Patents-Review.com
ClassID:

212716 ⎘

H01L2924/181 - page 22 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected Encapsulation

Recent Application in this class:
#6301
20120267950
2012-10-25

ENGINE START CONTROL APPARATUS

 #6302
20120267800
2012-10-25

Semiconductor device and method of forming IPD in fan-out wafer level chip scale package

 #6303
20120267797
2012-10-25

Flip-chip, face-up and face-down wirebond combination package

 #6304
20120267796
2012-10-25

Flip-chip, face-up and face-down centerbond memory wirebond assemblies

 #6305
20120267784
2012-10-25

Semiconductor device with a layer including niobium, and/or tantalum overlying a contact pad or a metal layer

 #6306
20120267774
2012-10-25

Method of manufacturing a semiconductor device

 #6307
20120267772
2012-10-25

Semiconductor device and method of manufacturing the same

 #6308
20120267771
2012-10-25

Stacked chip-on-board module with edge connector

 #6309
20120267682
2012-10-25

Semiconductor device

 #6310
20120267663
2012-10-25

LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF

 #6311
20120264258
2012-10-18

Method of assembling semiconductor device including insulating substrate and heat sink

 #6312
20120264257
2012-10-18

MOLD ARRAY PROCESS METHOD TO PREVENT EXPOSURE OF SUBSTRATE PERIPHERIES

 #6313
20120264240
2012-10-18

Semiconductor device and manufacturing method thereof

 #6314
20120263946
2012-10-18

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR WAFER PROVIDED WITH ADHESIVE LAYER

 #6315
20120263244
2012-10-18

Integrated circuit with electromagnetic communication

 #6316
20120262052
2012-10-18

Phosphor composition and method for producing the same, and light-emitting device using the same

 #6317
20120261841
2012-10-18

Article and panel comprising semiconductor chips, casting mold and methods of producing the same

 #6318
20120261840
2012-10-18

SEMICONDUCTOR DEVICE

 #6319
20120261837
2012-10-18

Semiconductor device

 #6320
20120261825
2012-10-18

Semiconductor device

 #6321
20120261820
2012-10-18

ASSEMBLY OF STACKED DEVICES WITH SEMICONDUCTOR COMPONENTS

 #6322
20120261818
2012-10-18

Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation

 #6323
20120261817
2012-10-18

Semiconductor Device and Method of Providing Common Voltage Bus and Wire Bondable Redistribution

 #6324
20120261816
2012-10-18

DEVICE PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

 #6325
20120261814
2012-10-18

Packaging an electronic device

 #6326
20120261808
2012-10-18

Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof

 #6327
20120261807
2012-10-18

Epoxy resin composition for semiconductor encapsulation, cured product thereof, and semiconductor device

 #6328
20120261796
2012-10-18

Die arrangements containing an inductor coil and methods of manufacturing a die arrangement containing an inductor coil

 #6329
20120261703
2012-10-18

Self-cooling solid-state emitters

 #6330
20120261699
2012-10-18

Reflecting resin sheet, light emitting diode device and producing method thereof

 #6331
20120261692
2012-10-18

LED package structure

 #6332
20120261691
2012-10-18

LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF

 #6333
20120261689
2012-10-18

SEMICONDUCTOR DEVICE PACKAGES AND RELATED METHODS

 #6334
20120261176
2012-10-18

Circuit board structure and packaging structure comprising the circuit board structure

 #6335
20120261169
2012-10-18

Interconnect-use electronic component and method for producing same

 #6336
20120260502
2012-10-18

Method for making circuit board

 #6337
20120258571
2012-10-11

Method for fabricating a semiconductor and semiconductor package

 #6338
20120257075
2012-10-11

Compact low-flare solid-state imaging apparatus and electronic system comprising a compact low-flare solid-state imaging apparatus

 #6339
20120256533
2012-10-11

Phosphor, method for producing phosphor, phosphor-containing composition, light-emitting device, lighting system and image display device

 #6340
20120256326
2012-10-11

ADHESIVE COMPOSITION, SEMICONDUCTOR DEVICE MAKING USE THEREOF, AND PRODUCTION METHOD THEREOF

 #6341
20120256323
2012-10-11

Method for processing a semiconductor wafer or die, and particle deposition device

