H01L2924/15158 - CPC Classification Index

ClassID:

212607 ⎘

H01L2924/15158 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Die mounting substrate; Shape the die mounting substrate being other than a cuboid

Sub-classes:

H01L2924/15159 » Side view 305
H01L2924/15162 » Top view 71

Recent Application in this class:

20190304931

NON-RECTANGULAR ELECTRONIC DEVICE COMPONENTS

20180336393

FINGERPRINT SENSING UNIT

20170186705

Non-rectangular electronic device components

20170076134

Fingerprint sensing unit and fingerprint sensing module

20120127660

CYLINDRICAL PACKAGES, ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHODS OF FABRICATING THE SAME

20100207244

Semiconductor apparatus with decoupling capacitor

20090096063

Semiconductor apparatus with decoupling capacitor

20070296069

Semiconductor apparatus with decoupling capacitor

20060012364

Magnetic detection device and method for manufacture

20050056924

Semiconductor apparatus with decoupling capacitor

14850966

IC package having non-horizontal die pad and lead frame therefor