Printed circuit board

Linked semiconductor module unit and electronic circuit-integrated motor vehicle device using same

Radio-frequency system in package including antenna

Luminescent material

PACKAGE PROCESS AND PACKAGE STRUCTURE

Layered chip package

Semiconductor device including two heat sinks and method of manufacturing the same

Package and the Method for Making the Same, and a Stacked Package

Semiconductor package and method of forming the same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Package with heat transfer

Package manufacturing method and semiconductor device

Semiconductor chip package and method of manufacturing the same

FLAT CHIP PACKAGE AND FABRICATION METHOD THEREOF

Semiconductor packaging structure having conductive gel to package semiconductor device

IC PACKAGE DESIGN WITH STRESS RELIEF FEATURE

Semiconductor device with embedded interconnect pad

Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same

Integrated circuit package system using heat slug

Semiconductor Device and Method of Forming Inductor Over Insulating Material Filled Trench In Substrate

Group III nitride semiconductor light emitting device and production method thereof, and lamp

Light-emitting diode lamp with uniform resin coating

Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member

Semiconductor device and manufacturing method thereof

Methods of operating electronic devices, and methods of providing electronic devices

Power amplifier and signal transceiving system

ULTRASONIC BONDING EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

Molded chip fabrication method and apparatus

Semiconductor device and power supply device using the same

Illuminating device and packaging method thereof

MEMORY CARD

Die package including encapsulated die and method of manufacturing the same

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Integrated circuit package-in-package system with side-by-side and offset stacking and method for manufacturing thereof

Adhesive film for semiconductor and semiconductor device using the adhesive film

Semiconductor package with substrate having single metal layer and manufacturing methods thereof

Integrated circuit package system with redistribution layer and method for manufacturing thereof

Integrated circuit packaging system with through via die having pedestal and recess and method of manufacture thereof

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

Wafer level stack structure for system-in-package and method thereof

Chip package structure and manufacturing methods thereof

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONTACT PADS AND METHOD OF MANUFACTURE THEREOF

Integrated circuit packaging system with a leadframe having radial-segments and method of manufacture thereof

Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die

Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof

Packaged integrated circuit devices with through-body conductive vias, and methods of making same

Laminated body of semiconductor chips including pads mutually connected to conductive member

Integrated circuit packaging system with a dual substrate package and method of manufacture thereof

Integrated circuit packaging system with inward and outward interconnects and method of manufacture thereof

Metallic leadframes having laser-treated surfaces for improved adhesion to polymeric compounds

Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same

Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structure

Standing chip scale package

Phosphor converting IR LEDs

METHOD FOR MAKING CAMERA MODULES AND CAMERA MODULE MADE THEREBY

Semiconductor device and method of forming conductive vias with trench in saw street

Method for assembling stackable semiconductor packages

Three-dimensional force input control device and fabrication

Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays

Lead frame, light emitting diode having the lead frame, and backlight unit having the light emitting diode

Semiconductor device

Semiconductor device and method of forming vertical interconnect structure between non-linear portions of conductive layers

Mounting substrate and electronic apparatus

Semiconductor package having substrate with solder ball connections and method of fabricating the same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device having a sealing resin and method of manufacturing the same

Chip packaging method and structure thereof

Electronic device package and method of manufacture

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Substrate having single patterned metal layer exposing patterned dielectric layer, chip package structure including the substrate, and manufacturing methods thereof

Integrated circuit package having a castellated heatspreader

Integrated circuit package stacking system with redistribution and method of manufacture thereof

SEMICONDUCTOR PACKAGE, STACK MODULE, CARD, AND ELECTRONIC SYSTEM

Package-on-package technology for fan-out wafer-level packaging

Integrated circuit packaging system with a stack package and method of manufacture thereof

Integrated circuit packaging system with package-on-package and method of manufacture thereof

Enhanced integrated circuit package

Integrated circuit packaging system with high lead count and method of manufacture thereof

Stacked hybrid interposer through silicon via (TSV) package

Stacked chip package structure with leadframe having inner leads with transfer pad

IC PACKAGE HAVING AN INDUCTOR ETCHED INTO A LEADFRAME THEREOF

Wireless IC device

Annealing device

AU ALLOY WIRE FOR BALL BONDING

Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device

Method and apparatus for no lead semiconductor package

Semiconductor device and method of forming through hole vias in die extension region around periphery of die

Semiconductor device

Manufacturing method of a lead frame

INTERPOSER SUBSTRATE, LSI CHIP AND INFORMATION TERMINAL DEVICE USING THE INTERPOSER SUBSTRATE, MANUFACTURING METHOD OF INTERPOSER SUBSTRATE, AND MANUFACTURING METHOD OF LSI CHIP

Electronic element packaging module

High Frequency Wiring Board, Package for Housing Electronic Component, Electronic Device, and Communication Apparatus

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD

Semiconductor device and method of forming through hole vias in die extension region around periphery of die

MULTI-CHIP SEMICONDUCTOR PACKAGE

Semiconductor device and method of forming through hole vias in die extension region around periphery of die

Semiconductor apparatus and manufacturing method of the same

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method of Manufacturing the Same

Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support

LED with remote phosphor layer and reflective submount

Packaging for micro electro-mechanical systems and methods of fabricating thereof

Package structure of compound semiconductor device and fabricating method thereof

Method for connecting a die attach pad to a lead frame and product thereof

Method of manufacturing layered chip package

METHOD OF MANUFACTURING DICING DIE-BONDING FILM

Optical module and method for manufacturing same

Method of manufacturing electronic device and electronic device

Ceramic substrate part and electronic part comprising it

Power semiconductor module featuring resiliently supported substrates and method for fabricating a power semiconductor module

Phosphor activated with europium, light emitting device using the same and method of manufacturing the phosphor

Joint structure and electronic component

Semiconductor device package structure and method for the same

Electronic component and method of connecting with multi-profile bumps

Integrated circuit packaging system with interposer interconnections and method of manufacture thereof

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

WIREBOND STRUCTURES

Semiconductor device

Lead frame, lead frame fabrication, and semiconductor device

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE

Semiconductor device and method of forming IPD structure using smooth conductive layer and bottom-side conductive layer

Method for manufacturing group III nitride semiconductor, method for manufacturing group III nitride semiconductor light-emitting device, group III nitride semiconductor light-emitting device, and lamp

LED package structure with fuse

Lighting devices with discrete lumiphor-bearing regions within or on a surface of remote elements

Light Emitting Diode Package Structure

Light emitting element

Detecting a Fault State of a Semiconductor Arrangement

Composite multi-layer substrate and module using the substrate

Method of manufacturing electronic component device

Semiconductor package with position member

Semiconductor device and method of manufacturing the same

Power semiconductor device and method for its production

Liquid crystal display device and color filter for liquid crystal display device

Illuminating device

Wiring board, semiconductor device, and method for manufacturing wiring board and semiconductor device

Semiconductor device and method for fabricating the same

Semiconductor chip package with post electrodes

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, CIRCUIT SUBSTRATE, ELECTRO-OPTICAL APPARATUS, AND ELECTRONIC EQUIPMENT

POWER SEMICONDUCTOR MODULE

Power electronic device

Semiconductor substrate and method of connecting semiconductor die to substrate

SEMICONDUCTOR PACKAGE USING CONDUCTIVE PLUG TO REPLACE SOLDER BALL

Semiconductor package

Stress-engineered interconnect packages with activator-assisted molds

Airgap micro-spring interconnect with bonded underfill seal

Method for semiconductor leadframes in low volume and rapid turnaround

QUAD FLAT PACKAGE STRUCTURE HAVING EXPOSED HEAT SINK, ELECTRONIC ASSEMBLY AND MANUFACTURING METHODS THEREOF

Method for fabrication of a semiconductor device and structure

Compound semiconductor light-emitting element and method of manufacturing the same, conductive translucent electrode for compound semiconductor light-emitting element, lamp, electronic device, and mechanical apparatus

Manufacture of light emitting devices with phosphor wavelength conversion

Manufacture of light emitting devices with phosphor wavelength conversion

Manufacture of light emitting devices with phosphor wavelength conversion

Semiconductor device having surface protective films on bond pad

Semiconductor device

BONDING MATERIAL, ELECTRONIC COMPONENT AND BONDED STRUCTURE

Bonding wire for semiconductor devices

Method for fabrication of a semiconductor device and structure

Semiconductor device with an improved solder joint

Semiconductor package with improved size, reliability, warpage prevention, and heat dissipation and method for manufacturing the same

Manufacturing method for electronic devices

Heat sink and assembly or module unit

Semiconductor package, lead frame, and wiring board with the same

System-in packages

Elastic wave device and method for manufacturing the same

Light-emitting device and manufacturing method thereof

Oxynitride phosphor and production process thereof, and light-emitting device using oxynitride phosphor

Oxynitride phosphor and production process thereof, and light-emitting device using oxynitride phosphor

Lens support and wirebond protector

Circuit board having bypass pad

Semiconductor power module

Semiconductor die having a redistribution layer

Semiconductor device

Stackable Package Having Embedded Interposer and Method for Making the Same

SUBSTRATE HAVING EMBEDDED SINGLE PATTERNED METAL LAYER, AND PACKAGE APPLIED WITH THE SAME, AND METHODS OF MANUFACTURING OF THE SUBSTRATE AND PACKAGE

Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure

Integrated circuit packaging system with leads and transposer and method of manufacture thereof

Semiconductor device

Semiconductor device and method of forming a 3D inductor from prefabricated pillar frame

Semiconductor chip assembly with post/base heat spreader and adhesive between base and terminal

Oxynitride phosphor and production process thereof, and light-emitting device using oxynitride phosphor

ELEMENT MOUNTING SUBSTRATE AND METHOD OF FABRICATING THE SAME, CIRCUIT DEVICE AND METHOD OF FABRICATING THE SAME, AND MOBILE APPLIANCE ( as amended

Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package

Wireless communication system

Method for fabricating QFN semiconductor package

Die down ball grid array packages and method for making same

Fabrication method of semiconductor device

Power semiconductor module including substrates spaced from each other

Filter and communications apparatus

PHOSPHOR, LIGHT EMITTING DEVICE USING PHOSPHOR, AND DISPLAY AND LIGHTING SYSTEM USING LIGHT EMITTING DEVICE

Phosphor and light emitting device

Techniques for packaging multiple device components

In-situ cavity integrated circuit package

Die Exposed Chip Package

Mold lock on heat spreader

SEMICONDUCTOR CHIP PACKAGE

Package on package having a conductive post with height lower than an upper surface of an encapsulation layer to prevent circuit pattern lift defect and method of fabricating the same

Semiconductor Device Package Having Chip With Conductive Layer

QFN semiconductor package

QFN semiconductor package

LEAD FRAME FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Photo detector

Massively parallel interconnect fabric for complex semiconductor devices

Molded housing used in force fit method

Pressure sensor package

DIE ATTACH FILM-PROVIDED DICING TAPE AND PRODUCTION PROCESS OF SEMICONDUCTOR DEVICE

Methodology for processing a panel during semiconductor device fabrication

Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components

Fabrication method of semiconductor integrated circuit device

IC card with terminals for direct access to internal components

Method for manufacturing a rigid power module suited for high-voltage applications

Insulating sheet and method for producing it, and power module comprising the insulating sheet

Antenna sheet, transponder, and booklet

LIGHTING DEVICE

Electronic component for surface mounting

Plastic package and method of fabricating the same

Semiconductor device

Semiconductor device

HIGH PIN DENSITY SEMICONDUCTOR SYSTEM-IN-A-PACKAGE

Semiconductor device and method of forming shielding layer after encapsulation and grounded through interconnect structure