 #6342
20120256315
2012-10-11

Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device

 #6343
20120256306
2012-10-11

Exposed die package for direct surface mounting

 #6344
20120256305
2012-10-11

Integrated Circuit Package Security Fence

 #6345
20120256300
2012-10-11

Semiconductor device with through silicon via and alignment mark

 #6346
20120256290
2012-10-11

Microstructure device comprising a face to face electromagnetic near field coupling between stacked device portions and method of forming the device

 #6347
20120256239
2012-10-11

Ultra-thin power transistor and synchronous buck converter having customized footprint

 #6348
20120256224
2012-10-11

INSULATED SUBSTRATE, PROCESS FOR PRODUCTION OF INSULATED SUBSTRATE, PROCESS FOR FORMATION OF WIRING LINE, WIRING SUBSTRATE, AND LIGHT-EMITTING ELEMENT

 #6349
20120256222
2012-10-11

PHOSPHOR AND LIGHT-EMITTING DEVICE

 #6350
20120256194
2012-10-11

Semiconductor device

 #6351
20120252169
2012-10-04

REDISTRIBUTED CHIP PACKAGING WITH THERMAL CONTACT TO DEVICE BACKSIDE

 #6352
20120252168
2012-10-04

Copper post solder bumps on substrate

 #6353
20120252167
2012-10-04

Potted integrated circuit device with aluminum case

 #6354
20120252166
2012-10-04

Semiconductor device manufacturing apparatus and method for manufacturing semiconductor device

 #6355
20120252165
2012-10-04

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

 #6356
20120252163
2012-10-04

Stacked package, method of fabricating stacked package, and method of mounting stacked package fabricated by the method

 #6357
20120250925
2012-10-04

Packages and methods for packaging microphone devices

 #6358
20120250329
2012-10-04

Light emitting device

 #6359
20120250326
2012-10-04

Luminous-Body Flexible Board and Luminous Device

 #6360
20120249893
2012-10-04

TELEVISION APPARATUS AND ELECTRONIC APPARATUS

 #6361
20120249380
2012-10-04

Integrated circuit package including miniature antenna

 #6362
20120248634
2012-10-04

METHOD FOR MANUFACTURING FILM-LIKE ADHESIVE, ADHESIVE SHEET, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

 #6363
20120248632
2012-10-04

Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device

 #6364
20120248631
2012-10-04

Method for manufacturing semiconductor devices having a glass substrate

 #6365
20120248630
2012-10-04

Hybrid integrated circuit device and electronic device

 #6366
20120248628
2012-10-04

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

 #6367
20120248620
2012-10-04

Semiconductor device

 #6368
20120248618
2012-10-04

Semiconductor device having pad region for wire-bonding and method of manufacturing the semiconductor device

 #6369
20120248601
2012-10-04

Method of making a semiconductor device comprising a land grid array flip chip bump system with short bumps

 #6370
20120248596
2012-10-04

Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure

 #6371
20120248595
2012-10-04

3D semiconductor device and structure with back-bias

 #6372
20120248592
2012-10-04

Lead component and method for manufacturing the same, and semiconductor package

 #6373
20120248590
2012-10-04

Semiconductor package and lead frame therefor

 #6374
20120248589
2012-10-04

LEAD FRAME WITH COINED INNER LEADS

 #6375
20120248539
2012-10-04

Flip chip semiconductor device

 #6376
20120248521
2012-10-04

Power converter having integrated capacitor

 #6377
20120248495
2012-10-04

Light-reflective anisotropic conductive paste and light-emitting device

 #6378
20120248492
2012-10-04

Optoelectronic component

 #6379
20120248484
2012-10-04

Light emitting diode device and producing method thereof

 #6380
20120248481
2012-10-04

Wafer level light emitting diode package and method of fabricating the same

 #6381
20120248439
2012-10-04

Semiconductor packages

 #6382
20120244664
2012-09-27

Reducing warpage for fan-out wafer level packaging

 #6383
20120244661
2012-09-27

Method of fabricating semiconductor die with through-hole via on saw streets and through-hole via in active area of die

 #6384
20120244642
2012-09-27

Semiconductor device and method of manufacturing the same

 #6385
20120244351
2012-09-27

MULTILAYER RESIN SHEET AND METHOD FOR PRODUCING THE SAME, METHOD FOR PRODUCING CURED MULTILAYER RESIN SHEET, AND HIGHLY THERMALLY CONDUCTIVE RESIN SHEET LAMINATE AND METHOD FOR PRODUCING THE SAME

 #6386
20120244347
2012-09-27

METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP, ADHESIVE FILM FOR SEMICONDUCTOR, AND COMPOSITE SHEET USING THE FILM

 #6387
20120241984
2012-09-27

Semiconductor device and method of forming pad layout for flipchip semiconductor die

 #6388
20120241980
2012-09-27

Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereof

 #6389
20120241979
2012-09-27

Integrated circuit packaging system with step mold and method of manufacture thereof

 #6390
20120241973
2012-09-27

Integrated circuit packaging system with filled vias and method of manufacture thereof

 #6391
20120241971
2012-09-27

Semiconductor device

 #6392
20120241968
2012-09-27

Integrated circuit packaging system with interconnects and method of manufacture thereof

 #6393
20120241967
2012-09-27

Integrated circuit packaging system with embedded conductive structure and method of manufacture thereof

 #6394
20120241966
2012-09-27

Integrated circuit packaging system with plated leads and method of manufacture thereof

 #6395
20120241962
2012-09-27

Integrated circuit packaging system with lead frame etching and method of manufacture thereof

 #6396
20120241957
2012-09-27

Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods

 #6397
20120241956
2012-09-27

Techniques for packaging multiple device components

 #6398
20120241955
2012-09-27

Chip scale package assembly in reconstitution panel process format

 #6399
20120241954
2012-09-27

Unpackaged and packaged IC stacked in a system-in-package module

 #6400
20120241950
2012-09-27

Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus

 #6401
20120241948
2012-09-27

Integrated circuit packaging system with pads and method of manufacture thereof

 #6402
20120241947
2012-09-27

Integrated circuit packaging system with locking interconnects and method of manufacture thereof

 #6403
20120241946
2012-09-27

Semiconductor Device and Method of Forming High Routing Density Interconnect Sites on Substrate

 #6404
20120241945
2012-09-27

Semiconductor device and method of forming flipchip interconnect structure

 #6405
20120241940
2012-09-27

Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation

 #6406
20120241939
2012-09-27

Apparatus for thermally enhanced semiconductor package

 #6407
20120241936
2012-09-27

Integrated circuit packaging system with package-on-package and method of manufacture thereof

 #6408
20120241934
2012-09-27

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME

 #6409
20120241933
2012-09-27

Semiconductor memory card

 #6410
20120241931
2012-09-27

Integrated circuit packaging system with interconnects and method of manufacture thereof

 #6411
20120241930
2012-09-27

Folded leadframe multiple die package

 #6412
20120241929
2012-09-27

Leadframe-based mold array package heat spreader and fabrication method therefor

 #6413
20120241928
2012-09-27

Integrated circuit packaging system with flipchip leadframe and method of manufacture thereof

 #6414
20120241927
2012-09-27

Integrated circuit packaging system with transparent encapsulation and method of manufacture thereof

 #6415
20120241926
2012-09-27

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEVELING STANDOFF AND METHOD OF MANUFACTURE THEREOF

 #6416
20120241922
2012-09-27

Integrated circuit packaging system for electromagnetic interference shielding and method of manufacture thereof

 #6417
20120241915
2012-09-27

Semiconductor device and method of forming leadframe with notched fingers for stacking semiconductor die

 #6418
20120241789
2012-09-27

LED package, method for making the LED package and light source having the same

 #6419
20120241781
2012-09-27

Solid state lighting component

 #6420
20120241779
2012-09-27

Light-Radiating Semiconductor Component with a Luminescence Conversion Element

 #6421
20120238233
2012-09-20

Wireless communication system

 #6422
20120238058
2012-09-20

Method of packaging semiconductor die with cap element

 #6423
20120238057
2012-09-20

Approach for bonding dies onto interposers

 #6424
20120238056
2012-09-20

Manufacturing method of semiconductor device

 #6425
20120236568
2012-09-20

Light emitting device package and manufacturing method thereof

 #6426
20120236532
2012-09-20

LED ENGINE FOR ILLUMINATION

 #6427
20120236529
2012-09-20

Method And Apparatus For A Light Source

 #6428
20120236519
2012-09-20

Electronic package structure

 #6429
20120236504
2012-09-20

Electronic device for switching currents and method for producing the same

 #6430
20120236503
2012-09-20

Power semiconductor module and its attachment structure

 #6431
20120235751
2012-09-20

Semiconductor device

 #6432
20120235553
2012-09-20

Spherical Light Output LED Lens and Heat Sink Stem System

 #6433
20120235309
2012-09-20

Semiconductor package with embedded die and manufacturing methods thereof

 #6434
20120235308
2012-09-20

Manufacturing method of semiconductor device, and semiconductor device

 #6435
20120235307
2012-09-20

Integrated circuit packaging system with lead frame stacking module and method of manufacture thereof

 #6436
20120235298
2012-09-20

ELECTRONIC DEVICE AND METHOD FOR PRODUCING A DEVICE

 #6437
20120235293
2012-09-20

SEMICONDUCTOR DEVICE INCLUDING A BASE PLATE

 #6438
20120235289
2012-09-20

Power device with bottom source electrode

 #6439
20120235288
2012-09-20

Semiconductor device and method of manufacturing same

 #6440
20120235286
2012-09-20

Inserts for directing molding compound flow and semiconductor die assemblies

 #6441
20120235278
2012-09-20

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC SYSTEM USING THE SAME

 #6442
20120235259
2012-09-20

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

 #6443
20120235188
2012-09-20

Method and Apparatus for a Flat Top Light Source

 #6444
20120235162
2012-09-20

POWER CONVERTER

 #6445
20120234588
2012-09-20

Low cost high frequency device package and methods

 #6446
20120231586
2012-09-13

Method of manufacturing power semiconductor device

 #6447
20120231585
2012-09-13

Method for packaging a semiconductor structure

 #6448
20120231584
2012-09-13

Semiconductor device manufacturing method

 #6449
20120231583
2012-09-13

DIE-BONDING FILM AND USE THEREOF

 #6450
20120231557
2012-09-13

Method of manufacturing film for semiconductor device

 #6451
20120231236
2012-09-13

Dicing film with protecting film

 #6452
20120230043
2012-09-13

LED mounting substrate

 #6453
20120230010
2012-09-13

FLUORESCENT SUBSTANCE AND LIGHT-EMITTING DEVICE EMPLOYING THE SAME

 #6454
20120230001
2012-09-13

ELECTRONIC DEVICE, PORTABLE ELECTRONIC TERMINAL, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

 #6455
20120229019
2012-09-13

PHOSPHORS, AND LIGHT EMITTING DEVICE EMPLOYING THE SAME

 #6456
20120229016
2012-09-13

Fluorescent substance and light-emitting device employing the same

 #6457
20120228784
2012-09-13

SEMICONDUCTOR DEVICE

 #6458
20120228782
2012-09-13

METHOD FOR MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE PACKAGE AND ELECTRONIC DEVICE PACKAGE

 #6459
20120228779
2012-09-13

Air-gap C4 fluidic I/O interconnects and methods of fabricating same

 #6460
20120228777
2012-09-13

Through silicon via guard ring

 #6461
20120228776
2012-09-13

Semiconductor device adapted to improve heat dissipation

 #6462
20120228767
2012-09-13

Integrated circuit package system with stackable devices and a method of manufacture thereof

 #6463
20120228766
2012-09-13

Semiconductor device and method of confining conductive bump material during reflow with solder mask patch

 #6464
20120228762
2012-09-13

Chip on chip semiconductor device including an underfill layer having a resin containing an amine-based curing agent

 #6465
20120228760
2012-09-13

Systems including an I/O stack and methods for fabricating such systems

 #6466
20120228759
2012-09-13

SEMICONDUCTOR PACKAGE HAVING INTERCONNECTION OF DUAL PARALLEL WIRES

 #6467
20120228756
2012-09-13

Semiconductor housing and method for the production of a semiconductor housing

 #6468
20120228753
2012-09-13

Integrated circuit package-on-package system with underfilling structures and method of manufacture thereof

