212613 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Die mounting substrate; Multilayer substrate; Fan-out arrangement of the internal vias in a single layer of the multilayer substrate
METHOD OF FORMING PACKAGE STRUCTURE
#2METHOD OF FORMING SEMICONDUCTOR PACKAGES HAVING THERMAL THROUGH VIAS (TTV)
#3Package structure
#4Chip-on-film and display including the same
#5Semiconductor packages having thermal through vias (TTV)
#6Connecting electronic components to substrates
#7Method of making flexible semiconductor device with graphene tape
#8Film for a package substrate
#9Semiconductor package
#10High bandwidth memory package for high performance processors
#11Package structure and method of manufacturing the same
#12Scalable phased array package
#13Chip-on-film and display including the same
#14Semiconductor device and method for manufacturing the same
#15Semiconductor chip package for improving freedom of arrangement of external terminals
#16Film for package substrate, semiconductor package, display device, and methods of fabricating the film, the semiconductor package, the display device
#17Package structure and method of manufacturing the same
#18Semiconductor package having an electro-magnetic interference shielding or electro-magnetic wave scattering structure
#19Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
#20Flexible semiconductor device with graphene tape
#21High-frequency component
#22Integrated fan-out structure with openings in buffer layer
#23Mounting member, electronic component, and method for manufacturing module
#24Semiconductor device grid array package
#25Semiconductor package with package-on-package stacking capability and method of manufacturing the same
#26Thermal dissipation through seal rings in 3DIC structure
#27Semiconductor device and manufacturing method thereof
#28Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof
#29Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof
#30Extended redistribution layers bumped wafer
#31Semiconductor device and manufacturing method thereof
#32Semiconductor package with bonding wires of reduced loop inductance
#33Package-in-package using through-hole via die on saw streets
#34Method of fabricating semiconductor package having substrate with solder ball connections
#35METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT BOARD AND MULTILAYER CIRCUIT BOARD OBTAINED BY THE METHOD
#36Method of producing multilayer circuit board
#37Semiconductor device
#38Semiconductor device and manufacturing method thereof
#39Semiconductor package with bonding wires of reduced loop inductance
#40Flexible packaging for chip-on-chip and package-on-package technologies
#41Semiconductor component and device provided with heat dissipation means
#42SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAME
#43SEMICONDUCTOR POWER DEVICE HAVING A STACKED DISCRETE INDUCTOR STRUCTURE
#44Device including an encapsulated semiconductor chip and manufacturing method thereof
#45Semiconductor package
#46SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#47Ball grid array package enhanced with a thermal and electrical connector
#48Semiconductor Package and Manufacturing Methods Thereof
#49Semiconductor device and method of forming electrical interconnect with stress relief void
#50Manufacturing method of semiconductor device
#51Wiring board, semiconductor device, and method of manufacturing the same
#52SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#53Molded ultra thin semiconductor die packages, systems using the same, and methods of making the same
#54Semiconductor package
#55Semiconductor device and method of manufacturing the same
#56Semiconductor chip, film substrate, and related semiconductor chip package
#57Semiconductor wiring assembly, semiconductor composite wiring assembly, and resin-sealed semiconductor device
#58Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof
#59Lead frame routed chip pads for semiconductor packages
#60Semiconductor package having substrate with solder ball connections and method of fabricating the same
#61Semiconductor device and method of manufacturing the same
#62Semiconductor package
#63Semiconductor device and method of stacking same size semiconductor die electrically connected through conductive via formed around periphery of the die
#64Flexible packaging for chip-on-chip and package-on-package technologies
#65Semiconductor device having wiring layers with power-supply plane and ground plane
#66MULTI-CHIP PACKAGE
#67Semiconductor apparatus with decoupling capacitor
#68Semiconductor package formed within an encapsulation
#69Semiconductor device and method for manufacturing the same
#70Extended redistribution layers bumped wafer
#71Flash memory card
#72Manufacturing method for semiconductor device embedded substrate
#73Packaging systems and methods
#74Molded ultra thin semiconductor die packages, systems using the same, and methods of making the same
#75Semiconductor device and manufacturing method thereof
#76Semiconductor device and semiconductor integrated circuit
#77SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAME
#78SEMICONDUCTOR PACKAGE, MOUNTING CIRCUIT BOARD, AND MOUNTING STRUCTURE
#79Method of producing circuit board
#80Method of producing a circuit board
#81Through-hole via on saw streets
#82Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon
#83Semiconductor packages and methods of fabricating the same
#84Electronic device substrate and its fabrication method, and electronic device and its fabrication method
#85Wiring substrate for use in semiconductor apparatus, method for fabricating the same, and semiconductor apparatus using the same
#86Integrated circuit having wide power lines
#87Wafer Level Chip Scale Packages Including Redistribution Substrates and Methods of Fabricating the Same
#88Method of manufacturing semiconductor device
