212632 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Die mounting substrate; Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate being a land array, e.g. LGA
CHIP SYSTEM AND COMMUNICATION DEVICE
#2INTEGRATED HALF-BRIDGE POWER CONVERTER
#3Integrated half-bridge power converter
#4Package on antenna package
#5Semiconductor device with recess and method of making
#6Packaged integrated circuit device with cantilever structure
#7Semiconductor integrated circuit device
#8Multi-surface edge pads for vertical mount packages and methods of making package stacks
#9Packaged integrated circuit device with cantilever structure
#10SUBSTRATE, CHIP PACKAGE WITH SAME AND METHOD FOR MANUFACTURING SAME
#11Wiring substrate
#12Semiconductor device
#13Batch process fabrication of package-on-package microelectronic assemblies
#14Printed circuit board
#15Semiconductor package and semiconductor device
#16Semiconductor device including semiconductor chips mounted over both surfaces of substrate
#17Package on package devices and methods of packaging semiconductor dies
#18METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION
#19Semiconductor integrated circuit device
#20Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging
#21Package on package devices and methods of packaging semiconductor dies
#22Metallurgical clamshell methods for micro land grid array fabrication
#23Metallurgical clamshell methods for micro land grid array fabrication
#24INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SYMMETRIC PACKAGING
#25Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging
#26Circuit board arrangement
#27Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging