

 #6
20210098403
2021-04-01

Semiconductor device

 #7
20200227369
2020-07-16

Structures for bonding a group III-V device to a substrate by stacked conductive bumps

 #8
20200194394
2020-06-18

Semiconductor device

 #9
20200177140
2020-06-04

Semiconductor device and power amplifier module

 #10
20200158951
2020-05-21

Photodiode device monolithically integrating waveguide element with photodiode element type of optical waveguide

 #11
20200083156
2020-03-12

Dummy metal with zigzagged edges

 #12
20200006271
2020-01-02

Structures for bonding a group III-V device to a substrate by stacked conductive bumps

 #13
20190393195
2019-12-26

Device and method for UBM/RDL routing

 #14
20190333887
2019-10-31

Semiconductor device

 #15
20190296699
2019-09-26

Semiconductor device and power amplifier module

 #16
20190271808
2019-09-05

Photodiode device monolithically integrating waveguide element with photodiode element type of optical waveguide

 #17
20190122975
2019-04-25

Dummy metal with zigzagged edges

 #18
20190067037
2019-02-28

Flip-chip high speed components with underfill

 #19
20180374824
2018-12-27

Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same

 #20
20180309417
2018-10-25

Semiconductor device and power amplifier module

 #21
20180233475
2018-08-16

Semiconductor device

 #22
20180053746
2018-02-22

Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same

 #23
20180001614
2018-01-04

APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING

 #24
20170338204
2017-11-23

Device and Method for UBM/RDL Routing

 #25
20170103964
2017-04-13

Apparatus and methods for micro-transfer-printing

 #26
20170084529
2017-03-23

Dummy metal with zigzagged edges

 #27
20170077214
2017-03-16

Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applications

 #28
20170077054
2017-03-16

Semiconductor device

 #29
20170012034
2017-01-12

Semiconductor device

 #30
20160315060
2016-10-27

Semiconductor device

 #31
20160141256
2016-05-19

Method for manufacturing a semiconductor device, and semiconductor device

 #32
20160020130
2016-01-21

Apparatus and methods for micro-transfer-printing

 #33
20160020127
2016-01-21

Apparatus and methods for micro-transfer-printing

 #34
20160020120
2016-01-21

Apparatus and methods for micro-transfer-printing

 #35
20160016399
2016-01-21

Apparatus and methods for micro-transfer-printing

 #36
20150069591
2015-03-12

Method for manufacturing a semiconductor device, and semiconductor device

 #37
20130321082
2013-12-05

Semiconductor apparatus comprised of two types of transistors

 #38
20130058049
2013-03-07

Package systems including passive electrical components

 #39
20120068345
2012-03-22

LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS

 #40
20060169992
2006-08-03

Light receiving or light emitting modular sheet and process for producing the same