Semiconductor device including a magnetic sensor chip

Light emitting apparatus and method for the same

Semiconductor light emitting device substrate strips and packaged semiconductor light emitting devices

Method for producing a plurality of optoelectronic devices, and optoelectronic device

SOLID STATE LIGHTING DEVICE WITH AN INTEGRATED FAN

Thermally enhanced wafer level package

Compact co-packaged semiconductor dies with elevation-adaptive interconnection plates

Sensor module

SEMICONDUCTOR DEVICE

Light emitting device

Semiconductor packages and electronic systems including the same

Multi-chip stacked package

Integrated circuit package system with offset stacking and anti-flash structure

Semiconductor device and method of manufacturing semiconductor device

Leadframe

Power lead-on-chip ball grid array package

Semiconductor device having electrical devices mounted to IPD structure and method of shielding electromagnetic interference

Semiconductor device and method for manufacturing metallic shielding plate

Semiconductor device, method of manufacturing the same, and silane coupling agent

Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices

Semiconductor device including an inductor that is inductively coupled to another inductor

Optical semiconductor package sealing resin material

Slim LED package

Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same

Optical coupler having first and second terminal boards and first and second conversion elements

Method for Mounting Flip Chip and Substrate Used Therein

SIM ADAPTER AND SIM CARD

Integrated circuit module and method of packaging same

Method of fabricating stacked semiconductor structure

Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device

Adhesive sheet for semiconductor, and dicing tape integrated adhesive sheet for semiconductor

Multi-chip packages providing reduced signal skew and related methods of operation

ENHANCING ADHESION OF MOLDING MATERIALS WITH SUBSTRATES

Device for emitting various colors

Device for emitting white-color light

Packaged electronic device having metal comprising self-healing die attach material

Semiconductor device and manufacturing method thereof

IC package reducing wiring layers on substrate and its carrier

INTEGRATED CIRCUIT PACKAGE ASSEMBLY AND SUBSTRATE PROCESSING METHOD

Chip package structure and manufacturing method thereof for effectively lowering manufacturing costs and improving yield and reliability of the chip package structure

Semiconductor chip package

Electronic device package

Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby

Stacked chip package structure with leadframe having bus bar

Integrated circuit package system with integral inner lead and paddle and method of manufacture thereof

Quad flat pack in quad flat pack integrated circuit package system and method for manufacturing thereof

Stacked chip package structure with leadframe having bus bar

Integrated circuit package system with leaded package and method for manufacturing thereof

Semiconductor device and method of forming high-frequency circuit structure and method thereof

Light emitting apparatus

Light emitting element and fabricating method thereof

Light emitting device with high color rendering index and high luminescence efficiency

Semiconductor integrated circuit device and method of manufacturing same

Manufacturing method of semiconductor device with surface mounting terminals

Wafer level packaging method

THERMOSETTING DIE BONDING FILM

Semiconductor package and method of packaging semiconductor devices

Manufacturing method of semiconductor integrated circuit device

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Light fixture using near UV solid state device and remote semiconductor nanophosphors to produce white light

Widebody coil isolators

Exposed die pad package with power ring

Semiconductor device capable of switching operation modes

SEMICONDUCTOR DEVICE

Microelectronic packages and methods therefor

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device, manufacturing method thereof, and electronic device

Semiconductor device and method for manufacturing the same

Stacked chips package having feed-through electrode connecting the first and second semiconductor components via an adhesive layer

Stacked microfeature devices

Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer

Semiconductor package and manufacturing method thereof

Semiconductor device, method of forming the same, and electronic device

Supporting substrate before cutting, semiconductor device, and method of forming semiconductor device

Semiconductor device and method of forming the same

Stacked semiconductor package and method of manufacturing thereof

Staircase shaped stacked semiconductor package

Integrated circuit packaging system with stacked integrated circuit and heat spreader with openings and method of manufacture thereof