 #6469
20120228751
2012-09-13

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

 #6470
20120228749
2012-09-13

Semiconductor device and method of forming shielding layer over semiconductor die mounted to TSV interposer

 #6471
20120228696
2012-09-13

STACKED DIE POWER CONVERTER

 #6472
20120228681
2012-09-13

Image and light sensor chip packages

 #6473
20120228660
2012-09-13

Method of manufacturing lead frame for light-emitting device package and light-emitting device package

 #6474
20120228012
2012-09-13

Circuit board and method for manufacturing circuit board

 #6475
20120227952
2012-09-13

Radiator and method of manufacturing radiator

 #6476
20120225523
2012-09-06

Method for attaching wide bus memory and serial memory to a processor within a chip scale package footprint

 #6477
20120225522
2012-09-06

Package 3D interconnection and method of making same

 #6478
20120224335
2012-09-06

Printed circuit board and semiconductor package using the same

 #6479
20120224332
2012-09-06

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BUMP BONDED DIES AND METHOD OF MANUFACTURE THEREOF

 #6480
20120223738
2012-09-06

Method for fabrication of configurable systems

 #6481
20120223444
2012-09-06

Semiconductor device with resin mold

 #6482
20120223441
2012-09-06

Stacked semiconductor device and manufacturing method thereof

 #6483
20120223435
2012-09-06

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADS AND METHOD OF MANUFACTURE THEREOF

 #6484
20120223432
2012-09-06

Moisture barrier for a wire bond

 #6485
20120223428
2012-09-06

Semiconductor device and method of forming vertical interconnect structure between semiconductor die and substrate

 #6486
20120223427
2012-09-06

Flip chip package

 #6487
20120223426
2012-09-06

Semiconductor device and method of forming stress relief layer between die and interconnect structure

 #6488
20120223424
2012-09-06

Semiconductor component and production method

 #6489
20120223326
2012-09-06

Light emitting diode and method for fabricating the same

 #6490
20120222895
2012-09-06

Many-up wiring substrate, wiring substrate, and electronic device

 #6491
20120220089
2012-08-30

Compound semiconductor device and method for manufacturing the same

 #6492
20120220082
2012-08-30

Semiconductor packages and methods of packaging semiconductor devices

 #6493
20120220080
2012-08-30

Method for fabricating flip-attached and underfilled semiconductor devices

 #6494
20120220059
2012-08-30

Method for producing light-emitting diode device

 #6495
20120218783
2012-08-30

Compound semiconductor device and method for manufacturing the same

 #6496
20120218729
2012-08-30

Methods of forming a microshield on standard QFN package

 #6497
20120218717
2012-08-30

Power module

 #6498
20120218496
2012-08-30

Red phosphor, method for producing red phosphor, white light source, illuminating device, and liquid crystal display device

 #6499
20120218318
2012-08-30

Light emitting apparatus, illumination apparatus and display apparatus

 #6500
20120217659
2012-08-30

Integrated circuit package with molded cavity

 #6501
20120217657
2012-08-30

MULTI-CHIP MODULE PACKAGE

 #6502
20120217656
2012-08-30

Semiconductor package including multiple chips and separate groups of leads

 #6503
20120217655
2012-08-30

Stacked multi-die electronic device with interposed electrically conductive strap

 #6504
20120217653
2012-08-30

SEMICONDUCTOR DEVICE AND NOISE SUPPRESSING METHOD

 #6505
20120217647
2012-08-30

Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-Applied Protective Layer

 #6506
20120217645
2012-08-30

Semiconductor device and method of forming interposer and opposing build-up interconnect structure with connecting conductive TMV for electrical interconnect of Fo-WLCSP

 #6507
20120217644
2012-08-30

Semiconductor device and method of forming conductive THV and RDL on opposite sides of semiconductor die for RDL-to-RDL bonding

 #6508
20120217643
2012-08-30

Semiconductor device and method of forming bond wires between semiconductor die contact pads and conductive TOV in peripheral area around semiconductor die

 #6509
20120217642
2012-08-30

Semiconductor device packages having a side-by-side device arrangement and stacking functionality

 #6510
20120217640
2012-08-30

Semiconductor device and method of forming bump structure with insulating buffer layer to reduce stress on semiconductor wafer

