212650 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Cap Structure
Semiconductor Device and Method of Forming Thin Heat Sink Using E-Bar Substrate
#2SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF FORMING THE SAME
#3SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#4REINFORCED STRUCTURE WITH CAPPING LAYER
#5INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
#6Semiconductor Device and Method of Forming Graphene-Coated Core Embedded Within TIM
#7Semiconductor Device and Method Forming Same
#8SEMICONDUCTOR PACKAGE WITH THERMAL CONDUCTIVE STRUCTURE AND THE METHODS OF FORMING THE SAME
#9METHOD FOR FORMING SEMICONDUCTOR PACKAGE STRUCTURE
#10SEMICONDUCTOR DEVICE
#11PACKAGE ASSEMBLY LID AND METHODS FOR FORMING THE SAME
#12PACKAGE ASSMEBLY INCLUDING LID WITH ADDITIONAL STRESS MTITGATING FEET AND METHODS OF MAKING THE SAME
#13HERMETIC SMD PACKAGE
#14SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
#15CHIPLET INTEGRATION STRUCTURE FOR THERMAL MANAGEMENT
#16LIDDED ELECTRONIC PACKAGE CONTAINING A BATTERY
#17INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
#18DEVICES AND METHODS FOR FORMING DEVICES WITH LIDS
#19PACKAGE STRUCTURE
#20Semiconductor Package With Thermal Conductive Structure and the Methods of Forming the Same
#21SEMICONDUCTOR PACKAGES WITH THERMAL LID AND METHODS OF FORMING THE SAME
#22ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF
#23SEMICONDUCTOR DEVICE
#24BONDING STRUCTURE AND METHOD THEREOF
#25METHOD FOR FORMING SEMICONDUCTOR PACKAGE STRUCTURE
#26ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
#27SEMICONDUCTOR PACKAGE WITH A HEAT DISSIPATION MEMBER
#28Integrated Circuit Packages and Methods of Forming the Same
#29Semiconductor Device and Method of Forming Graphene-Coated Core Embedded Within TIM
#30Semiconductor Device and Method of Forming Thin Heat Sink Using E-Bar Substrate
#31Semiconductor Device and Method Forming Same
#32REINFORCED STRUCTURE WITH CAPPING LAYER AND METHODS OF FORMING THE SAME
#33SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF FORMING THE SAME
#34Package assembly lid and methods for forming the same
#35Bonding structure and method thereof
#36MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS AROUND INDIVIDUAL DIES
#37POWER MODULE
#38POWER SEMICONDUCTOR MODULE, METHOD FOR ASSEMBLING A POWER SEMICONDUCTOR MODULE AND HOUSING FOR A POWER SEMICONDUCTOR MODULE
#39Semiconductor Device and Method for Manufacturing The Same
#40HIGH-FREQUENCEY PACKAGE, HIGH-FREQUENCY MODULE, AND RADIO WAVE ABSORPTION METHOD
#41SEMICONDUCTOR DEVICE
#42Semiconductor device and manufacturing method thereof
#43Semiconductor Packages with Thermal Lid and Methods of Forming the Same
#44SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#45Package assembly including lid with additional stress mitigating feet and methods of making the same
#46Semiconductor package structure and method for forming the same
#47Package structures and method for forming the same
#48Semiconductor device and manufacturing method thereof
#49DIC package comprising perforated foil sheet
#50Packaging structures with improved adhesion and strength
#51Chip on film package and heat-dissipation structure for a chip package
#52Packaging structures with improved adhesion and strength
#533DIC package comprising perforated foil sheet
#54Electronic module and method of manufacturing the same
#55Semiconductor device having improved heat sink
#56Semiconductor device having improved heat sink