ClassID:

212557

H01L2924/13063 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of semiconductor or other solid state devices to be connected; Device type; Discrete devices, e.g. 3 terminal devices; Transistor; Field-effect transistor [FET] Metal-Semiconductor Field-Effect Transistor [MESFET]

Recent Application in this class:
#1
20250300570
2025-09-25

POWER CONVERSION DEVICE

#2
20250239560
2025-07-24

SEMICONDUCTOR DEVICE

#3
20250122413
2025-04-17

Multifunctional Adhesion Promoter for Semiconductor Device Packages

#4
20230197698
2023-06-22

Multi-typed integrated passive device (IPD) components and devices and processes implementing the same

#5
20230154883
2023-05-18

SEMICONDUCTOR PACKAGE WITH IMPROVED CONNECTION OF THE PINS TO THE BOND PADS OF THE SEMICONDUCTOR DIE

#6
20210343862
2021-11-04

Methods and devices for fabricating and assembling printable semiconductor elements

#7
20210126591
2021-04-29

Semiconductor device and power amplifier module

#8
20210005523
2021-01-07

Semiconductor devices comprising getter layers and methods of making and using the same

#9
20200177140
2020-06-04

Semiconductor device and power amplifier module

#10
20200013720
2020-01-09

Stretchable form of single crystal silicon for high performance electronics on rubber substrates

#11
20200006540
2020-01-02

Methods and devices for fabricating and assembling printable semiconductor elements

#12
20190296699
2019-09-26

Semiconductor device and power amplifier module

#13
20190198361
2019-06-27

Integrated circuit controlled ejection system (ICCES) for massively parallel integrated circuit assembly (MPICA)

#14
20190172806
2019-06-06

Semiconductor element

#15
20180309417
2018-10-25

Semiconductor device and power amplifier module

#16
20180145018
2018-05-24

Semiconductor devices with via structure and package structures comprising the same

#17
20170309733
2017-10-26

Methods and devices for fabricating and assembling printable semiconductor elements

#18
20170236793
2017-08-17

Semiconductor device

#19
20170200707
2017-07-13

Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays

#20
20170178989
2017-06-22

Semiconductor devices comprising getter layers and methods of making and using the same

#21
20170170132
2017-06-15

Three dimensional device integration method and integrated device

#22
20170070198
2017-03-09

Apparatus and methods for radio frequency amplifiers

#23
20170033237
2017-02-02

Field-effect transistor, display element, image display device, and system

#24
20160343631
2016-11-24

Semiconductor devices comprising getter layers and methods of making and using the same

#25
20160293794
2016-10-06

Methods and devices for fabricating and assembling printable semiconductor elements

#26
20160284544
2016-09-29

Methods and devices for fabricating and assembling printable semiconductor elements

#27
20160277017
2016-09-22

SNUBBER CIRCUIT

#28
20160190093
2016-06-30

Three dimensional device integration method and integrated device

#29
20160064325
2016-03-03

Semiconductor device and structure therefor

#30
20150373809
2015-12-24

Full color LED module having integrated driver transistors

#31
20150366025
2015-12-17

Active LED module having integrated limiter

#32
20150287692
2015-10-08

Three dimensional device integration method and integrated device

#33
20150132873
2015-05-14

Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays

#34
20150111320
2015-04-23

Integrated circuit combination of a target integrated circuit and a plurality of thin film photovoltaic cells connected thereto using a conductive path

#35
20150041984
2015-02-12

Electronic component and method

#36
20150001692
2015-01-01

Semiconductor component having a lateral semiconductor device and a vertical semiconductor device

#37
20150001462
2015-01-01

Stretchable form of single crystal silicon for high performance electronics on rubber substrates

#38
20140347136
2014-11-27

Apparatus and methods for radio frequency amplifiers

#39
20140285178
2014-09-25

System and method of sensing current in a power semiconductor device

#40
20140070226
2014-03-13

Bondable top metal contacts for gallium nitride power devices

#41
20140021479
2014-01-23

GaN power device with solderable back metal

#42
20130228924
2013-09-05

Copper interconnects having a titanium-platinum-titanium assembly between copper and compound semiconductor

