Patents-Review.com
ClassID:

212755 ⎘

H01L2924/20102 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Parameters; Temperature ranges Temperature range 0 C=

Recent Application in this class:
#1
20250259951
2025-08-14

INTEGRATED CIRCUIT DIE BONDING PADS

 #2
20250140739
2025-05-01

LASER ENHANCED WIRE BONDING FOR SEMICONDUCTOR DEVICE PACKAGES

 #3
20240413117
2024-12-12

LOW PRESSURE SINTERING POWDER

 #4
20240404989
2024-12-05

PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARATUS FOR EFFECTING THE SAME

 #5
20240404988
2024-12-05

FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS FOR EFFECTING THE SAME

 #6
20240332116
2024-10-03

SEMICONDUCTOR DEVICE THERMAL INTERFACE AND METHOD

 #7
20240170366
2024-05-23

SEMICONDUCTOR PACKAGE WITH A HEAT DISSIPATION MEMBER

 #8
20230307392
2023-09-28

Die bonding pads and methods of forming the same

 #9
20230005848
2023-01-05

Redistribution layer and integrated circuit including redistribution layer

 #10
20210320006
2021-10-14

METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT, AND WORKPIECE

 #11
20210249376
2021-08-12

Low pressure sintering powder

 #12
20200277515
2020-09-03

Film-shaped firing material and film-shaped firing material with support sheet

 #13
20200161272
2020-05-21

Lead-free solder joining of electronic structures

 #14
20200051935
2020-02-13

Method of manufacturing a redistribution layer, redistribution layer and integrated circuit including the redistribution layer

 #15
20200006621
2020-01-02

Superconducting bump bonds

 #16
20200006620
2020-01-02

Superconducting bump bonds

 #17
20190006313
2019-01-03

METHOD FOR PERMANENT BONDING OF WAFERS

 #18
20190006312
2019-01-03

Lead-free solder joining of electronic structures

 #19
20180366634
2018-12-20

Superconducting bump bonds

 #20
20180286826
2018-10-04

Methods of interconnect for high density 2.5D and 3D integration

 #21
20180190565
2018-07-05

Thermal interface material on package

 #22
20180182733
2018-06-28

Systems and methods for bonding semiconductor elements

 #23
20180122760
2018-05-03

Semiconductor device and method for manufacturing the same

 #24
20180047655
2018-02-15

Thermal interface material on package

 #25
20180026006
2018-01-25

Systems and methods for bonding semiconductor elements

 #26
20180005975
2018-01-04

Enhanced cleaning for water-soluble flux soldering

 #27
20170248590
2017-08-31

Sensor and manufacturing method thereof

 #28
20170243852
2017-08-24

Enhanced cleaning for water-soluble flux soldering

 #29
20170236800
2017-08-17

Method for direct adhesion via low-roughness metal layers

 #30
20170233610
2017-08-17

Adhesive film for semiconductor

 #31
20170198182
2017-07-13

Adhesive composition for semiconductor, adhesive film for semiconductor, and dicing die bonding film

 #32
20170179072
2017-06-22

Systems and methods for bonding semiconductor elements

 #33
20170125366
2017-05-04

Electronic device, electronic part, and solder

 #34
20170120396
2017-05-04

SOLDER PASTE AND SOLDERING FLUX, AND MOUNTED STRUCTURE USING SAME

 #35
20170033073
2017-02-02

Low pressure sintering powder

 #36
20160260657
2016-09-08

Method of manufacturing semiconductor package and semiconductor package

 #37
20160254252
2016-09-01

Systems and methods for bonding semiconductor elements

 #38
20160204001
2016-07-14

Metal etchant compositions and methods of fabricating a semiconductor device using the same

 #39
20160172327
2016-06-16

Low-Temperature Bonding and Sealing With Spaced Nanorods

 #40
20160111394
2016-04-21

Method for permanent bonding of wafers

 #41
20160043016
2016-02-11

Thermal interface material on package

 #42
20160043015
2016-02-11

Thermal interface material on package

 #43
20160042977
2016-02-11

Thermal interface material on package

 #44
20160042976
2016-02-11

Thermal interface material on package

 #45
20150380370
2015-12-31

Method for etching semiconductor structures and etching composition for use in such a method

 #46
20150348859
2015-12-03

Underfill material and method for manufacturing semiconductor device using the same

 #47
20150348858
2015-12-03

Underfill material and method for manufacturing semiconductor device using the same

 #48
20150303173
2015-10-22

Integrated electronic device including an interposer structure and a method for fabricating the same

 #49
20150303166
2015-10-22

Wire bonding apparatus

 #50
20150243624
2015-08-27

Microelectronic packages with nanoparticle joining

 #51
20150228595
2015-08-13

Methods for etching copper during the fabrication of integrated circuits

 #52
20150221605
2015-08-06

Etching of under bump mettallization layer and resulting device

 #53
20150214204
2015-07-30

Electronic Device and Method for Fabricating an Electronic Device

 #54
20150206851
2015-07-23

Thermal interface material on package

 #55
20150200189
2015-07-16

Integrated circuit module having a first die with a power amplifier stacked with a second die and method of making the same

 #56
20150179604
2015-06-25

Method for bonding substrates

 #57
20150123263
2015-05-07

TWO-STEP METHOD FOR JOINING A SEMICONDUCTOR TO A SUBSTRATE WITH CONNECTING MATERIAL BASED ON SILVER

 #58
20150118841
2015-04-30

Semiconductor device and method for manufacturing the same

 #59
20140363966
2014-12-11

Pillar bumps and process for making same

 #60
20140342546
2014-11-20

Copper pillar bump with cobalt-containing sidewall protection layer

 #61
20130193455
2013-08-01

Light emitter packages and devices having improved wire bonding and related methods

 #62
20130160902
2013-06-27

MANUFACTURING METHOD FOR COMPOSITE ALLOY BONDING WIRE

 #63
20120091577
2012-04-19

Copper pillar bump with cobalt-containing sidewall protection

 #64
20120049346
2012-03-01

Pillar bumps and process for making same

 #65
20120025365
2012-02-02

Microelectronic packages with nanoparticle joining

 #66
20110156248
2011-06-30

Semiconductor device and method for manufacturing the same

 #67
20090178830
2009-07-16

Printed circuit board and component package having the same

 #68
20080213943
2008-09-04

Thermosetting die bonding film

 #69
20080073786
2008-03-27

Semiconductor device and method of manufacturing the same

 #70
20050082679
2005-04-21

Semiconductor component and production method suitable therefor

 #71
14532761
2016-05-10

Method of integration of wafer level heat spreaders and backside interconnects on microelectronics wafers