H01L2924/10349 - CPC Classification Index

ClassID:

212414 ⎘

H01L2924/10349 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of semiconductor or other solid state devices to be connected; Material of the semiconductor or solid state bodies; Semiconducting materials; Compound semiconductors; III-V Aluminium gallium indium phosphide [AlGaInP]

Recent Application in this class:

20240421266

2024-12-19

OPTOELECTRONIC SYSTEM

20210157142

2021-05-27

Surface emitting light source with lateral variant refractive index profile

20200013720

2020-01-09

Stretchable form of single crystal silicon for high performance electronics on rubber substrates

20170324009

2017-11-09

OPTOELECTRONIC SYSTEM

20170271295

2017-09-21

Electronic device and method for producing an electronic device

20150188003

2015-07-02

Optoelectronic system

20150001462

2015-01-01

Stretchable form of single crystal silicon for high performance electronics on rubber substrates

20130264596

2013-10-10

Optoelectronic component and method for producing same

20120273974

2012-11-01

Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device

#10

20120168954

2012-07-05

Substrate bonding method and semiconductor device

#11

20120085579

2012-04-12

ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL AND CONNECTING STRUCTURE OF CIRCUIT MEMBER

#12

20120063109

2012-03-15

Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device

#13

20120048606

2012-03-01

ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER

#14

20110176288

2011-07-21

Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device

#15

20110081738

2011-04-07

Semiconductor composite apparatus, method for manufacturing the semiconductor composite apparatus, LED head that employs the semiconductor composite apparatus, and image forming apparatus that employs the LED head

#16

20110018158

2011-01-27

Vacuum coupled tool apparatus for dry transfer printing semiconductor elements

#17

20100283062

2010-11-11

Optoelectronic system

#18

20100224890

2010-09-09

Light emitting diode chip with electrical insulation element

#19

20100213471

2010-08-26

Light-emitting device having a thermal conductive member with wiring function and method of manufacturing the same

#20

20100123268

2010-05-20

Printing semiconductor elements by shear-assisted elastomeric stamp transfer

#21

20100059863

2010-03-11

Stretchable form of single crystal silicon for high performance electronics on rubber substrates

#22

20090309220

2009-12-17

Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device

#23

20090290337

2009-11-26

Mounting method, mounted structure, manufacturing method for electronic equipment, electronic equipment, manufacturing method for light-emitting diode display, and light-emitting diode display

#24

20090095972

2009-04-16

Light-emitting device

#25

20080315427

2008-12-25

Substrate bonding method and semiconductor device

#26

20080017873

2008-01-24

Device, method of manufacturing device, board, method of manufacturing board, mounting structure, mounting method, LED display, LED backlight and electronic device

#27