#89Integrated circuit incorporating wire bond inductance
#90Electronic device and method of manufacturing thereof
#91Semiconductor device and method of manufacturing the same
#92Thin semiconductor device package
#93Semiconductor apparatus with decoupling capacitor
#94Memory Packages Having Stair Step Interconnection Layers
#95Wiring substrate, tape package having the same, display device having the tape package, method of manufacturing the wiring substrate, method of manufacturing a tape package having the same and method of manufacturing a display device having the tape package
#96Ball grid array package enhanced with a thermal and electrical connector
#97Fan out type wafer level package structure and method of the same
#98Semiconductor device and printed circuit board
#99Tapered dielectric and conductor structures and applications thereof
#100Integrated circuit package and system interface
#101Method of manufacturing printed wiring board
#102Semiconductor package
#103Semiconductor power device having a stacked discrete inductor structure
#104High performance chip carrier substrate
#105Semiconductor package
#106High performance chip carrier substrate
#107Flash memory card
#108Method of assembling electronic components of an electronic system, and system thus obtained
#109Package-in-package using through-hole via die on saw streets
#110Through-hole via on saw streets
#111Same size die stacked package having through-hole vias formed in organic material
#112Extended redistribution layers bumped wafer
#113Integrated circuit device with embedded passive component by flip-chip connection and method for manufacturing the same
#114Semiconductor device and its manufacturing method
#115CHIP PACKAGE STRUCTURE
#116Method for fabricating an electronic device substrate
#117Structure and method of high performance two layer ball grid array substrate
#118Wafer level package with die receiving through-hole and method of the same
#119Semiconductor device
#120Semiconductor device and printed circuit board
#121Fan out type wafer level package structure and method of the same
#122PRINTED-WIRING BOARD, METHOD FOR FORMING ELECTRODE OF THE BOARD, AND HARD DISK DEVICE
#123I/O Architecture for integrated circuit package
#124Wiring board and semiconductor device
#125Integrated circuit package and system interface
#126Stackable ceramic FBGA for high thermal applications
#127Integrated circuit incorporating wire bond inductance
#128Semiconductor apparatus with decoupling capacitor
#129Semiconductor device
#130Manufacturing a bump electrode with roughened face
#131Method for applying rewiring to a panel while compensating for position errors of semiconductor chips in component positions of the panel
#132Thin semiconductor device package
#133Chip with power and signal pads connected to power and signal lines on substrate
#134Connecting device for electronic components
#135Semiconductor device
#136Wiring substrate of a semiconductor component comprising rubber-elastic pads embedded in said wiring substrate and method for producing the same
#137Electronic circuit, a semiconductor device and a mounting substrate
#138Wiring board and semiconductor apparatus
#139High performance chip carrier substrate
#140Printed wiring board for mounting semiconductor
#141Method of manufacturing wiring substrate
#142Semiconductor chip, film substrate, and related semiconductor chip package
#143Circuit substrate and method of manufacture
#144Semiconductor package form within an encapsulation
#145Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon
#146Semiconductor device, fabrication method therefor, and film fabrication method
#147Reduction of Electromagnetic Interference in Integrated Circuit Device Packages
#148Wiring board, semiconductor device, and method of manufacturing the same
#149Depopulation of a ball grid array to allow via placement
#150Flash memory card
#151Flash memory card
#152Selective consolidation methods for fabricating semiconductor device components and conductive features thereof
#153Fan out type wafer level package structure and method of the same
#154Electronic device and method of manufacturing thereof
#155Semiconductor device and method of manufacturing the same
#156High current semiconductor device system having low resistance and inductance
#157Semiconductor chip and multi-chip package
#158Semiconductor device and method of manufacturing the same
#159High speed interface design
#160Ball grid array package enhanced with a thermal and electrical connector
#161Semiconductor device
#162System, method and apparatus for routing signals from an integrated circuit using thickfilm and printed circuit interconnects
#163System for assembling electronic components of an electronic system
#164Screen mask
#165Memory packages having stair step interconnection layers
#166Method and system for an improved package substrate for use with a semiconductor package
#167Fan out type wafer level package structure and method of the same
#168Electronic device substrate and its fabrication method, and electronic device and its fabrication method
#169High frequency integrated circuit (HFIC) microsystems assembly and method for fabricating the same
#170Semiconductor device and method of manufacturing the same
#171Semiconductor device
#172Method of manufacturing semiconductor device
#173Universal pattern of contact pads for semiconductor reflow interconnections
#174IC package with signal land pads
#175Device packages having stable wirebonds
#176Tile-based routing method of a multi-layer circuit board and related structure
#177Multi-level semiconductor module and method for fabricating the same
#178Compact system module with built-in thermoelectric cooling
#179Ball assignment schemes for integrated circuit packages
#180Wiring board having connecting wiring between electrode plane and connecting pad
#181Component with ultra-high frequency connections in a substrate