#43
20130228796
2013-09-05

High voltage semiconductor devices including electric arc suppression material and methods of forming the same

#44
20130221528
2013-08-29

Devices and methods related to a sputtered titanium tungsten layer formed over a copper interconnect stack structure

#45
20130134433
2013-05-30

Metallization structure for high power microelectronic devices

#46
20130026631
2013-01-31

Semiconductor apparatus and manufacturing method thereof

#47
20130015924
2013-01-17

RF transistor packages with high frequency stabilization features and methods of forming RF transistor packages with high frequency stabilization features

#48
20120320581
2012-12-20

Thermally managed LED arrays assembled by printing

#49
20120305945
2012-12-06

Power semiconductor device

#50
20120286878
2012-11-15

Apparatus and methods for electronic amplification

#51
20120273799
2012-11-01

SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR THE SAME

#52
20120234592
2012-09-20

Package and high frequency terminal structure for the same

#53
20120208324
2012-08-16

Manufacturing method of semiconductor device

#54
20120199900
2012-08-09

Semiconductor device and method for manufacturing the same

#55
20120138954
2012-06-07

Semiconductor device for smoothing the voltage of the end face of a drain of a high frequency semiconductor chip

#56
20120126246
2012-05-24

Package and high frequency terminal structure for the same

#57
20120085385
2012-04-12

Integrated circuit combination of a target integrated circuit and a plurality of photovoltaic cells connected thereto using the top conductive layer

#58
20120074426
2012-03-29

Field-effect transistor

#59
20120032190
2012-02-09

Package and fabrication method of the same

#60
20120007159
2012-01-12

Semiconductor device having a capacitor

#61
20110312170
2011-12-22

Semiconductor device and fabrication mehtod of the semiconductor device

#62
20110233758
2011-09-29

Semiconductor device

#63
20110221421
2011-09-15

Method of sensing magnitude of current through semiconductor power device

#64
20110220890
2011-09-15

Methods and devices for fabricating and assembling printable semiconductor elements

#65
20110215746
2011-09-08

SEMICONDUCTOR DEVICE

#66
20110181350
2011-07-28

High frequency semiconductor device

#67
20110169549
2011-07-14

Electronic devices and components for high efficiency power circuits

#68
20110074006
2011-03-31

RF transistor packages with internal stability network including intra-capacitor resistors and methods of forming RF transistor packages with internal stability networks including intra-capacitor resistors

#69
20110049580
2011-03-03

Hybrid Packaged Gate Controlled Semiconductor Switching Device Using GaN MESFET

#70
20110044016
2011-02-24

High frequency circuit having multi-chip module structure

#71
20100317132
2010-12-16

Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays

#72
20100252863
2010-10-07

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME

#73
20100133543
2010-06-03

Methods of Making Semiconductor-Based Electronic Devices on a Wire and Articles That Can Be Made Thereby

#74
20100072577
2010-03-25

Methods and devices for fabricating and assembling printable semiconductor elements

#75
20100059863
2010-03-11

Stretchable form of single crystal silicon for high performance electronics on rubber substrates

#76
20090309215
2009-12-17

Semiconductor module and method for fabricating semiconductor module

#77
20090294803
2009-12-03

Methods and devices for fabricating and assembling printable semiconductor elements

#78
20090286343
2009-11-19

Double-sided monolithically integrated optoelectronic module with temperature compensation

#79
20090231042
2009-09-17

Broadband Power Amplifier with A High Power Feedback Structure

#80
20090191674
2009-07-30

AlGaN/GaN high electron mobility transistor devices

#81
20090189200
2009-07-30

Semiconductor device having hermitically sealed active area and electrodes

#82
20090148985
2009-06-11

Method for fabricating a nitride FET including passivation layers

#83
20090146224
2009-06-11

Composite passivation process for nitride FET

#84
20090140262
2009-06-04

FIELD-EFFECT TRANSISTOR

#85
20090110917
2009-04-30

Electronic Package and Method of Preparing Same

#86
20090072356
2009-03-19

High-Heat-Resistant Semiconductor Device

#87
20090039869
2009-02-12

Cascode current sensor for discrete power semiconductor devices

#88
20080315393
2008-12-25

RF transistor packages with internal stability network and methods of forming RF transistor packages with internal stability networks

