H01L2924/2021 - CPC Classification Index

ClassID:

212768 ⎘

H01L2924/2021 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Parameters; Electromagnetic wavelength ranges [W] Ultraviolet radiation

Sub-classes:

H01L2924/20211 » UV-C 100= 2

H01L2924/20212 » UV-B 280= 2

H01L2924/20213 » UV-A 315= 3

Recent Application in this class:

20250140739

2025-05-01

LASER ENHANCED WIRE BONDING FOR SEMICONDUCTOR DEVICE PACKAGES

20240021563

2024-01-18

METHOD OF MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE

20180228022

2018-08-09

Implementing reworkable strain relief packaging structure for electronic component interconnects

20180168030

2018-06-14

Implementing reworkable strain relief packaging structure for electronic component interconnects

20170077056

2017-03-16

ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME

20170077055

2017-03-16

Anisotropic conductive film including oblique region having lower curing ratio

20140342504

2014-11-20

Method of manufacturing an electronic device, and electronic device manufacturing apparatus