H01L2924/20101 - CPC Classification Index

ClassID:

212754 ⎘

H01L2924/20101 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Parameters; Temperature ranges Temperature range T<0 C, T<273.15 K

Recent Application in this class:

20230371167

2023-11-16

SUBSTRATE FOR AN ELECTRONIC CHIP

20180286826

2018-10-04

Methods of interconnect for high density 2.5D and 3D integration

20180122760

2018-05-03

Semiconductor device and method for manufacturing the same

20150303173

2015-10-22

Integrated electronic device including an interposer structure and a method for fabricating the same

20150214204

2015-07-30

Electronic Device and Method for Fabricating an Electronic Device

20150123263

2015-05-07

TWO-STEP METHOD FOR JOINING A SEMICONDUCTOR TO A SUBSTRATE WITH CONNECTING MATERIAL BASED ON SILVER

20150118841

2015-04-30

Semiconductor device and method for manufacturing the same

20150061123

2015-03-05

Semiconductor device and method for forming openings and trenches in insulating layer by first LDA and second LDA for RDL formation

20130249080

2013-09-26

Semiconductor device and method for forming openings and trenches in insulating layer by first LDA and second LDA for RDL formation

#10

20130160902

2013-06-27

MANUFACTURING METHOD FOR COMPOSITE ALLOY BONDING WIRE

#11

20110156248

2011-06-30

Semiconductor device and method for manufacturing the same

#12

14532761

2016-05-10

Method of integration of wafer level heat spreaders and backside interconnects on microelectronics wafers