#89
20080315392
2008-12-25

RF power transistor packages with internal harmonic frequency reduction and methods of forming RF power transistor packages with internal harmonic frequency reduction

#90
20080277698
2008-11-13

Field effect transistor with air bridge

#91
20080277697
2008-11-13

Semiconductor device for high frequency

#92
20080266032
2008-10-30

Illuminable GaAs switching component with transparent housing and associated microwave circuit

#93
20080210948
2008-09-04

High-heat-resistive semiconductor device

#94
20080093747
2008-04-24

Three dimensional device integration method and integrated device

#95
20080087898
2008-04-17

High-heat-resistant semiconductor device

#96
20080061419
2008-03-13

Three dimensional device integration method and integrated device

#97
20080061418
2008-03-13

Three dimensional device integration method and integrated device

#98
20080054298
2008-03-06

POWER MODULE WITH LAMINAR INTERCONNECT

#99
20080050858
2008-02-28

Method for producing semiconductor device

#100
20080042142
2008-02-21

Highly Heat-Resistant Synthetic Polymer Compound and High Withstand Voltage Semiconductor Device

#101
20080017966
2008-01-24

Pillar Bump Package Technology

#102
20070290304
2007-12-20

High power shunt switch with high isolation and ease of assembly

#103
20070275506
2007-11-29

Separation method of semiconductor device

#104
20070248128
2007-10-25

DOUBLE-SIDED MONOLITHICALLY INTEGRATED OPTOELECTRONIC MODULE WITH TEMPERATURE COMPENSATION

#105
20070200110
2007-08-30

Methods of making semiconductor-based electronic devices on a wire and articles that can be made thereby

#106
20070158778
2007-07-12

Device for implementing an inverter having a reduced size

#107
20070120153
2007-05-31

Rugged MESFET for Power Applications

#108
20070096081
2007-05-03

High-heat-resistant semiconductor device

#109
20070051979
2007-03-08

Semiconductor device

#110
20070023901
2007-02-01

Microelectronic bond pad

#111
20070023897
2007-02-01

Semiconductor device, power amplifier device and PC card

#112
20060292744
2006-12-28

Three dimensional device integration method and integrated device

#113
20060286785
2006-12-21

Stretchable form of single crystal silicon for high performance electronics on rubber substrates

#114
20060108684
2006-05-25

Power module, and phase leg assembly

#115
20060097320
2006-05-11

Vertical protecting element formed in semiconductor substrate and semiconductor device using the same

#116
20060055027
2006-03-16

Semiconductor apparatus including power semiconductor device constructed by using wide band gap semiconductor

#117
20060038182
2006-02-23

Stretchable semiconductor elements and stretchable electrical circuits

#118
20060006414
2006-01-12

AlGaN/GaN high electron mobility transistor devices

#119
20050285117
2005-12-29

Adhesion and/or encapsulation of silicon carbide-based semiconductor devices on ceramic substrates

#120
20050263822
2005-12-01

Semiconductor device and manufacturing method thereof

#121
20050218500
2005-10-06

Split-gate power module for suppressing oscillation therein

#122
20050207133
2005-09-22

Embedded power management control circuit

#123
20050194671
2005-09-08

High frequency semiconductor device

#124
20050098862
2005-05-12

Lead frame and semiconductor device having the same as well as method of resin-molding the same

#125
20050051870
2005-03-10

Semiconductor device having transferred integrated circuit

#126
20050012123
2005-01-20

Semiconductor device having a flip-chip construction

#127
20050006742
2005-01-13

High frequency semiconductor module, high frequency semiconductor device and manufacturing method for the same

#128
17014368
2022-03-15

Power MOSFET and JBSFET cell topologies with superior high frequency figure of merit

#129
16410016
2021-01-05

RFID integrated circuits with antenna contacts on multiple surfaces

#130
15870775
2019-06-04

RFID integrated circuits with antenna contacts on multiple surfaces