 #6511
20120217637
2012-08-30

Semiconductor package having substrate for high speed semiconductor package

 #6512
20120217635
2012-08-30

Packaging Structure and Method

 #6513
20120217634
2012-08-30

Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier

 #6514
20120217629
2012-08-30

Semiconductor device and method of forming a wafer level package structure using conductive via and exposed bump

 #6515
20120217627
2012-08-30

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

 #6516
20120217626
2012-08-30

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

 #6517
20120217616
2012-08-30

Semiconductor device and semiconductor device mounting structure

 #6518
20120217591
2012-08-30

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND POWER SUPPLY APPARATUS

 #6519
20120217556
2012-08-30

Mosfet package

 #6520
20120217531
2012-08-30

Semiconductor light emitting device, semiconductor light emitting apparatus, and method for manufacturing semiconductor light emitting device

 #6521
20120217528
2012-08-30

LIGT EMITTING DEVICE

 #6522
20120217524
2012-08-30

Semiconductor light emitting device and light emitting apparatus

 #6523
20120216396
2012-08-30

Non-uniform vacuum profile die attach tip

 #6524
20120214302
2012-08-23

Methods of fabricating semiconductor devices

 #6525
20120212964
2012-08-23

Light emitting diode package with reflective layer

 #6526
20120212164
2012-08-23

SEMICONDUCTOR DEVICE AND DEVICE WITH USE OF IT

 #6527
20120212124
2012-08-23

Light-emitting device with reflection layers

 #6528
20120211904
2012-08-23

Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die

 #6529
20120211901
2012-08-23

Semiconductor device, manufacturing method of semiconductor device, and power source device

 #6530
20120211900
2012-08-23

Semiconductor device and method of forming multi-layered UBM with intermediate insulating buffer layer to reduce stress for semiconductor wafer

 #6531
20120211899
2012-08-23

Semiconductor device, method for manufacturing the same, and power supply unit

 #6532
20120211892
2012-08-23

Semiconductor device and method of forming WLCSP structure using protruded MLP

 #6533
20120211889
2012-08-23

Semiconductor device having agglomerate terminals

 #6534
20120211887
2012-08-23

Bump-on-lead flip chip interconnection

 #6535
20120211882
2012-08-23

Semiconductor device and method of confining conductive bump material with solder mask patch

 #6536
20120211875
2012-08-23

Semiconductor device with stacked semiconductor chips

 #6537
20120211846
2012-08-23

MRAM device and method of assembling same

 #6538
20120211791
2012-08-23

LED Packaging Structure and Fabricating Method Thereof

 #6539
20120211767
2012-08-23

Power converter

 #6540
20120211766
2012-08-23

IMAGE DISPLAY DEVICE AND LIGHT EMISSION DEVICE

 #6541
20120211764
2012-08-23

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

 #6542
20120211762
2012-08-23

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND ELECTRONIC CIRCUIT

 #6543
20120211761
2012-08-23

Semiconductor device and method for manufacturing semiconductor device

 #6544
20120211760
2012-08-23

Semiconductor device including gate electrode provided over active region in P-type nitride semiconductor layer and method of manufacturing the same, and power supply apparatus

 #6545
20120211265
2012-08-23

Flexible circuit assembly without solder

 #6546
20120210438
2012-08-16

Secure Three-Dimensional Mask-Programmed Read-Only Memory

 #6547
20120209100
2012-08-16

Biocompatible packaging

 #6548
20120208326
2012-08-16

Semiconductor Device and Method of Forming Narrow Interconnect Sites on Substrate with Elongated Mask Openings

 #6549
20120208325
2012-08-16

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

 #6550
20120208324
2012-08-16

Manufacturing method of semiconductor device

 #6551
20120208323
2012-08-16

Method for mounting a semiconductor chip on a carrier

 #6552
20120208322
2012-08-16

Semiconductor device and manufacturing method therefor

 #6553
20120208320
2012-08-16

On-Chip RF shields with front side redistribution lines

 #6554
20120207920
2012-08-16

Protecting a mold having a substantially planar surface provided with a plurality of mold cavities

