H01L2924/10339 - CPC Classification Index

ClassID:

212404 ⎘

H01L2924/10339 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of semiconductor or other solid state devices to be connected; Material of the semiconductor or solid state bodies; Semiconducting materials; Compound semiconductors; III-V Aluminium indium arsenide [AlInAs]

Recent Application in this class:

20250183205

SEMICONDUCTOR STRUCTURE

20210343680

System on integrated chips and methods of forming same

20210143131

Device and Method for UBM/RDL Routing

20200152604

System on integrated chips and methods of forming same

20200083156

Dummy metal with zigzagged edges

20190393195

Device and method for UBM/RDL routing

20190122975

Dummy metal with zigzagged edges

20190027465

System on integrated chips and methods of forming same

20170338204

Device and Method for UBM/RDL Routing

20170256487

Semiconductor devices, multi-die packages, and methods of manufacure thereof

20170084529

Dummy metal with zigzagged edges

20160155730

Semiconductor devices, multi-die packages, and methods of manufacture thereof

20130264596

Optoelectronic component and method for producing same

20130058049

Package systems including passive electrical components