#182Fan out type wafer level package structure and method of the same
#183IC package structures having separate circuit interconnection structures and assemblies constructed thereof
#184Semiconductor device and method for manufacture thereof, circuit board, and electronic instrument
#185Fine pitch grid array type semiconductor device
#186Multi-terminal device and printed wiring board
#187Structure and method of high performance two layer ball grid array substrate
#188Method of manufacturing printed wiring board
#189Tin-plated film and method for producing the same
#190High wireability microvia substrate
#191Stacking system and method
#192Semiconductor device
#193Semiconductor device
#194Wire bonding method and apparatus for integrated circuit
#195Semiconductor device
#196Method and structure for implementing enhanced electronic packaging and PCB layout with diagonal vias
#197Mounting with auxiliary bumps
#198Integrated circuit package with improved electro-static discharge protection
#199Fan out type wafer level package structure and method of the same
#200Voltage reference signal circuit layout inside multi-layered substrate
#201Flip-chip type semiconductor devices and conductive elements thereof
#202Semiconductor device and printed circuit board
#203Conductive elements with adjacent, mutually adhered regions and semiconductor device assemblies including such conductive elements
#204Semiconductor package having a high-speed signal input/output terminal
#205Carrier substrates and conductive elements thereof
#206Semiconductor device
#207Semiconductor device assemblies and packages including multiple semiconductor device components
#208Wiring board and process for producing the same
#209LSI package, LSI element testing method, and semiconductor device manufacturing method
#210Semiconductor device manufacturing method and manufacturing apparatus
#211Semiconductor integrated circuit device
#212Fabrication method of semiconductor package with photosensitive chip
#213Board for mounting BGA semiconductor chip thereon, semiconductor device, and methods of fabricating such board and semiconductor device
#214Structure of stacked vias in multiple layer electrode device carriers
#215Electronic component package
#216Semiconductor integrated circuit device
#217Stackable ceramic FBGA for high thermal applications
#218I/O architecture for integrated circuit package
#219Semiconductor device and electronic equipment using the same
#220Semiconductor integrated circuit device
#221Tapered dielectric and conductor structures and applications thereof
#222Method of assembling a ball grid array package with patterned stiffener layer
#223Ball grid array package substrates with a modified central opening and method for making the same
#224Fan out type wafer level package structure and method of the same
#225Lead-free integrated circuit package structure
#226Integrated circuit and method of manufacturing an integrated circuit and package
#227Routing scheme for differential pairs in flip chip substrates
#228High performance chip carrier substrate
#229High wireability microvia substrate
#230Integrated circuit carrier apparatus method and system
#231Method of fabricating the routing of electrical signals
#232Semiconductor device and method of manufacturing the same
#233Semiconductor package having discrete non-active electrical components incorporated into the package
#234Multi-surface contact IC packaging structures and assemblies
#235Semiconductor package capable of absorbing electromagnetic wave
#236Depopulation of a ball grid array to allow via placement
#237Optimization of routing layers and board space requirements for a ball grid array package
#238Optimization of routing layers and board space requirements for a ball grid array land pattern
#239Memory expansion and chip scale stacking system and method
#240Manufacturing a bump electrode with roughened face
#241Memory expansion and chip scale stacking system and method
#242Semiconductor device
#243Semiconductor apparatus with decoupling capacitor
#244Integrated circuit package
#245I/O architecture for integrated circuit package
#246Die-up ball grid array package including a substrate capable of mounting an integrated circuit die and method for making the same
#247Method and apparatus for evaluating and adjusting microwave integrated circuit
#248Integrated circuit device with embedded passive component by flip-chip connection and method for manufacturing the same
#249Optimization of routing layers and board space requirements for ball grid array package implementations including array corner considerations
#250Flip chip die bond pads, die bond pad placement and routing optimization
#251Die-up ball grid array package including a substrate having an opening and method for making the same
#252Semiconductor device and an electronic device
#253Methods for consolidating previously unconsolidated conductive material to form conductive structures or contact pads or secure conductive structures to contact pads
#254Printed wiring board and manufacturing method therefor
#255Intermediate substrate, intermediate substrate with semiconductor element, substrate with intermediate substrate, and structure having semiconductor element, intermediate substrate and substrate
#256Semiconductor device
#257Method for optimizing routing layers and board space requirements for a ball grid array land pattern
#258Via and via landing structures for smoothing transitions in multi-layer substrates
#259Chip mounting substrate, first level assembly, and second level assembly
#260Selective consolidation processes for electrically connecting contacts of semiconductor device components
#261Electronic device carrier adapted for transmitting high frequency signals
#262Printed wiring board for mounting semiconductor
#263Integrated fan-out package and method of fabricating the same