 #6555
20120206888
2012-08-16

Sensor arrangement and chip comprising additional fixing pins

 #6556
20120206673
2012-08-16

Surface light-emitting unit and display device provided with the same

 #6557
20120206671
2012-08-16

White LED, backlight using the same, and liquid crystal display device

 #6558
20120206039
2012-08-16

Phosphor distribution in LED lamps using centrifugal force

 #6559
20120205822
2012-08-16

RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE USING THE RESIN COMPOSITION

 #6560
20120205816
2012-08-16

Semiconductor chip and fabricating method thereof

 #6561
20120205811
2012-08-16

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TERMINAL LOCKS AND METHOD OF MANUFACTURE THEREOF

 #6562
20120205795
2012-08-16

Stacked package including spacers and method of manufacturing the same

 #6563
20120205790
2012-08-16

Semiconductor device including a lead frame

 #6564
20120205789
2012-08-16

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

 #6565
20120205696
2012-08-16

LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THEREOF

 #6566
20120205689
2012-08-16

Light emitting devices

 #6567
20120205674
2012-08-16

Light emitting device having surface-modified silicate luminophores

 #6568
20120205663
2012-08-16

Semiconductor device, power-supply unit, amplifier and method of manufacturing semiconductor device

 #6569
20120203954
2012-08-09

DATA STORAGE DEVICE

 #6570
20120202436
2012-08-09

SINGLE-PACKAGE WIRELESS COMMUNICATION DEVICE

 #6571
20120201025
2012-08-09

Lighting apparatus providing increased luminous flux while maintaining color point and CRI

 #6572
20120200965
2012-08-09

Electronic component device and package substrate

 #6573
20120200303
2012-08-09

High bandwidth passive switching current sensor

 #6574
20120200281
2012-08-09

Three-Dimensional Power Supply Module Having Reduced Switch Node Ringing

 #6575
20120199991
2012-08-09

Semiconductor device and method for producing the same, and power supply

 #6576
20120199990
2012-08-09

Semiconductor module having deflecting conductive layer over a spacer structure

 #6577
20120199988
2012-08-09

METHOD OF MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, AND APPARATUS FOR MANUFACTURING ELECTRONIC DEVICE

 #6578
20120199972
2012-08-09

Semiconductor device having a vertical interconnect structure using stud bumps

 #6579
20120199971
2012-08-09

Embedded semiconductor die package and method of making the same using metal frame carrier

 #6580
20120199968
2012-08-09

SEMICONDUCTOR PACKAGE

 #6581
20120199966
2012-08-09

Elongated bump structure for semiconductor devices

 #6582
20120199965
2012-08-09

Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation

 #6583
20120199964
2012-08-09

ELECTRONIC DEVICE HAVING STACK-TYPE SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

 #6584
20120199963
2012-08-09

Package-on-package using through-hole via die on saw streets

 #6585
20120199962
2012-08-09

Semiconductor package with cantilever leads

 #6586
20120199961
2012-08-09

SEMICONDUCTOR PACKAGES HAVING LEAD FRAMES

 #6587
20120199958
2012-08-09

Method of manufacturing high frequency module and high frequency module

 #6588
20120199955
2012-08-09

Package carrier and manufacturing method thereof

 #6589
20120199911
2012-08-09

Vertical discrete device with drain and gate electrodes on the same surface and method for making the same

 #6590
20120199862
2012-08-09

Light emitting diode package structure

 #6591
20120199851
2012-08-09

Semiconductor relay

 #6592
20120199844
2012-08-09

Nitride-based semiconductor device and method for fabricating the same

 #6593
20120196409
2012-08-02

3D semiconductor device

 #6594
20120196405
2012-08-02

Method for manufacturing semiconductor device including removing a resin burr

 #6595
20120196404
2012-08-02

Adhesive compositions for a semiconductor, an adhesive sheet for a semiconductor and a production method of a semiconductor device

 #6596
20120196403
2012-08-02

Rule-based semiconductor die stacking and bonding within a multi-die package

 #6597
20120196393
2012-08-02

Packaging method of wafer level chips

 #6598
20120193812
2012-08-02

Semiconductor packages and methods of packaging semiconductor devices

 #6599
20120193805
2012-08-02

Dual molded multi-chip package system

 #6600
20120193802
2012-08-02

GLOB TOP SEMICONDUCTOR PACKAGE